JPH065341A - Jumper chip and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a jumper chip and a manufacturing method thereof by which there is no need to form a ceramic substrate as well as there is no need to carry out complicated bending processing and material cost and processing cost become low and mass-productivity becomes excellent. CONSTITUTION:After insulating coating films 12 are formed by application on a metallic hoop member 14 on which boring work has been carried out, solder metal plating layers 13 are formed. Afterward, chip areas 17 are punched off. The solder metal plating layers 13 (electrodes) are arranged in both side parts of a metallic board, and the insulating coating films 12 to be interposed between the electrodes are arranged on the surface except both the side parts of the metallic substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jumper chip used for short-circuiting a pair of patterns facing each other across a gap and a method for manufacturing the jumper chip.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional jumper chip.
As shown in FIG. 3, electrodes 2 made by nickel plating and solder plating are provided on both sides of a rectangular parallelepiped ceramic substrate 1, and both electrodes 2, 2 are electrically connected by a short circuit electrode 3 provided on the upper surface of the ceramic substrate 1. Widely used items are used. This pattern is placed on a printed circuit board (not shown) at a position where a pair of patterns facing each other across a gap are short-circuited, and electrodes 2 and 2 on both sides and each pattern are soldered together to form both patterns. Is short-circuited and mounted on the printed circuit board.

However, in such a conventional product, it is necessary to first form a ceramic substrate and then to form a plating layer having a predetermined shape on the ceramic substrate, which increases material costs and processing costs, resulting in an expensive jumper chip. There was a problem.

Therefore, conventionally, a jumper chip whose cost is reduced by using a metal plate as a base material is used as an actual flat plate.
No. 129612 is proposed. This one is
As shown in FIG. 6, by bending a metal plate 4 having a predetermined shape, one side of which is plated with solder, the solder plating layer 5 is bent into a substantially U-shape so that both sides are bent. The portions 6 and 7 serve as electrodes, and when mounted on the printed board, the bent portions 6 and 7 are each soldered to the pattern of the printed board. Also, the metal plate 4
In the part where both the bent portions 6 and 7 are connected, the folded portion 8 which is folded back so that the surface not subjected to the solder plating is exposed to the outside is superposed and therefore the solder to the pattern of the printed circuit board is placed. At the time of attachment, the solder which goes up the bent portions 6 and 7 and goes to the central portion of the metal plate 4 can be blocked by the folded portion 8, so that an undesired short circuit caused by the dropping of the solder does not occur. ing.

According to the above-mentioned conventional proposal, it is not necessary to form a ceramic substrate, and by soldering one side of a metal hoop material and then punching it out, a large number of single jumper chips which only leave bending work are taken. Therefore, the material cost and the processing cost can be significantly reduced.

[0006]

However, in the above-mentioned conventional proposals, since the metal plate removed from the metal hoop material has to be individually bent, a small jumper chip having a side dimension of about 1 to 2 mm. However, there is a problem in that the mass productivity is poor and the merit of cost reduction is small as a result.

The present invention has been made in view of the above problems of the prior art, and its first object is to provide a jumper chip which is low in material cost and processing cost and excellent in mass productivity. A second object of the present invention is to provide a method for manufacturing such a jumper chip.

[0008]

The first object of the present invention described above is to provide electrodes formed by forming a solder plating layer on both sides of a metal substrate, and to the surface of the metal substrate excluding at least both sides. It is achieved by providing an insulating film made of an insulating resin and interposed between the electrodes.

A second object of the present invention described above is to form a large number of chip regions surrounded by a plurality of through holes for a metal substrate of a jumper chip by drilling a metal hoop material. In addition, an insulating resin is applied to the surface of the chip area except at least both sides to form an insulating film, and solder plating is applied to both sides of the chip area, and then the metal hoop material is punched. It is achieved by cutting the portion connecting the through holes around the tip region.

[0010]

[Function] The jumper chip in which the base material is the metal plate and the insulating film is interposed between the electrodes on both sides can be manufactured by using the metal hoop material, and is removed from the metal hoop material. The finished product can be obtained without complicated bending later. That is, in the above manufacturing method, an insulating film or a solder plating layer can be continuously formed while supplying the hoop to the chip region of the metal hoop material, and the chip region is extracted from the metal hoop material. Since a single jumper chip can be obtained at that point, mass productivity becomes extremely good.

[0011]

Embodiments of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a manufacturing process diagram of the jumper chip according to the embodiment, FIG. 2 is a perspective view of a finished product of the jumper chip, FIG. 3 is a flowchart showing the work contents of the manufacturing process of the jumper chip, and FIG. It is sectional drawing which shows the insulating resin application process of the manufacturing process of a jumper chip.

