JPS62252194A - 多層プリント配線板の製造方法 - Google Patents
多層プリント配線板の製造方法Info
- Publication number
- JPS62252194A JPS62252194A JP9645586A JP9645586A JPS62252194A JP S62252194 A JPS62252194 A JP S62252194A JP 9645586 A JP9645586 A JP 9645586A JP 9645586 A JP9645586 A JP 9645586A JP S62252194 A JPS62252194 A JP S62252194A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- lamination
- reference pin
- multilayer
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 238000003475 lamination Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 21
- 238000005553 drilling Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000008602 contraction Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9645586A JPS62252194A (ja) | 1986-04-24 | 1986-04-24 | 多層プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9645586A JPS62252194A (ja) | 1986-04-24 | 1986-04-24 | 多層プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62252194A true JPS62252194A (ja) | 1987-11-02 |
| JPH0451080B2 JPH0451080B2 (cg-RX-API-DMAC7.html) | 1992-08-18 |
Family
ID=14165499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9645586A Granted JPS62252194A (ja) | 1986-04-24 | 1986-04-24 | 多層プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62252194A (cg-RX-API-DMAC7.html) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5392471A (en) * | 1977-01-26 | 1978-08-14 | Tokyo Shibaura Electric Co | Method of perforating multilayer printed circuit board |
| JPS5678199A (en) * | 1979-11-30 | 1981-06-26 | Fujitsu Ltd | Method of laminating multilayer printed board |
-
1986
- 1986-04-24 JP JP9645586A patent/JPS62252194A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5392471A (en) * | 1977-01-26 | 1978-08-14 | Tokyo Shibaura Electric Co | Method of perforating multilayer printed circuit board |
| JPS5678199A (en) * | 1979-11-30 | 1981-06-26 | Fujitsu Ltd | Method of laminating multilayer printed board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451080B2 (cg-RX-API-DMAC7.html) | 1992-08-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |