JPS6224960B2 - - Google Patents
Info
- Publication number
- JPS6224960B2 JPS6224960B2 JP11481081A JP11481081A JPS6224960B2 JP S6224960 B2 JPS6224960 B2 JP S6224960B2 JP 11481081 A JP11481081 A JP 11481081A JP 11481081 A JP11481081 A JP 11481081A JP S6224960 B2 JPS6224960 B2 JP S6224960B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- cylindrical body
- solder
- leg
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明はプリント基板に半田付されたIC等の
部品を容易に取外すことができる安価な筒状体を
用いた取外し方法を提供することを目的とするも
のである。DETAILED DESCRIPTION OF THE INVENTION An object of the present invention is to provide a method for easily removing components such as ICs soldered to a printed circuit board using an inexpensive cylindrical body.
第１図は従来例における半田付部品取外し装置
を示すものであり、中空状の半田鏝１を加熱して
半田付部分に当てて半田を溶融し、次にポンプス
イツチ２を投入してポンプ３を押し、半田溜め４
の空気を抜いて溶融した半田鏝１の中空部を通つ
て半田溜め４に吸い込む。この結果、半田付され
ていた部品をプリント基板より取外すことができ
る。 FIG. 1 shows a conventional soldered parts removal device, in which a hollow soldering iron 1 is heated and applied to the soldered part to melt the solder, and then the pump switch 2 is turned on and the pump 3 is turned on. Press the solder reservoir 4
The air is removed and the melted solder is sucked into the solder reservoir 4 through the hollow part of the soldering iron 1. As a result, the soldered components can be removed from the printed circuit board.
この装置は、溶融した半田が半田鏝１の中空部
に存在する間に電源が切られて半田鏝１が冷える
と、溶融半田が半田鏝１の中に残り、孔づまりを
生じることがある上に、ポンプを必要とするので
装置が大型化する欠点がある。 In this device, if the power is turned off and the soldering iron 1 cools while molten solder exists in the hollow part of the soldering iron 1, the molten solder may remain in the soldering iron 1 and cause hole clogging. However, since a pump is required, the device has the disadvantage of becoming larger.
そこで、本発明はポンプを用いることがなく、
孔づまりを起すことがない安価な筒状体を用いた
半田付部品取外し方法を提供しようとするもので
あり、以下本発明の一実施例について図面を参照
して説明する。 Therefore, the present invention does not use a pump,
The object is to provide a method for removing soldered parts using an inexpensive cylindrical body that does not cause hole clogging, and one embodiment of the present invention will be described below with reference to the drawings.
第２図は本発明の半田付部品取外し方法におけ
る筒状体を示すものである。第２図に示すように
半田が付着せず、熱にも強いステンレス等の材料
であつて、中空のステンレスパイプで筒状体５を
形成する。筒状体５の形状について述べると、筒
状体５の先端の角部は傾斜面として孔に挿入しや
すくしてあり、その傾斜角αは約20゜になつてい
る。筒状体５の外径W1は第４図に示すように、
プリント基板７の抵抗部品１１ａの脚挿入孔１０
ａの内径ＷP1（例えば1.0mm）より少し小さい
0.95mmに設定し、筒状体５の内径W2は、上記抵
抗部品の脚の外径ＷR（例えば0.6mm）より大きい
0.65mmに設定する。尚、筒状体５の肉厚W3は0.15
mmに設定する。 FIG. 2 shows a cylindrical body in the soldered component removal method of the present invention. As shown in FIG. 2, the cylindrical body 5 is formed of a hollow stainless steel pipe made of a material such as stainless steel that does not adhere to solder and is resistant to heat. Regarding the shape of the cylindrical body 5, the tip corner of the cylindrical body 5 is an inclined surface to facilitate insertion into the hole, and the angle of inclination α is about 20°. The outer diameter W 1 of the cylindrical body 5 is as shown in FIG.
Leg insertion hole 10 of resistor component 11a of printed circuit board 7
Slightly smaller than the inner diameter of a W P1 (e.g. 1.0mm)
The inner diameter W 2 of the cylindrical body 5 is set to 0.95 mm, and the inner diameter W 2 of the cylindrical body 5 is larger than the outer diameter W R (for example, 0.6 mm) of the leg of the resistance component.
Set to 0.65mm. Furthermore, the wall thickness W3 of the cylindrical body 5 is 0.15.
Set to mm.