The jumper chip 10 shown in FIG. 2 has a rectangular parallelepiped metal substrate 11 formed by plating nickel on the upper and lower surfaces of an iron plate as a base material, and the entire surface of the metal substrate 11 excluding both sides is made of epoxy resin or the like. An insulating film 12 made of an insulating resin is formed by coating, and the metal substrate 1
Solder plated layers 13 are plated on both side portions of the electrode 1. The solder plated layers 13 serve as electrodes for soldering to a pattern to be short-circuited. That is, when the jumper chip 10 is mounted on a printed circuit board (not shown), the jumper chip 10 is placed at a position bridging a pair of patterns facing each other across a gap on the printed circuit board, Part of the solder plating layer 13 and each pattern are soldered. As a result, the two patterns on the printed circuit board are short-circuited via the jumper chip 10.
The other pattern located in the gap between these two patterns faces the insulating film 12 so that an undesired short circuit can be prevented.

Next, a method of manufacturing the jumper chip 10 will be described.

First, a metal hoop material 14 having nickel plating on both sides is prepared, and the metal hoop material 14 is mounted on a reel stand (not shown) and a hole is formed while supplying a hoop, and a length of 1.2 mm. , 1.1 mm square hole 1
5 and a long hole 16 having a width of 0.6 mm and a length of 2 mm are shown in FIG.
A large number of holes are drilled in the arrangement as shown in FIG. In addition, the reference numeral 17 in FIG.
In the chip area used as the metal substrate 11, the chip area 17 is sandwiched between two rectangular holes 15 and 15 on the left and right sides and between two elongated holes 16 and 16 on the top and bottom sides.

Next, with respect to the metal hoop material 14, a narrow crosspiece 18 located between two adjacent square holes 15 and 15.
Is crushed in the thickness direction by about 0.1 mm to facilitate the insertion of a later-described relief roller into the square holes 15 and 15, and both sides of the metal hoop material 14 are deburred by a deburring machine (not shown) to 0.0
Grinding is performed for about 5 mm to remove the sagging during the drilling process, and then the metal hoop material 14 is washed to remove the working oil and shavings.

The next step is the application and curing of the insulating resin by the relief printing method. As shown in FIG. 1B, the rows of square holes 15 and the groups of long holes 16 on both sides of the metal hoop material 14 are formed. , The inner surface (the inner right surface or the inner left surface) of each square hole 15 on the side to be the end surface of the chip region 17, and the right inner surface and the left inner surface of each elongated hole 16 are formed by coating. These insulating coatings 12 are formed by curing an insulating resin applied by a roller coating method in a UV curing furnace (not shown), for example, square holes 15
As shown in FIG. 4, a part of the letterpress roller 21 to which the insulating resin 20 is supplied to the outer peripheral surface by the transfer roller 19 is arranged in parallel with the crosspiece 18 interposed therebetween, as shown in FIG.
In the same figure, the upper left edge of the left square hole 15 is the insulating resin 2 of the relief roller 21.
0 is scraped off and the insulating resin 20 is applied to the left inner surface of the square hole 15.
Has been applied. Then, while the metal hoop material 14 is being fed, the insulating resin 20 is applied to the left inner surface of the square hole 15 one after another.
After coating, the insulating resin 20 is sent to a UV curing furnace as it is, and the insulating resin 20 is cured to form the insulating film 12.

If the upper right edge of the right square hole 15 in FIG. 4 is set so as to scrape off the insulating resin 20 of the relief roller 21, the insulating film is formed on the right inner surface of the square hole 15 after curing. 12 can be formed, and in the same manner, the insulating film 12 can be formed on the right inner surface and the left inner surface of each elongated hole 16, and thus, the insulating film 12 is formed on the required portions of the square hole 15 and the elongated hole 16. After that, the insulating film 12 is formed by applying and curing the insulating resin of the relief roller to the required portions on both sides of the metal hoop material 14, respectively.

Since the size of the square hole 15 along the feeding direction of the metal hoop material 14 is as small as 1.1 mm, when the letterpress roller 21 is inserted into one square hole 15, the insulating resin 20 is applied to the inner surface. However, in this embodiment, the cross-section 18 is crushed in advance so that the relief roller 21 can be inserted deeply by using the two square holes 15, 15. Further, if the edges of the square holes 15 and the long holes 16 disappear due to sagging during the drilling process, the insulating resin 20 may not be sufficiently scraped off and the coating amount may be insufficient. Since the drainage has been removed by using the
The edges are easy to scrape off. Therefore, in this embodiment, the insufficient amount of the insulating resin 20 applied to the inner surface of the hole is unlikely to occur, and the insulating film 12 having a sufficient thickness can be reliably formed.

