JPS6227748B2 - - Google Patents

Info

Publication number
JPS6227748B2
JPS6227748B2 JP59151232A JP15123284A JPS6227748B2 JP S6227748 B2 JPS6227748 B2 JP S6227748B2 JP 59151232 A JP59151232 A JP 59151232A JP 15123284 A JP15123284 A JP 15123284A JP S6227748 B2 JPS6227748 B2 JP S6227748B2
Authority
JP
Japan
Prior art keywords
electronic component
circuit board
chip
mercury
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59151232A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6046055A (ja
Inventor
Sumio Eguchi
Takashi Kotake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59151232A priority Critical patent/JPS6046055A/ja
Publication of JPS6046055A publication Critical patent/JPS6046055A/ja
Publication of JPS6227748B2 publication Critical patent/JPS6227748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59151232A 1984-07-23 1984-07-23 電子部品の冷却装置 Granted JPS6046055A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59151232A JPS6046055A (ja) 1984-07-23 1984-07-23 電子部品の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59151232A JPS6046055A (ja) 1984-07-23 1984-07-23 電子部品の冷却装置

Publications (2)

Publication Number Publication Date
JPS6046055A JPS6046055A (ja) 1985-03-12
JPS6227748B2 true JPS6227748B2 (OSRAM) 1987-06-16

Family

ID=15514130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59151232A Granted JPS6046055A (ja) 1984-07-23 1984-07-23 電子部品の冷却装置

Country Status (1)

Country Link
JP (1) JPS6046055A (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180436B1 (en) * 1998-05-04 2001-01-30 Delco Electronics Corporation Method for removing heat from a flip chip semiconductor device
JP3653417B2 (ja) * 1999-06-09 2005-05-25 株式会社日立製作所 マルチチップモジュールの封止構造
US8232091B2 (en) * 2006-05-17 2012-07-31 California Institute Of Technology Thermal cycling system

Also Published As

Publication number Publication date
JPS6046055A (ja) 1985-03-12

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