筒状体５の一端にはプラスチツク等で構成さ
れ、表面にローレツト加工を施した把手６が設け
られている。この把手６の外径W4は5.0mm、筒状
体５の先端から把手６までの距離W5は30mm、全
長W6は90mmに設定されている。 A handle 6 made of plastic or the like and having a knurled surface is provided at one end of the cylindrical body 5. The outer diameter W 4 of this handle 6 is set to 5.0 mm, the distance W 5 from the tip of the cylindrical body 5 to the handle 6 is set to 30 mm, and the total length W 6 is set to 90 mm.
尚、プリント基板７は紙フエノール基板を用
い、基板の厚みＷP2は1.6mmであり、抵抗部品１
１ａは、例えば炭素皮膜抵抗を用い、脚数は２本
である。 Note that the printed circuit board 7 is a paper phenol board, the thickness W P2 of the board is 1.6 mm, and the resistor component 1 is
1a uses, for example, a carbon film resistor, and has two legs.
第３図ａ，ｂ，ｃ，ｄは部品の取外しの状態を
示すものであり、プリント基板７の挿入孔１０に
部品１１の脚１２を挿入して半田８により半田付
けされている。 3a, b, c, and d show states in which the component is removed, and the leg 12 of the component 11 is inserted into the insertion hole 10 of the printed circuit board 7 and soldered with the solder 8.
以上の状態において、まず治具を使用する人が
この半田８に第３図ａに示すように半田鏝９を当
てて溶融し、この半田８の溶融状態を見ながら第
３図ｂに示すように治具を指で少し回転させつつ
筒状体５を挿入孔１０にプリント基板の導電箔側
から半田８を突き破つて挿入する。すると半田８
と脚１２とを分離することができる。この状態で
第３図ｃに示すように部品１１の脚１２を引き抜
く。このとき、脚１２に付着している半田は筒状
体５の内壁に付着しないので、容易に脚１２をと
ることができる。最後に筒状体５を引き抜けばよ
い。 In the above state, the person using the jig first melts the solder 8 by applying the soldering iron 9 as shown in FIG. While slightly rotating the jig with fingers, insert the cylindrical body 5 into the insertion hole 10 from the conductive foil side of the printed circuit board through the solder 8. Then solder 8
and the legs 12 can be separated. In this state, the legs 12 of the component 11 are pulled out as shown in FIG. 3c. At this time, since the solder attached to the legs 12 does not adhere to the inner wall of the cylindrical body 5, the legs 12 can be easily removed. Finally, the cylindrical body 5 can be pulled out.
尚、治具の挿入加減については、目的とする半
田と、部品の足との分離ができる位置であれば良
く、治具の先が基板の部品面側に出ていなくて
も、支障はない。 Regarding the insertion of the jig, it is fine as long as the desired solder can be separated from the legs of the component, and there is no problem even if the tip of the jig does not come out on the component side of the board. .
また、上記具体例以外の部品で、脚径が違う場
合は、プリント板の穴径と部品脚の径とのクリア
ランスに合う治具を使用する事により、同様に半
田と部品脚とが分離でき、かつ脚数の多い部品、
例えばFBT、チユーナ、IC、小型トランス程効
果が大きい。 In addition, if the leg diameter is different for parts other than the above specific example, by using a jig that matches the clearance between the hole diameter of the printed board and the diameter of the component leg, the solder and the component leg can be separated in the same way. , and parts with many legs,
For example, the effect is greater for FBT, tuner, IC, and smaller transformers.
第５図は、脚が多い半導体ICの場合を示すも
のである。第５図において、半導体IC１１ｂの
部品脚１１ｃの脚数は14本で、部品脚１１ｃのＷ
Cは0.5mm〜0.6mmである。また、プリント基板７
の基板穴径ＷP1は0.8mmに設定する。従つて、こ
の場合の取はずし治具も、上記プリント基板７の
穴径ＷP1と部品脚１１ｃの線径ＷCとのクリアラ
ンスに合うものを使用する。即ち、この場合の治
具の各寸法は、内径W1が0.51mm〜0.61mm、外径
W2が0.79mm、肉厚W3は0.14mm〜0.09mmの範囲内
に設定される。尚、他の寸法は、第４図に示すも
のと同一である。 FIG. 5 shows the case of a semiconductor IC with many legs. In FIG. 5, the number of component legs 11c of the semiconductor IC 11b is 14, and the W of the component legs 11c is 14.
C is 0.5mm to 0.6mm. In addition, the printed circuit board 7
The substrate hole diameter W P1 is set to 0.8 mm. Therefore, the removal jig used in this case is one that matches the clearance between the hole diameter W P1 of the printed circuit board 7 and the wire diameter W C of the component leg 11c. In other words, the dimensions of the jig in this case are the inner diameter W1 of 0.51 mm to 0.61 mm, and the outer diameter W1 of 0.51 mm to 0.61 mm.
