JPH03229252A - Mask for printing - Google Patents
Mask for printingInfo
- Publication number
- JPH03229252A JPH03229252A JP2023714A JP2371490A JPH03229252A JP H03229252 A JPH03229252 A JP H03229252A JP 2023714 A JP2023714 A JP 2023714A JP 2371490 A JP2371490 A JP 2371490A JP H03229252 A JPH03229252 A JP H03229252A
- Authority
- JP
- Japan
- Prior art keywords
- printing
- holes
- printing mask
- coating material
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 239000000463 material Substances 0.000 abstract description 11
- 239000011248 coating agent Substances 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 10
- 238000004080 punching Methods 0.000 abstract 1
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、印刷回路板の印刷用マスクの改良に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to improvements in printing masks for printed circuit boards.
（従来の技術）
従来の第５．６図に示す印刷回路板の印刷用マスクｌの
多数の孔（スリット）２は表裏両面から同時にエツチン
グ加工によって作られている為、孔２の内面に第５図に
示す如く段部又は膨らみ若しくはくびれ２ａが生じてい
た。(Prior art) Since the many holes (slits) 2 of the conventional printing mask l of the printed circuit board shown in FIG. As shown in FIG. 5, a stepped portion, a bulge, or a constriction 2a was formed.
（発明が解決しようとする課題）
ところで、上記のように孔（スリット）２の内面に段部
又は膨らみ若しくはくびれ２ａが生じた印刷用マスクｌ
を用いて第７図に示す如く印刷回路板３へ半田などの塗
布材料４を印刷し、印刷用マスク上面の塗布材料をスキ
ージにて除いた後、第８図に示す如く印刷用マスクｌを
取り外した際、塗布材料４が孔（スリット）２の途中で
切れたり、印刷回路板３から剥がれたりするという問題
があった。(Problem to be Solved by the Invention) By the way, as described above, there is a printing mask l in which a step, a bulge, or a constriction 2a is formed on the inner surface of the hole (slit) 2.
After printing the coating material 4 such as solder on the printed circuit board 3 as shown in FIG. 7 using When removed, there was a problem that the coating material 4 was cut in the middle of the hole (slit) 2 or peeled off from the printed circuit board 3.
そこで本発明は、印刷回路板への塗布材料が孔（スリッ
ト）の途中から切れたりすることの無い印刷用マスクを
提供しようとするものである。SUMMARY OF THE INVENTION Therefore, the present invention aims to provide a printing mask in which the material applied to a printed circuit board does not break in the middle of the hole (slit).
（課題を解決するための手段）
上記課題を解決するための本発明の印刷用マスクは、印
刷用の多数の孔の内側面が塑性加工により滑らかなスト
レート面になされていることを特徴とするものである。(Means for Solving the Problems) A printing mask of the present invention for solving the above problems is characterized in that the inner surfaces of the numerous holes for printing are formed into smooth straight surfaces by plastic working. It is something.
（作用）
上述の如く構成された印刷用マスクを用いて印刷回路板
上へ半田などの塗布すると、印刷用マスクの多数の孔の
内側面が塑性加工により滑らかなストレート面になされ
ているので、印刷用マスク上面の塗布材料をスキージに
て除いた後、印刷用マスクを取り外す際、塗布材料との
摩擦抵抗が無く、スムースに離れて、塗布材料を引っ張
ることが無いので、塗布材料が孔の途中で切れたり、印
刷回路板から剥がれたりすることが無い。(Function) When solder or the like is applied onto a printed circuit board using the printing mask configured as described above, the inner surfaces of the many holes in the printing mask are formed into smooth straight surfaces by plastic processing. After removing the coating material on the top surface of the printing mask with a squeegee, when removing the printing mask, there is no frictional resistance with the coating material, and the coating material separates smoothly, and the coating material is not pulled. It will not break or peel off from the printed circuit board.
（実施例）
本発明の印刷用マスクの一実施例を第１．２図によって
説明すると、■は印刷用マスクで、そのマスク１の印刷
用の多数のスリット形状の孔２は、最初に第３図ａに示
す如く放電加工（又はエツチング加工）にて小さめの原
形孔２′を製作し、次に第３図すに示す如く印刷形状の
パンチエ具８にてバニッシュ加工を行って所定形状の大
きさの内壁面の滑らかなストレートの孔２を製作し、次
いで第３図Ｃに示す如く孔２の下端開口縁に生じたばり
６を研摩して取り除き、然る後第３図ｄに示す如く研摩
により孔２の下端開口縁内側に生じたばり７を下方から
の孔２への仕上げパンチ８′の打ち込みにより、平滑美
麗に仕上げられている。(Embodiment) An embodiment of the printing mask of the present invention will be described with reference to FIGS. As shown in Figure 3a, a smaller original hole 2' is manufactured by electrical discharge machining (or etching), and then burnishing is performed using a puncher 8 with a printed shape as shown in Figure 3A to form a predetermined shape. A straight hole 2 with a smooth inner wall surface of the same size is manufactured, and then the burr 6 formed at the lower opening edge of the hole 2 is polished and removed as shown in FIG. The burr 7 formed on the inner side of the lower opening edge of the hole 2 due to polishing is finished smooth and beautiful by driving the finishing punch 8' into the hole 2 from below.
