JPS6226872B2 - - Google Patents
Info
- Publication number
- JPS6226872B2 JPS6226872B2 JP53120894A JP12089478A JPS6226872B2 JP S6226872 B2 JPS6226872 B2 JP S6226872B2 JP 53120894 A JP53120894 A JP 53120894A JP 12089478 A JP12089478 A JP 12089478A JP S6226872 B2 JPS6226872 B2 JP S6226872B2
- Authority
- JP
- Japan
- Prior art keywords
- data
- workpiece
- processing
- laser
- peripheral pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012545 processing Methods 0.000 claims description 52
- 230000002093 peripheral effect Effects 0.000 claims description 26
- 238000003754 machining Methods 0.000 claims description 21
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Lasers (AREA)
- Laser Beam Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12089478A JPS5548489A (en) | 1978-09-29 | 1978-09-29 | Full-automatic laser work system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12089478A JPS5548489A (en) | 1978-09-29 | 1978-09-29 | Full-automatic laser work system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5548489A JPS5548489A (en) | 1980-04-07 |
| JPS6226872B2 true JPS6226872B2 (zh) | 1987-06-11 |
Family
ID=14797614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12089478A Granted JPS5548489A (en) | 1978-09-29 | 1978-09-29 | Full-automatic laser work system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5548489A (zh) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4467172A (en) * | 1983-01-03 | 1984-08-21 | Jerry Ehrenwald | Method and apparatus for laser engraving diamonds with permanent identification markings |
| JPS62243549A (ja) * | 1986-04-17 | 1987-10-24 | 興和株式会社 | 治療用レ−ザ装置 |
| JPS6356383A (ja) * | 1986-08-27 | 1988-03-10 | Nec Corp | レーザ加工位置制御装置 |
| JP2965040B2 (ja) * | 1988-06-27 | 1999-10-18 | 株式会社日立製作所 | エネルギービームの加工方法およびその装置 |
| JPH07101667B2 (ja) * | 1990-07-16 | 1995-11-01 | 株式会社東芝 | プロキシミティ露光装置 |
| US5580471A (en) * | 1994-03-30 | 1996-12-03 | Panasonic Technologies, Inc. | Apparatus and method for material treatment and inspection using fiber-coupled laser diode |
| KR101026010B1 (ko) | 2008-08-13 | 2011-03-30 | 삼성전기주식회사 | 레이저 가공장치 및 레이저 가공방법 |
| JP7343324B2 (ja) * | 2019-07-26 | 2023-09-12 | ファナック株式会社 | レーザ発振器を制御する制御装置、及び制御方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5393497A (en) * | 1977-01-28 | 1978-08-16 | Hitachi Ltd | Laser processing device |
-
1978
- 1978-09-29 JP JP12089478A patent/JPS5548489A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5393497A (en) * | 1977-01-28 | 1978-08-16 | Hitachi Ltd | Laser processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5548489A (en) | 1980-04-07 |
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