JPH07240566A - Printed-wiring board and its outward-form working method - Google Patents
Printed-wiring board and its outward-form working methodInfo
- Publication number
- JPH07240566A JPH07240566A JP2991994A JP2991994A JPH07240566A JP H07240566 A JPH07240566 A JP H07240566A JP 2991994 A JP2991994 A JP 2991994A JP 2991994 A JP2991994 A JP 2991994A JP H07240566 A JPH07240566 A JP H07240566A
- Authority
- JP
- Japan
- Prior art keywords
- area
- product
- product area
- wiring board
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、印刷配線板及びその外
形方法に関し、特に基板の製品エリアと捨て基板エリア
とを容易に分離できる印刷配線板及びその外形加工方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and an outer shape method thereof, and more particularly to a printed wiring board and an outer shape processing method thereof that can easily separate a product area of a substrate and a waste board area.
【０００２】[0002]
【従来の技術】近年、印刷配線板に実装される部分は、
表面実装部品が増加しており、それに伴い実装方法の効
率化を図る為に複数枚の印刷配線板を１シート内に編集
して部品実装後に分離するという事が多く行なわれてい
る。2. Description of the Related Art Recently, the parts mounted on a printed wiring board are
The number of surface-mounted components is increasing, and accordingly, in order to improve the efficiency of the mounting method, it is often practiced to edit a plurality of printed wiring boards in one sheet and separate them after component mounting.
【０００３】従来、この種の印刷配線板は図２に示す様
に製品エリア１と捨て基板エリア２の接続部４を製品エ
リア１の外周に沿って複数箇所配置しており、製品エリ
ア１と捨て基板エリア２を分離する場合に、専用治具を
用いて接続部４のカットを行っている。Conventionally, in this type of printed wiring board, as shown in FIG. 2, a plurality of connecting portions 4 between the product area 1 and the discarded substrate area 2 are arranged along the outer periphery of the product area 1, and When separating the discarded substrate area 2, the connecting portion 4 is cut using a dedicated jig.
【０００４】製品エリア１と捨て基板エリア２の間にス
リット３を形成する事は、特開平４−７１２８５号公報
で提案されている。本提案は、製品の外形に沿ってスリ
ットを予め形成した後、スリット３に沿って製品の外形
をカットするものである。Forming the slit 3 between the product area 1 and the discarded substrate area 2 has been proposed in Japanese Patent Laid-Open No. 4-71285. The present proposal is to form a slit along the outer shape of the product in advance and then cut the outer shape of the product along the slit 3.
【０００５】本提案によると、従来、製品の外形をカッ
トする場合に金属性の型（金型）を用いて行っていた事
に対して、ＮＣルーター外形加工機を用いる事により生
産性の向上を図る事ができる。According to the present proposal, in the past, when the outer shape of the product was cut by using a metal mold (mold), the productivity is improved by using the NC router outer shape processing machine. You can plan.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上述し
た従来技術では、製品エリア１と捨て基板エリア２を分
離する場合に接続部４を簡単にカットする事ができず、
接続部４をカットする為に、金型及びＮＣルーター外形
加工機の様な専用治具が必要である事から専用治具作成
費用がかかるという欠点がある。However, in the above-mentioned conventional technique, the connecting portion 4 cannot be easily cut when the product area 1 and the discarded substrate area 2 are separated,
In order to cut the connecting portion 4, a dedicated jig such as a die and an NC router outer shape processing machine is required, so that there is a disadvantage that a dedicated jig preparation cost is required.
