JPH065343A - Solder metal plating method to hole inside surface of metal plate - Google Patents

Abstract

PURPOSE:To provide a solder metal plating method to the hole inside surfaces of a metal plate by which desired solder metal plating layers can be formed efficiently on the inside surfaces of through holes such as oblong holes by devising beforehand so that a molten solder film blocking the through holes may not be formed in a dip solder process of the metal plate. CONSTITUTION:Insulating resin is applied to a part on the inside surfaces of oblong holes 16 of a metal hoop member 14, and solder resist layers 12 (insulating coating films) are formed. Afterwards, the metal hoop material 14 is soaked in a melting solder tank, and solder metal plating layers 13 are formed in places where the solder resist layers 12 are not formed among the inside surfaces of the oblong holes 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder plating method suitable for the inner surface of a hole of a metal plate, which is suitable for forming a solder plating layer on the inner surface of a long hole, a small hole or the like formed in a metal plate. .

[0002]

2. Description of the Related Art When solder plating is applied to the inner surface of a through hole formed in a metal plate, dip solder is widely used in which the metal plate is immersed in a molten solder bath. However, if the through hole has a small diameter or is elongated, a film due to the surface tension of the molten solder is likely to be formed in the through hole in the dip soldering process, and thus the through hole is apt to be clogged with solder.

Therefore, conventionally, when a solder plating layer is formed on the inner surface of a through hole such as a long hole or a small hole formed in a metal plate, excess solder in the through hole is removed as a step subsequent to the dip soldering step. It was removed using an air knife or a vacuum nozzle. That is, the solder removal method using an air knife is
It is a method of scraping off the solder clogged in the through holes by blowing compressed air from diagonally above and diagonally below the metal plate to the through holes, and the solder removing method using a vacuum nozzle is In this method, a nozzle is pressed against the through hole and vacuum suction is performed to suck up the solder clogged in the through hole.

[0004]

However, the above-mentioned air knife method has a problem in that it is difficult to obtain surface smoothness because solder holes are generated when the solder is scraped off, and the reliability of the solder plating layer is impaired. It was On the other hand, in the above-mentioned vacuum method, the sucked solder is apt to be clogged in the vacuum nozzle and the filter, so that there is a problem in that work efficiency is deteriorated and productivity is impaired.

The present invention has been made in view of the above problems of the prior art, and an object thereof is to provide a hole inner surface of a metal plate capable of efficiently forming a desired solder plating layer on the inner surface of a through hole such as an elongated hole. It is to provide a method of solder plating to the.

[0006]

In order to achieve the above object, the present invention provides a solder resist layer by applying an insulating resin to a part of the inner surface of a through hole formed in a metal plate. Then, by dipping the metal plate in a molten solder bath, a solder plating layer is formed on the inner surface of the through hole without closing the solder resist layer without closing the through hole. .

[0007]

When the solder resist layer is formed on a part of the inner surface of the through hole, the solder wettability is poor at that part, so that the molten solder does not adhere to the part, so that the through hole is blocked in the dip soldering process. The molten solder film is not formed, and the solder plating layer can be formed only at a desired portion on the inner surface of the through hole.

[0008]

Embodiments of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a manufacturing process diagram of the jumper chip according to the embodiment, FIG. 2 is a perspective view of a finished product of the jumper chip, FIG. 3 is a flowchart showing the work contents of the manufacturing process of the jumper chip, and FIG. It is sectional drawing which shows the insulating resin application process of the manufacturing process of a jumper chip.

The jumper chip 10 shown in FIG. 2 uses a rectangular parallelepiped metal substrate 11 made of nickel plated on the upper and lower surfaces of a steel plate as a base material, and the entire surface of the metal substrate 11 excluding both sides is made of epoxy resin or the like. An insulating film 12 made of an insulating resin is formed by coating, and the metal substrate 1
Solder plated layers 13 are plated on both side portions of the electrode 1. The solder plated layers 13 serve as electrodes for soldering to a pattern to be short-circuited. That is, when the jumper chip 10 is mounted on a printed circuit board (not shown), the jumper chip 10 is placed at a position bridging a pair of patterns facing each other across a gap on the printed circuit board, Part of the solder plating layer 13 and each pattern are soldered. As a result, the two patterns on the printed circuit board are short-circuited via the jumper chip 10.
The other pattern located in the gap between these two patterns faces the insulating film 12 so that an undesired short circuit can be prevented.

