JPS6227748B2 - - Google Patents
Info
- Publication number
- JPS6227748B2 JPS6227748B2 JP15123284A JP15123284A JPS6227748B2 JP S6227748 B2 JPS6227748 B2 JP S6227748B2 JP 15123284 A JP15123284 A JP 15123284A JP 15123284 A JP15123284 A JP 15123284A JP S6227748 B2 JPS6227748 B2 JP S6227748B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit board
- chip
- mercury
- cooling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 12
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 12
- 229910052753 mercury Inorganic materials 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
この発明は、電子機器において、回路基板に配
置された半導体チツプの熱を冷却媒体を介するこ
とで効率よく放熱部に熱を伝える冷却装置に関す
るものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a cooling device for efficiently transmitting heat from a semiconductor chip disposed on a circuit board to a heat dissipation part through a cooling medium in electronic equipment. It is.
第１図は従来技術による半導体チツプの冷却装
置を示す図でありその断面図を示す。図中、回路
基板１に配置される半導体チツプ３から発生した
熱は、金属製のピストン５に伝わり、次に放熱器
７に伝わり、更にジヤケツト８に伝わつて、その
ジヤケツト８の内部を循環する冷媒により外部に
吐き出される。しかし第１図の冷却装置では回路
基板１とチツプ３の総てを平行に取り付けること
は不可能であり、そのためにチツプ３とピストン
５は密着出来ずその分だけ熱抵抗が増えてしま
う。またピストン５と放熱器７の間もピストン５
がある程度スムーズに上下出来るように間隙が必
要で、ここでも熱抵抗を増やすことになる。更に
重大な問題として回路基板１とチツプ３の電気的
接続の信頼性を保つには、ハンダボール４に規定
以上の力をかけらず、スプリング６の強度を余程
うまく選定しないと信頼性を保つことが出来な
い。
FIG. 1 is a diagram showing a conventional semiconductor chip cooling device, and shows a sectional view thereof. In the figure, heat generated from a semiconductor chip 3 placed on a circuit board 1 is transmitted to a metal piston 5, then to a radiator 7, and then to a jacket 8, where it circulates inside the jacket 8. Discharged outside by refrigerant. However, in the cooling device shown in FIG. 1, it is impossible to mount the circuit board 1 and the chips 3 in parallel, and therefore the chips 3 and the piston 5 cannot be brought into close contact with each other, resulting in an increase in thermal resistance. Also, between the piston 5 and the radiator 7, the piston 5
A gap is required so that the can move up and down somewhat smoothly, which also increases thermal resistance. A more serious problem is that in order to maintain the reliability of the electrical connection between the circuit board 1 and the chip 3, it is necessary not to apply more than a specified force to the solder ball 4 and to select the strength of the spring 6 very carefully. I can't do that.
この発明の目的とするところは上記の如き従来
技術の問題点を除去するものであり、ハンダボー
ルに規定以上の力をかけず電気的接続の信頼性を
保ち、チツプから発生する熱を効果的に吐き出す
ことが出来る電子回路部品例えば半導体チツプの
冷却装置を提供することにある。
The purpose of this invention is to eliminate the problems of the prior art as described above, and to maintain the reliability of electrical connection without applying more force than specified to the solder ball, and to effectively reduce the heat generated from the chip. The object of the present invention is to provide a cooling device for electronic circuit components such as semiconductor chips, which can be discharged to a high temperature.
この発明の特徴とするところは、回路基板の裏
面に配置されるチツプと放熱部間に、そのチツプ
表面に密着する柔軟な冷却媒体（例えば水銀。以
下水銀と呼ぶ）を充填するものであり、そのため
回路基板にチツプが平行に取り付けられなくても
水銀とチツプ表面が密着し、柔軟な冷却媒体のた
めハンダボールに規定以上の力をかけることもな
く回路基板とチツプの電気的接続の信頼性を保つ
ことが出来る。又冷却媒体のチツプ発熱による熱
膨張は空気溜めを設けることで吸収出来、空気溜
めを上部にすることで回路基板を垂直に実装する
ことも出来る。
The feature of this invention is that a flexible cooling medium (for example, mercury, hereinafter referred to as mercury) that adheres closely to the surface of the chip is filled between the chip and the heat dissipation section arranged on the back side of the circuit board. Therefore, even if the chip is not mounted parallel to the circuit board, the mercury and the chip surface are in close contact with each other, and because the cooling medium is flexible, there is no need to apply excessive force to the solder balls, ensuring reliable electrical connection between the circuit board and the chip. can be maintained. Also, thermal expansion due to chip heat generation of the cooling medium can be absorbed by providing an air reservoir, and by placing the air reservoir at the top, the circuit board can be mounted vertically.