【０００７】[0007]
【課題を解決するための手段】本発明によれば、製品エ
リアと捨て基板エリアで構成される印刷配線板におい
て、製品エリアと捨て基板エリアの接続部を製品の重心
を通る直線とスリットとが交差する２箇所にのみ配置し
た構造を特徴とする印刷配線板を得る事ができる。又、
製品エリアと捨て基板エリアとの接続部を残してスリッ
トを形成する際、製品エリアと捨て基板エリアとの接続
部を製品エリアの重心を通る直線上に２箇所のみ配置す
る様にスリットを形成する工程と、前記接続部を軸にし
て、製品エリアに回転させる力を加える事により、製品
エリアと捨て基板エリアを分離する工程とを有する事を
特徴とする印刷配線板の外形加工方法を得る事ができ
る。According to the present invention, in a printed wiring board composed of a product area and a waste substrate area, a straight line passing through the center of gravity of the product and a slit are provided at the connection portion of the product area and the waste substrate area. It is possible to obtain a printed wiring board having a structure in which it is arranged only at two intersecting points. or,
When the slit is formed leaving the connection between the product area and the discarded substrate area, the slit is formed so that the connection between the product area and the discarded substrate area is arranged only at two points on a straight line passing through the center of gravity of the product area. To obtain an outer shape processing method of a printed wiring board, characterized by comprising a step and a step of separating a product area and a waste board area by applying a rotating force to the product area about the connecting portion as an axis. You can
【０００８】[0008]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【０００９】図１は、本発明の第１の実施例を示す略図
である。製品エリア１を２個１シート内に編集し、捨て
基板エリア２との間にスリット３を設けて接続部４で製
品エリア１と捨て基板エリア２を接続する。スリット３
は、幅が２ｍｍで接続部４は接続幅４ａが板厚と同一で
あり、製品エリア１の重心５を通る直線Ａ−Ａ′とスリ
ット３が交差する箇所に各々配置してある。接続幅４ａ
は、板厚の１／２から板厚までが接続強度及び分離のし
やすさに対して最適である。製品エリア１の重心５は、
製品エリア１の面積を２等分する直線を少なくとも２本
引き、その交点を求め、製品エリア１の重心５とする。FIG. 1 is a schematic diagram showing a first embodiment of the present invention. Two product areas 1 are edited in one sheet, a slit 3 is provided between the product area 1 and the discarded board area 2, and the product area 1 and the discarded board area 2 are connected by a connecting portion 4. Slit 3
Has a width of 2 mm, the connecting portion 4 has a connecting width 4a equal to the plate thickness, and is arranged at a position where a straight line AA 'passing through the center of gravity 5 of the product area 1 and the slit 3 intersect. Connection width 4a
Is optimal from the half of the plate thickness to the plate thickness for the connection strength and the ease of separation. The center of gravity 5 of product area 1 is
At least two straight lines that divide the area of the product area 1 into two are drawn, and the intersections thereof are determined to be the center of gravity 5 of the product area 1.
【００１０】所望の位置にスルーホール形成，回路形
成，ソルダーレジスト印刷および文字印刷を公知の方法
で施した後に、製品エリア１の重心５を通る直線Ａ−
Ａ′とスリット３が交差する２箇所のみに接続部４が配
置される様にスリット３及び最外周の外形加工を行う。
製品エリア１に接続部４を軸にした回転する力を、軸か
らもっとも離れた位置に加える事により、専用治具を用
いる事なく、容易に製品エリア１と捨て基板エリア２を
分離する事とがでる。After performing through-hole formation, circuit formation, solder resist printing and character printing at desired positions by known methods, a straight line A- passing through the center of gravity 5 of the product area 1
The outer shapes of the slit 3 and the outermost periphery are processed so that the connecting portions 4 are arranged only at two points where A ′ and the slit 3 intersect.
By applying a rotating force about the connecting portion 4 to the product area 1 at the position farthest from the axis, the product area 1 and the discarded substrate area 2 can be easily separated without using a dedicated jig. Get out.
【００１１】図３は本発明の第２の実施例を示す略図で
あり、図１の接続部４に丸穴６を追加したものである。
丸穴６の大きさは、スリット３の幅と同一の大きさ（直
径２ｍｍ）で、接続部４は接続幅４ｂがトータルで製品
の板厚と同一となる様な幅とする。丸穴６の追加によ
り、製品エリア１と捨て基板エリア２を分離した場合の
破断面の仕上りをなめらかにして分離する事ができる利
点がある。FIG. 3 is a schematic view showing a second embodiment of the present invention, in which a round hole 6 is added to the connecting portion 4 of FIG.
The size of the round hole 6 is the same as the width of the slit 3 (diameter 2 mm), and the connection portion 4 has a width such that the connection width 4b is the same as the product thickness in total. The addition of the round hole 6 has an advantage that the finish of the fracture surface when the product area 1 and the discarded substrate area 2 are separated can be smoothed and separated.
【００１２】[0012]
【発明の効果】以上説明したように本発明は製品と捨て
基板の接続部を製品の重心を通る直線上に配置したの
で、 （１）製品に回転する力を加えるだけで、容易に製品と
捨て基板を分離する事ができる。As described above, according to the present invention, since the connecting portion between the product and the discarded substrate is arranged on the straight line passing through the center of gravity of the product, (1) the product can be easily connected to the product by applying a rotating force to the product. The discarded substrate can be separated.
【００１３】（２）製品と捨て基板を分離する為の専用
治具が不要であり、専用治具作製費用が削減できる。 という効果がある。(2) A dedicated jig for separating the product from the discarded substrate is not required, and the cost for manufacturing the dedicated jig can be reduced. There is an effect.
【図１】本発明の第１実施例を示す平面図。FIG. 1 is a plan view showing a first embodiment of the present invention.