Next, a method of manufacturing the jumper chip 10 will be described.

First, a metal hoop material 14 having nickel plating on both sides is prepared, and the metal hoop material 14 is mounted on a reel stand (not shown) and a hole is formed while supplying a hoop, and a length of 1.2 mm. , 1.1 mm square hole 1
5 and a long hole 16 having a width of 0.6 mm and a length of 2 mm are shown in FIG.
A large number of holes are drilled in the arrangement as shown in FIG. In addition, the reference numeral 17 in FIG.
In the chip area used as the metal substrate 11, the chip area 17 is sandwiched between two rectangular holes 15 and 15 on the left and right sides and between two elongated holes 16 and 16 on the top and bottom sides.

Next, with respect to the metal hoop material 14, a narrow crosspiece 18 located between two adjacent square holes 15 and 15.
Is crushed in the thickness direction by about 0.1 mm to facilitate the insertion of a later-described relief roller into the square holes 15 and 15, and both sides of the metal hoop material 14 are deburred by a deburring machine (not shown) to 0.0
Grinding is performed for about 5 mm to remove the sagging during the drilling process, and then the metal hoop material 14 is washed to remove the working oil and shavings.

The next step is the application and curing of the insulating resin by the relief printing method. As shown in FIG. 1B, the rows of square holes 15 and the groups of long holes 16 on both sides of the metal hoop material 14 are formed. , The inner surface (the inner right surface or the inner left surface) of each square hole 15 on the side to be the end surface of the chip region 17, and the right inner surface and the left inner surface of each elongated hole 16 are formed by coating. These insulating coatings 12 are formed by curing an insulating resin applied by a roller coating method in a UV curing furnace (not shown), for example, square holes 15
As shown in FIG. 4, a part of the letterpress roller 21 to which the insulating resin 20 is supplied to the outer peripheral surface by the transfer roller 19 is arranged in parallel with the crosspiece 18 interposed therebetween, as shown in FIG.
In the same figure, the upper left edge of the left square hole 15 is the insulating resin 2 of the relief roller 21.
0 is scraped off and the insulating resin 20 is applied to the left inner surface of the square hole 15.
Has been applied. Then, while the metal hoop material 14 is being fed, the insulating resin 20 is applied to the left inner surface of the square hole 15 one after another.
After coating, the insulating resin 20 is sent to a UV curing furnace as it is, and the insulating resin 20 is cured to form the insulating film 12.

If the upper right edge of the right square hole 15 in FIG. 4 is set to scrape off the insulating resin 20 of the relief roller 21, the insulating film is formed on the right inner surface of the square hole 15 after curing. 12 can be formed, and in the same manner, the insulating film 12 can be formed on the right inner surface and the left inner surface of each elongated hole 16, and thus, the insulating film 12 is formed on the required portions of the square hole 15 and the elongated hole 16. After that, the insulating film 12 is formed by applying and curing the insulating resin of the relief roller to the required portions on both sides of the metal hoop material 14, respectively.

Since the size of the square hole 15 along the feeding direction of the metal hoop material 14 is as small as 1.1 mm, when the letterpress roller 21 is inserted into one square hole 15, the insulating resin 20 is applied to the inner surface. However, in this embodiment, the cross-section 18 is crushed in advance so that the relief roller 21 can be inserted deeply by using the two square holes 15, 15. Further, if the edges of the square holes 15 and the long holes 16 disappear due to sagging during the drilling process, the insulating resin 20 may not be sufficiently scraped off and the coating amount may be insufficient. Since the drainage has been removed by using the
The edges are easy to scrape off. Therefore, in this embodiment, the insufficient amount of the insulating resin 20 applied to the inner surface of the hole is unlikely to occur, and the insulating film 12 having a sufficient thickness can be reliably formed.

