JPS6226696B2 - - Google Patents

Info

Publication number
JPS6226696B2
JPS6226696B2 JP55123424A JP12342480A JPS6226696B2 JP S6226696 B2 JPS6226696 B2 JP S6226696B2 JP 55123424 A JP55123424 A JP 55123424A JP 12342480 A JP12342480 A JP 12342480A JP S6226696 B2 JPS6226696 B2 JP S6226696B2
Authority
JP
Japan
Prior art keywords
plating
metal
pattern
substrate
heat flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55123424A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5748625A (en
Inventor
Kazuo Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KENSETSUSHO KENCHIKU KENKYU SHOCHO
Original Assignee
KENSETSUSHO KENCHIKU KENKYU SHOCHO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KENSETSUSHO KENCHIKU KENKYU SHOCHO filed Critical KENSETSUSHO KENCHIKU KENKYU SHOCHO
Priority to JP55123424A priority Critical patent/JPS5748625A/ja
Publication of JPS5748625A publication Critical patent/JPS5748625A/ja
Publication of JPS6226696B2 publication Critical patent/JPS6226696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K17/00Measuring quantity of heat

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP55123424A 1980-09-08 1980-09-08 Detecting end for quantity of heat flow rate and its production Granted JPS5748625A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55123424A JPS5748625A (en) 1980-09-08 1980-09-08 Detecting end for quantity of heat flow rate and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55123424A JPS5748625A (en) 1980-09-08 1980-09-08 Detecting end for quantity of heat flow rate and its production

Publications (2)

Publication Number Publication Date
JPS5748625A JPS5748625A (en) 1982-03-20
JPS6226696B2 true JPS6226696B2 (enrdf_load_stackoverflow) 1987-06-10

Family

ID=14860208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55123424A Granted JPS5748625A (en) 1980-09-08 1980-09-08 Detecting end for quantity of heat flow rate and its production

Country Status (1)

Country Link
JP (1) JPS5748625A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0640031B2 (ja) * 1985-10-23 1994-05-25 英弘精機産業株式会社 熱流計センサ−及びその製法
JP5598035B2 (ja) * 2010-03-16 2014-10-01 富士通株式会社 熱電変換装置
JP5638871B2 (ja) * 2010-08-18 2014-12-10 江藤電気株式会社 熱流センサ
JP6799522B2 (ja) * 2017-11-30 2020-12-16 三菱重工業株式会社 熱流束計測システム

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2413646A1 (fr) * 1978-01-02 1979-07-27 Saint Gobain Fluxmetre thermique

Also Published As

Publication number Publication date
JPS5748625A (en) 1982-03-20

Similar Documents

Publication Publication Date Title
US4343960A (en) Thermopile and process for manufacturing same
US8266794B2 (en) Method of producing a wired circuit board
EP1968364B1 (en) Wired circuit board and producing method thereof
US3778530A (en) Flatpack lead positioning device
US7629540B2 (en) Wired circuit board and production method thereof
US20150264795A1 (en) Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit
US3400210A (en) Interlayer connection technique for multilayer printed wiring boards
JP2009135184A (ja) 配線基板及びその製造方法
JP5829100B2 (ja) 配線回路基板
US8647517B2 (en) Producing method of suspension board with circuit
JPS6226696B2 (enrdf_load_stackoverflow)
JP2020013827A (ja) コイル基板
CN101754575A (zh) 布线电路基板集合体片
JPS58147638A (ja) 金属格子構造の製造方法
US6248247B1 (en) Method of fortifying an air bridge circuit
EP1006765A2 (en) Method for strengthening air bridge circuits
JPH0410696A (ja) 多層配線基板の製造方法
US20240040705A1 (en) Wiring circuit board assembly sheet
JPH0227569Y2 (enrdf_load_stackoverflow)
JP2009295691A (ja) 配線回路基板の製造方法
JP5469729B2 (ja) 回路付サスペンション回路基板、その製造方法および回路付サスペンション基板の位置決め方法
US3859177A (en) Method of manufacturing multilayer circuits
JP4611075B2 (ja) 配線回路基板
JP2009152238A (ja) 配線回路基板の製造方法
WO2024225227A1 (ja) 配線回路基板集合体シートの製造方法、配線回路基板の製造方法、配線回路基板集合体シートおよび配線回路基板