【図２】図１の接続部の拡大平面図。FIG. 2 is an enlarged plan view of a connection portion of FIG.
【図３】従来の一例を示す平面図。FIG. 3 is a plan view showing a conventional example.
【図４】本発明の実施例２の接続部を示す拡大平面図。FIG. 4 is an enlarged plan view showing a connecting portion according to a second embodiment of the present invention.
１ 製品エリア ２ 捨て基板エリア ３ スリット ４ 接続部 ４ａ，４ｂ 接続幅 ５ 重心 ６ 丸穴 Ａ−Ａ′ 製品の重心を通る直線 1 Product area 2 Discarded board area 3 Slit 4 Connection part 4a, 4b Connection width 5 Center of gravity 6 Round hole AA 'Straight line passing through the center of gravity of the product
Claims (2)
る印刷配線板において、製品エリアと捨て基板エリアと
の接続部を製品エリアの重心を通る直線とスリットとが
交差する２箇所のみに配置したことを特徴とする印刷配
線板。1. A printed wiring board composed of a product area and a discarded substrate area, wherein the connecting portion between the product area and the discarded substrate area is arranged only at two points where a straight line passing through the center of gravity of the product area and a slit intersect. A printed wiring board characterized by the above.
てスリットを形成する際、製品エリアと捨て基板エリア
との接続部を製品エリアの重心を通る直線上の２箇所の
みに配置するようにスリットを形成する工程と、前記接
続部を軸にして製品エリアに回転させる力を加える事に
より、製品エリアと捨て基板エリアを分離する工程とを
有することを特徴とする印刷配線板の外形加工方法。2. When forming a slit leaving the connection between the product area and the discarded substrate, the connection between the product area and the discarded substrate area is arranged only at two points on a straight line passing through the center of gravity of the product area. Outer processing of a printed wiring board, characterized in that it has a step of forming a slit in the product and a step of separating the product area and the discarded substrate area by applying a force for rotating the product area around the connection part as an axis. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6029919A JP2687868B2 (en) | 1994-02-28 | 1994-02-28 | Printed wiring board and external processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6029919A JP2687868B2 (en) | 1994-02-28 | 1994-02-28 | Printed wiring board and external processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07240566A true JPH07240566A (en) | 1995-09-12 |
| JP2687868B2 JP2687868B2 (en) | 1997-12-08 |
Family
ID=12289411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6029919A Expired - Fee Related JP2687868B2 (en) | 1994-02-28 | 1994-02-28 | Printed wiring board and external processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2687868B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142861A (en) * | 1993-11-15 | 1995-06-02 | Fujitsu Denso Ltd | Manufacture of metal-base wiring board |
-
1994
- 1994-02-28 JP JP6029919A patent/JP2687868B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07142861A (en) * | 1993-11-15 | 1995-06-02 | Fujitsu Denso Ltd | Manufacture of metal-base wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2687868B2 (en) | 1997-12-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2687868B2 (en) | Printed wiring board and external processing method thereof | |
| JP2004200607A (en) | Printed-wiring board assembly | |
| JPH0389587A (en) | Flexible circuit board assembly and manufacture thereof | |
| JP2001203482A (en) | Detachable printed board fitting frame | |
| JPH0230498A (en) | Punching fitting for working printed board | |
| JP2001277058A (en) | Compound plate working method including laser beam machining and pressing | |
| US6751861B2 (en) | Printed circuit board manufacturing method | |
| JPS624879B2 (en) | ||
| JPH0435086A (en) | Cutting method for end face through-hole substrate | |
| JP3187415B2 (en) | Punching method for brittle materials | |
| JPH051095Y2 (en) | ||
| JPH02230787A (en) | Printed wiring board | |
| JPH0745916A (en) | Printed wiring board | |
| JPH06342963A (en) | Printed circuit board and dividing method therefor | |
| JPS5826199B2 (en) | Manufacturing method of printed wiring board with metal core | |
| JPH0471285A (en) | Metal core printed-wiring board and profiling method thereof | |
| JPH02215179A (en) | Printed board | |
| JPS63254756A (en) | Manufacture of lead frame | |
| JPH0573977U (en) | Multi-sided board | |
| JPH0927659A (en) | Sheet for flexible printed board | |
| JPH0231791Y2 (en) | ||
| JPH0639471Y2 (en) | Printed wiring board | |
| JP2002368352A (en) | Printed board sheet | |
| JPH1051084A (en) | Split type printed wiring board and its manufacture | |
| JPH03240291A (en) | Manufacture of printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970722 |
|
| LAPS | Cancellation because of no payment of annual fees |