このように構成された実施例の印刷用マスク１を第４図
ａに示す如く印刷回路板３上にセットし、その上から第
４図すに示す如く溶融半田５を塗布して印刷用マスクｌ
の上面の溶融半田５をスキージにて第４図Ｃに示す如（
取り除いた後、印刷用マスク１を取り外した処、印刷用
マスク１の多数のスリット形状の孔２の内側面が滑らか
なストレートとなっているので、半田５′との摩擦抵抗
が極めて少なく、半田５′を引っ張ることが無く、半田
５′が孔２の途中から切れたり、印刷回路板３上から剥
がれたりすることが無かった。The printing mask 1 of the embodiment thus constructed is set on the printed circuit board 3 as shown in FIG. 4a, and molten solder 5 is applied thereon as shown in FIG. l
Using a squeegee, remove the molten solder 5 on the top surface as shown in FIG.
After removing the printing mask 1, the inner surface of the many slit-shaped holes 2 of the printing mask 1 is smooth and straight, so the frictional resistance with the solder 5' is extremely small, and the solder is removed. There was no need to pull the solder 5', and the solder 5' did not break in the middle of the hole 2 or peel off from the printed circuit board 3.
（発明の効果）
以上の説明で判るように本発明の印刷用マスクによれば
、印刷用マスクを取り外した際、半田等の塗布材料が印
刷用マスクの孔の途中から切れたり、印刷回路板上から
剥がれたりすることが無いので、精度の高い安定した品
質の印刷ができる。(Effects of the Invention) As can be seen from the above explanation, according to the printing mask of the present invention, when the printing mask is removed, the coating material such as solder may be cut from the middle of the hole of the printing mask, or the printed circuit board may be damaged. Since it does not peel off from the top, it is possible to print with high precision and stable quality.
第１図は本発明の印刷用マスクの斜視図、第２図はその
縦断面図、第３図ａ乃至ｄはその印刷用マスクの孔の製
作工程を示す図、第４図ａ乃至Ｃは本発明の印刷用マス
クを用いて印刷回路板へ半田を塗布し、印刷用マスクを
取り外して印刷する工程を示す図、第５図は従来の印刷
回路板の印刷用マスクの斜視図、第６図はその縦断面図
、第７図はその印刷用マスクを用いて印刷回路板へ半田
などの塗布材料を塗布した状態を示す縦断面図、第８図
はその印刷回路板より印刷用マスクを取り外した状態を
示す図である。Fig. 1 is a perspective view of the printing mask of the present invention, Fig. 2 is a longitudinal sectional view thereof, Figs. 3 a to d are views showing the manufacturing process of holes in the printing mask, and Figs. A diagram showing a process of applying solder to a printed circuit board using the printing mask of the present invention, removing the printing mask and printing, FIG. The figure is a vertical cross-sectional view of the same, Figure 7 is a vertical cross-sectional view showing a state in which a coating material such as solder is applied to a printed circuit board using the printing mask, and Figure 8 is a vertical cross-sectional view showing how the printing mask is applied from the printed circuit board. It is a figure which shows the state removed.
Claims (1)
の内側面が塑性加工により滑らかなストレート面になさ
れていることを特徴とする印刷用マスク。1) A printing mask for printing a printed circuit, characterized in that the inner surfaces of the many holes for printing in the mask for printing a printed circuit are formed into smooth straight surfaces by plastic processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023714A JPH03229252A (en) | 1990-02-02 | 1990-02-02 | Mask for printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023714A JPH03229252A (en) | 1990-02-02 | 1990-02-02 | Mask for printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03229252A true JPH03229252A (en) | 1991-10-11 |
Family
ID=12118005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023714A Pending JPH03229252A (en) | 1990-02-02 | 1990-02-02 | Mask for printing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03229252A (en) |
-
1990
- 1990-02-02 JP JP2023714A patent/JPH03229252A/en active Pending
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