W 2 is set to 0.79 mm, and wall thickness W 3 is set within the range of 0.14 mm to 0.09 mm. Note that the other dimensions are the same as those shown in FIG.
以上のように半導体IC等、脚が多い部品の場
合には筒状体５を次々と脚が取付けられているプ
リント基板の挿入孔に挿入して半田と脚とを分離
させ、最後にIC本体を持つて引き抜けばよい。
このように脚が多い部品に用いると特に便利であ
る。 As described above, in the case of a component with many legs, such as a semiconductor IC, the cylindrical body 5 is inserted into the insertion hole of the printed circuit board to which the legs are attached one after another, the solder and the legs are separated, and finally the IC body Just grab it and pull it out.
It is particularly convenient to use this for parts with many legs.
以上のように本発明によれば、従来のように大
型の部品取外し装置を用いることなく安価な筒状
体を用いて半田付部品を取外すことができるもの
であり、IC等脚の多いものに用いて特に有効な
ものである。 As described above, according to the present invention, it is possible to remove soldered parts using an inexpensive cylindrical body without using a large component removal device as in the past, and it is suitable for products with many legs such as ICs. It is particularly effective when used.
第１図は従来例における半田付部品取外し装置
の一部断側面図、第２図は本発明の半田付部品取
外し方法における筒状体の側断面図、第３図ａ，
ｂ，ｃ，ｄは同方法の実施過程を示す断正面図、
第４図は本発明の一実施例における抵抗部品の取
りはずす状態を示す要部断面図、第５図は同半導
体ICの取りはずし状態を示す要部断面図であ
る。
５……筒状体、６……把手、７……プリント基
板、８……半田、９……半田鏝、１０……挿入
孔、１１……部品、１１ａ……抵抗部品、１１ｂ
……半導体IC、１２……脚。
FIG. 1 is a partially sectional side view of a conventional soldered component removal device, FIG. 2 is a side sectional view of a cylindrical body in the soldered component removal method of the present invention, and FIGS.
b, c, d are cross-sectional front views showing the implementation process of the method,
FIG. 4 is a sectional view of a main part showing a state in which a resistor component is removed in an embodiment of the present invention, and FIG. 5 is a sectional view of a main part showing a state in which the same semiconductor IC is removed. 5... Cylindrical body, 6... Handle, 7... Printed circuit board, 8... Solder, 9... Soldering iron, 10... Insertion hole, 11... Component, 11a... Resistance component, 11b
...Semiconductor IC, 12...legs.
Claims (1)
さい外径を有し、上記部品挿入孔に挿入された部
品の脚の径より大きい内径を持つ筒状体を、半田
が付着せず熱にも強いステンレス等の材料によつ
て構成し、上記プリント基板の部品の脚取付部分
の半田に半田鏝を当てて溶融し、溶融した半田を
貫通して上記筒状体を上記プリント基板の導電箔
側より上記部品挿入孔に挿入し、この筒状体の中
に入つた部品の脚と半田とを分離し、部品の脚を
引き抜くことを特徴とする半田付部品取外し方
法。1. A cylindrical body having an outer diameter slightly smaller than the inner diameter of the component insertion hole of a printed circuit board and an inner diameter larger than the diameter of the leg of the component inserted into the component insertion hole is resistant to heat without adhering to solder. The cylindrical body is made of a material such as stainless steel, and is melted by applying a soldering iron to the solder on the leg attachment part of the component of the printed circuit board, and passing through the melted solder to insert the cylindrical body from the conductive foil side of the printed circuit board. A method for removing a soldered component, which comprises inserting the component into the component insertion hole, separating the solder from the leg of the component that has entered the cylindrical body, and pulling out the leg of the component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11481081A JPS5815295A (en) | 1981-07-21 | 1981-07-21 | Method of removing soldered part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11481081A JPS5815295A (en) | 1981-07-21 | 1981-07-21 | Method of removing soldered part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5815295A JPS5815295A (en) | 1983-01-28 |
| JPS6224960B2 true JPS6224960B2 (en) | 1987-05-30 |
Family
ID=14647245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11481081A Granted JPS5815295A (en) | 1981-07-21 | 1981-07-21 | Method of removing soldered part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5815295A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58128761U (en) * | 1982-02-22 | 1983-08-31 | 株式会社河合楽器製作所 | Soldering parts removal tool |
-
1981
- 1981-07-21 JP JP11481081A patent/JPS5815295A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5815295A (en) | 1983-01-28 |
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