Now, after the insulating film 12 has been applied and formed on the metal hoop material 14 at a predetermined position in this way, the hoop is supplied to a molten solder bath (not shown) and dipped to perform dip soldering. As shown, insulating film 12
A solder plating layer 13 is formed on the metal surface not covered with the solder. By performing such dip soldering, the chip area 17 of the metal hoop material 14 is solder-plated on both side portions adjacent to the elongated hole 16 including the end face (inner surface of the elongated hole 16). Further, the slit-shaped elongated hole has a drawback that the solder tends to be clogged because the molten solder easily forms an undesired film due to the surface tension.
Since the insulating film 12 is previously formed on a part of the inner surface of the 6 mm long hole 16, the insulating film 12 serves as a solder resist layer, and a film of molten solder is not formed in the long hole 16. It is not necessary to remove excess solder in the slot 16 using an air knife or vacuum nozzle. That is,
On the inner surface of the slit-shaped long hole 16, the insulating film 12 is formed by applying the insulating resin 20 in advance on both ends in the longitudinal direction.
Is formed, the slot 1 is formed after the dip soldering process.
6A and 6B, the solder plating layer 13 is formed only on the upper inner surface and the lower inner surface of the chip region 17 on the end surface side in FIG. 1C, and there is no concern that the elongated hole 16 is blocked by the solder.

Then, after the flux is washed after the dip soldering, the metal hoop material 14 is sent to a press machine (not shown), and as shown in FIG.
The single jumper chip 10 is pulled out from the metal hoop material 14 by cutting the part connecting the square hole 15 and the long hole 16 around the. As described above with reference to FIG. 2, the jumper chip 10 thus obtained has a rectangular parallelepiped metal substrate 11 in which the chip region 17 of the metal hoop material 14 is punched out, and all the metal substrate 11 except both side portions. It is composed of an insulating film 12 provided on the surface and a solder plating layer 13 as an electrode provided on both sides of the metal substrate 11. After being removed from the metal hoop material 14, it can be directly tape-packaged.

As described above, in the above embodiment, the metal hoop material 1 is used.
Since the insulating film 12 is previously formed by coating on a part of the inner surface of the narrow slot 16 of No. 4, a molten solder film is formed so as to block the slot 16 even when the metal hoop material 14 is dip-soldered. Instead, the solder plating layer 13 can be formed only on a desired portion of the inner surface of the elongated hole 16. In other words, since excess solder does not remain in the long hole 16 after the dip soldering, it is not necessary to remove the excess solder by using an air knife or a vacuum nozzle, and there is a decrease in reliability that may occur when shaving with the air knife, or a vacuum is generated. It is possible to prevent the work efficiency from being deteriorated when sucking with the nozzle, and it is possible to efficiently form the desired solder plating layer 13 on the inner surface of the long hole 16.

In the above embodiment, the case where the inner surface of the narrow hole is subjected to the solder plating is described. However, in the case of other through holes in which an undesired film of molten solder is easily formed at the time of dip soldering, By forming a solder resist layer made of an insulating resin on a part of the inner surface in advance, it is possible to prevent clogging of the solder.

[0020]

As described above, according to the present invention in which the solder resist layer is formed on a part of the inner surface of the through hole of the metal plate and then the dip soldering is performed, the molten solder for closing the through hole is obtained. Film is not formed, it is not necessary to remove excess solder by using an air knife or a vacuum nozzle after dip soldering, so that a desired solder plating layer can be efficiently formed on the inner surface of the through hole.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of a jumper chip according to an embodiment.

FIG. 2 is a perspective view of a finished product of the jumper chip.

FIG. 3 is a flowchart showing work contents of a manufacturing process of the jumper chip.

FIG. 4 is a cross-sectional view showing an insulating resin coating step in the manufacturing process of the jumper chip.

[Explanation of symbols]

 10 Jumper Chip 12 Insulating Film (Solder Resist Layer) 13 Solder Plating Layer 14 Metal Hoop Material 16 Long Hole 20 Insulating Resin

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Teruo Nishikawa 1-7 Yukiya Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd.

Claims (1)

[Claims] 1. A solder resist layer is formed by applying an insulative resin to a part of the inner surface of a through hole formed in a metal plate, and thereafter, the metal plate is immersed in a molten solder bath to form the solder resist layer. A solder plating method for forming an inner surface of a hole of a metal plate, wherein a solder plating layer is formed on a portion of the inner surface of the through hole where the solder resist layer is not formed.