次に本発明の実施例につき図面を用いて詳細に
説明する。
Next, embodiments of the present invention will be described in detail using the drawings.
第２図は本発明による冷却装置の一実施例を示
す図でありその断面を示す。図中、回路基板１の
裏面にチツプ３が配置され、そのチツプ３が配置
される側に放熱器７０を取り付け、回路基板１は
放熱器７０に蓋９０にて固定される。蓋９０の注
入口１３より放熱器７０とチツプ３間に水銀１１
を充填する。水銀１１と回路基板１、ハンダボー
ル４が接触しないように絶縁性パツキン１４を取
り付け、更に放熱器７０と蓋９０間にパツキン１
５を取り付ける。ジヤケツト８は放熱器７０にネ
ジ等により密着固定されている。 FIG. 2 is a diagram showing an embodiment of the cooling device according to the present invention, and shows a cross section thereof. In the figure, a chip 3 is placed on the back side of a circuit board 1, a heat sink 70 is attached to the side on which the chip 3 is placed, and the circuit board 1 is fixed to the heat sink 70 with a lid 90. Mercury 11 is inserted between the radiator 70 and the chip 3 from the inlet 13 of the lid 90.
Fill it with. An insulating gasket 14 is attached to prevent contact between the mercury 11, the circuit board 1, and the solder ball 4, and a gasket 14 is installed between the radiator 70 and the lid 90.
Attach 5. The jacket 8 is closely fixed to the heat sink 70 with screws or the like.
この様に構成された冷却装置において、チツプ
から出た熱は水銀１１に伝わり、次に放熱器７０
に伝わり、更にジヤケツト８（水冷却部）に伝わ
つて、そのジヤケツト８の内部を循環する冷媒
（例えば水）により外部に吐き出される。又チツ
プ３の発熱により水銀１１は熱膨張するが空気溜
め１２を設けてその膨張収縮を吸収する。 In the cooling device configured in this way, the heat emitted from the chip is transferred to the mercury 11, and then the heat radiator 70
It is further transmitted to the jacket 8 (water cooling section), and is discharged to the outside by the refrigerant (for example, water) circulating inside the jacket 8. Furthermore, the mercury 11 thermally expands due to the heat generated by the chip 3, but an air reservoir 12 is provided to absorb the expansion and contraction.
〔発明の効果〕
以上述べた如き構成であるから本発明にあつて
は次の如き効果を得ることができる。[Effects of the Invention] With the configuration as described above, the following effects can be obtained with the present invention.
チツプ表面に水銀が密着するため熱抵抗を極
めて少なくすることが出来、更に水銀と放熱器
も密着するため放熱効果を著しくよくすること
が出来る。 Since the mercury is in close contact with the chip surface, thermal resistance can be extremely reduced, and since the mercury and the heat sink are also in close contact, the heat radiation effect can be significantly improved.
次にチツプと放熱器間に、水銀を充填するた
めハンダボールに規定以上の力をかけることも
なく回路基板とチツプの電気的接続の信頼性を
保つことが出来る。 Next, since mercury is filled between the chip and the heat sink, the reliability of the electrical connection between the circuit board and the chip can be maintained without applying more force than specified to the solder ball.
更に空気溜めを設けることで水銀の温度変化
による膨張収縮を吸収することが出来る。 Furthermore, by providing an air reservoir, expansion and contraction of mercury due to temperature changes can be absorbed.
第１図は従来の電子回路部品の冷却装置を示す
断面図、第２図は本発明の電子回路部品の冷却装
置を示す断面図。
符号の説明、１……回路基板、２……ピン、３
……半導体チツプ、４……ハンダボール、５……
ピストン、６……スプリング、７０……放熱器、
８……ジヤケツト、９０……蓋、１０……ネジ、
１１……冷却媒体、１２……空気溜メ、１３……
注入口、１４……パツキン、１５……パツキン、
１６……ネジ。
FIG. 1 is a sectional view showing a conventional cooling device for electronic circuit components, and FIG. 2 is a sectional view showing a cooling device for electronic circuit components according to the present invention. Explanation of symbols, 1...Circuit board, 2...Pin, 3
...Semiconductor chip, 4...Solder ball, 5...