Now, after the insulating film 12 is formed by coating on the predetermined portion of the metal hoop material 14 in this way, the hoop is supplied and dipped into a molten solder bath (not shown) for dip soldering. As shown, insulating film 12
A solder plating layer 13 is formed on the metal surface not covered with the solder. By performing such dip soldering, the chip area 17 of the metal hoop material 14 is solder-plated on both side portions adjacent to the elongated hole 16 including the end face (inner surface of the elongated hole 16). Further, the slit-shaped elongated hole has a drawback that the solder is likely to be clogged due to the film formation due to the surface tension of the molten solder, but in this embodiment, the insulating film 12 is previously formed on a part of the inner surface of the elongated hole 16 having a width of 0.6 mm. Since the insulating film 12 serves as a solder resist layer, a molten solder film is not formed in the elongated hole 16, and therefore the inside of the elongated hole 16 is formed by using an air knife or a vacuum nozzle after the dip soldering process. There is no need to remove excess solder. That is,
If dip solder is applied to the metal hoop material 14 on which the insulating film 12 that functions as a solder resist layer is formed,
There is no fear that the slit-shaped long holes 16 will be blocked by the solder, and the long holes 16 have the solder plating layer 13 only on the upper inner surface and the lower inner surface on the end surface side of the chip region 17 in FIG. It is formed.

Then, after the flux is washed after the dip soldering, the metal hoop material 14 is sent to a press machine (not shown), and as shown in FIG.
The single jumper chip 10 is pulled out from the metal hoop material 14 by cutting the part connecting the square hole 15 and the long hole 16 around the. As described above with reference to FIG. 2, the jumper chip 10 thus obtained has a rectangular parallelepiped metal substrate 11 in which the chip region 17 of the metal hoop material 14 is punched out, and all the metal substrate 11 except both ends thereof. It is composed of an insulating film 12 provided on the surface and a solder plating layer 13 as an electrode provided on both ends of the metal substrate 11, and can be taped and packaged after being removed from the metal hoop material 14.

As described above, in the above-described embodiment, the single jumper chip 10 is supplied while the metal hoop material 14 is being supplied in the hoop.
Since it can be continuously manufactured, the material cost and the processing cost can be significantly reduced as compared with the conventional general jumper chip using a ceramic substrate as a base material. Moreover, since this jumper chip 10 does not need to be complicatedly bent after being removed from the metal hoop material 14, it is a small jumper chip having a side dimension of about 1 to 2 mm, and has extremely good mass productivity. Therefore, a large cost reduction can be realized.

In the above embodiment, the metal hoop material 14 is used.
Since the through hole on the side of the jumper chip 10 which is to be the electrode is a narrow long hole 16 to reduce the waste of material, the insulating film 12 is formed on the inner surface of the long hole 16 by coating. However, if the through hole is formed wide enough not to be clogged with molten solder during dip soldering, it is not necessary to provide an insulating film (solder resist layer) on the inner surface thereof.

[0023]

As described above, the insulating film is applied between the pair of electrodes on both sides of the metal substrate by applying the insulating resin to the metal hoop material and then performing the solder plating to remove the chip area. According to the present invention, in which a jumper chip intervening with is obtained, the material cost and the processing cost are lower than that of the conventional product using a ceramic substrate as a base material, and moreover, complicated bending work is required after the metal hoop material is removed. It is possible to obtain a jumper chip that does not need to be performed and has extremely good mass productivity.
It has an excellent effect that a significant cost reduction can be achieved.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of a jumper chip according to an embodiment.

FIG. 2 is a perspective view of a finished product of the jumper chip.

FIG. 3 is a flowchart showing work contents of a manufacturing process of the jumper chip.

FIG. 4 is a cross-sectional view showing an insulating resin coating step in the manufacturing process of the jumper chip.

FIG. 5 is a perspective view showing an example of a conventional jumper chip.

FIG. 6 is a perspective view showing another example of a conventional jumper chip.

[Explanation of symbols]

 10 Jumper Chip 11 Metal Substrate 12 Insulating Film 13 Solder Plating Layer (Electrode) 14 Metal Hoop Material 15 Square Hole 16 Long Hole 17 Chip Area 20 Insulating Resin

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Teruo Nishikawa 1-7 Yukiya Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd.

Claims (2)

[Claims] 1. An electrode having a solder plating layer formed on both sides of a metal substrate, and an insulating film made of an insulating resin interposed between the electrodes on the surface of the metal substrate except at least both sides. A jumper chip characterized by being provided with. 2. A metal hoop material is perforated to form a large number of chip regions surrounded by a plurality of through holes for a metal substrate of a jumper chip, and then at least both sides of the chip region are removed. An insulating resin is applied to the surface to form an insulating film, and solder plating is applied to both sides of the chip area, and then the metal hoop material is punched to form the through holes around the chip area. A method for manufacturing a jumper chip, which is characterized in that a portion connecting the two is cut.