Piston, 6...spring, 70...radiator,
8...jacket, 90...lid, 10...screw,
11...Cooling medium, 12...Air reservoir, 13...
Inlet, 14...Patsukin, 15...Patsukin,
16...screw.
Claims (1)
により発熱する電子部の冷却を行なう電子部品の
冷却装置であつて、該電子部品が搭載されたプリ
ント基板の露出した電気回路を被い、該電子部品
の頭部のみを露出するパツキンと、前記プリント
基板を搭載し、該電子部品の頭部と接触する冷却
媒体としての水銀を密閉的に収納する放熱器と、
該放熱器を介する該電子部品の発熱を外部へ放出
する水冷却部とを備えることを特徴とする電子部
品の冷却装置。1. A cooling device for electronic components that is mounted on a printed circuit board and cools an electronic component that generates heat by electrical drive, which covers the exposed electric circuit of the printed circuit board on which the electronic component is mounted, and cools the electronic component that generates heat by electrical drive. a gasket that exposes only the head of the electronic component; a radiator that mounts the printed circuit board and hermetically stores mercury as a cooling medium that contacts the head of the electronic component;
A cooling device for an electronic component, comprising: a water cooling section that releases heat generated by the electronic component to the outside via the radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15123284A JPS6046055A (en) | 1984-07-23 | 1984-07-23 | Cooler of electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15123284A JPS6046055A (en) | 1984-07-23 | 1984-07-23 | Cooler of electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6046055A JPS6046055A (en) | 1985-03-12 |
| JPS6227748B2 true JPS6227748B2 (en) | 1987-06-16 |
Family
ID=15514130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15123284A Granted JPS6046055A (en) | 1984-07-23 | 1984-07-23 | Cooler of electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6046055A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180436B1 (en) * | 1998-05-04 | 2001-01-30 | Delco Electronics Corporation | Method for removing heat from a flip chip semiconductor device |
| JP3653417B2 (en) * | 1999-06-09 | 2005-05-25 | 株式会社日立製作所 | Multi-chip module sealing structure |
| US8232091B2 (en) * | 2006-05-17 | 2012-07-31 | California Institute Of Technology | Thermal cycling system |
-
1984
- 1984-07-23 JP JP15123284A patent/JPS6046055A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6046055A (en) | 1985-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4145708A (en) | Power module with isolated substrates cooled by integral heat-energy-removal means | |
| US5339519A (en) | Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels | |
| US6365964B1 (en) | Heat-dissipating assembly for removing heat from a flip chip semiconductor device | |
| US5920458A (en) | Enhanced cooling of a heat dissipating circuit element | |
| US6570764B2 (en) | Low thermal resistance interface for attachment of thermal materials to a processor die | |
| JP2002118384A (en) | Electronic equipment | |
| JPH10260230A (en) | Apparatus for cooling heat-generating body | |
| US5508885A (en) | IC card having improved heat dissipation | |
| JPH09213851A (en) | Heat radiation method and heat radiation means for ic device | |
| JPS6227748B2 (en) | ||
| JPH07109867B2 (en) | Cooling structure for semiconductor chips | |
| JPH1168360A (en) | Cooling structure for semiconductor element | |
| JP3193142B2 (en) | Board | |
| JPH077109A (en) | Package mounting structure | |
| JPS6142864B2 (en) | ||
| JPH0263146A (en) | Radiating structure of heat-generating component mounted on printed-circuit board | |
| JPS58218148A (en) | Cooling device for electronic part | |
| JPS6329999A (en) | Electronic device module cooling structure | |
| JP2006135202A (en) | Heat radiating structure for electronic appliance | |
| JPH05160306A (en) | Heat radiation structure | |
| JP3395409B2 (en) | Semiconductor module | |
| JP2000156584A (en) | Apparatus provided with heat dissipating structure | |
| JPH11145656A (en) | Method for heat radiation for circuit board and circuit board | |
| JP2830212B2 (en) | Hybrid integrated circuit | |
| JPS59155158A (en) | Cooling structure of semiconductor device |