JPH04123486A - Cream solder printing apparatus and its preparation - Google Patents
Cream solder printing apparatus and its preparationInfo
- Publication number
- JPH04123486A JPH04123486A JP24269890A JP24269890A JPH04123486A JP H04123486 A JPH04123486 A JP H04123486A JP 24269890 A JP24269890 A JP 24269890A JP 24269890 A JP24269890 A JP 24269890A JP H04123486 A JPH04123486 A JP H04123486A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- cream solder
- squeegee
- holes
- flexible board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006071 cream Substances 0.000 title claims abstract description 48
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 claims description 5
- 235000013290 Sagittaria latifolia Nutrition 0.000 abstract 1
- 235000015246 common arrowhead Nutrition 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板、特にフレキシブルなプリント基
板にクリームはんだを印刷する方法お上びその装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for printing cream solder on printed circuit boards, particularly flexible printed circuit boards.
一般にプリント基板にクリームはんだを印刷するには、
プリント基板のクリームはんだ印刷箇所（以下、印刷箇
所という）と同一箇所に穴のあいた平らなマスクを用い
、該マスクの穴をプリント基板の印刷箇所に完全に一致
させてマスクをプリント基板に重ね合わせ、マスク上の
クリームはんだをスキージで掻いて穴の中にクリームは
んだを充填する。そしてマスクを上方に移動させること
によりマスクの穴の中に充填されたクリームはんだをは
んだ付は部に付着させるものである。Generally, to print cream solder on a printed circuit board,
Using a flat mask with holes in the same places as the cream solder printed areas (hereinafter referred to as printed areas) on the printed circuit board, align the holes of the mask perfectly with the printed areas on the printed circuit board and overlay the mask on the printed circuit board. , Scrape the cream solder on the mask with a squeegee and fill the holes with cream solder. By moving the mask upward, the cream solder filled in the hole of the mask is applied to the soldering part.
ところで近時、電子機器の小型化から、狭い場所にも変
形させて設置できるというフレキシブルなプリント基板
や生産性向上のためにフレキシブルなテープ上に電子部
品を搭載したテープ・オートメイテッド・ボンディング
（ＴＡＢ）等が用いられるようになってきた。これらフ
レキシブルな材料（以下、フレキ基板という）にクリー
ムはんだを印刷する場合、材料が非常に柔軟なものであ
るためフレキ基板１杖毎四方を治具に固定してから前述
のように平らなマスクを用いて印刷を行わなければなら
なかった。Recently, with the miniaturization of electronic devices, flexible printed circuit boards that can be deformed and installed in narrow spaces, and tape automated bonding (TAB), which mounts electronic components on flexible tape to improve productivity, have become popular. ) etc. have come to be used. When printing cream solder on these flexible materials (hereinafter referred to as flexible boards), since the materials are very flexible, each square of the flexible board is fixed to a jig, and then a flat mask is used as described above. had to be printed using.
フレキ基板のクリームはんだの印刷は治具を用いなけれ
ばならないことから、治具への取付け、取外しに多大な
手間を要するものであった。また、フレキ基板は治具に
取付けてから治具とマスクとの位置合わせを行うが、治
具を介しての位置合わせとなるため詔差が生しやすく、
信頼性に欠けるものであった。Printing cream solder on a flexible substrate requires the use of a jig, which requires a great deal of effort to attach and remove from the jig. In addition, the flexible substrate is mounted on a jig and then aligned between the jig and the mask, but since the alignment is done through the jig, discrepancies are likely to occur.
It lacked reliability.
本発明は、フレキ基板を治具に取付けることなくクリー
ムはんだの印刷が行え、しかもフレキ基板の印刷箇所と
マスクの穴とがずれることなく所定の箇所にクリームは
んだを印刷できるという装置および方法を提供すること
にある。The present invention provides an apparatus and method that can print cream solder without attaching a flexible board to a jig, and can also print cream solder at predetermined locations without misaligning the printed locations on the flexible board and the holes in the mask. It's about doing.
本発明者は、フレキ基板は材料が長尺となっていて、同
一回路が繰り返し形成されていることに着目して本発明
を完成させた。The present inventor completed the present invention by focusing on the fact that a flexible substrate is made of a long material and the same circuit is repeatedly formed.
本発明は、所定の穴が穿設された円筒状のマスク；マス
ク内に設置された円柱状のスキージ；マスク内に設置さ
れたクリームはんだ供給装置；前記スキージの下部に設
置された送りローラから構成されていることを特徴とす
るクリームはんだの印刷装置であり、また所定の穴が穿
設された円筒状のマスクを回転するとともにマスクの内
側にクノーム半田を供給し、該クリームはんたをマスク
内に置かれたスキージて押圧することにより、マスクの
穴からクリームはんだを押出してスキージとマスクの接
触面の反対側を走行するプリント基板にクリームはんだ
を印刷することを特徴とするクリームはんだの印刷方法
である。The present invention includes: a cylindrical mask with predetermined holes; a cylindrical squeegee installed in the mask; a cream solder supply device installed in the mask; This is a cream solder printing device characterized by the following: a cylindrical mask with predetermined holes is rotated, and the cream solder is supplied to the inside of the mask; A cream solder product that prints cream solder on the printed circuit board that runs on the opposite side of the contact surface between the squeegee and the mask by pushing cream solder out of the holes in the mask by pressing with a squeegee placed inside the mask. It is a printing method.
第１図は本発明のクリームはんたの印刷Ｈ置の斜視図、
第２図は同正面断面図、第３図は第２図ｍ−ｍ線断面図
、第４図はアンコイラ−１切断機が付設された正面断面
図である。FIG. 1 is a perspective view of the cream solder printing position H of the present invention;
2 is a front sectional view of the same, FIG. 3 is a sectional view taken along line mm in FIG. 2, and FIG. 4 is a front sectional view with an uncoiler-1 cutting machine attached.
先ずクリームはんだを印刷するフレキ基板について説明
する。フレキ基板１は長尺てあり、アンコイラ−２に巻
回されている。該フレキ基板には同一パターン３が繰り
返し形成されており、ここには多数のクリームハンダ印
刷箇所４・・・がある。First, the flexible substrate on which cream solder is printed will be explained. The flexible substrate 1 is long and is wound around an uncoiler 2. The same pattern 3 is repeatedly formed on the flexible substrate, and there are a large number of cream solder printed areas 4.
また、フレキ基板１の両側には、送りを正確に行うスプ
ロケット穴５・・・が穿設されている。Furthermore, sprocket holes 5 for accurate feeding are provided on both sides of the flexible substrate 1.
クリームはんだ印刷装置のマスク６は円筒状てあり、フ
レキ基板ｌの印刷箇所４と一致したところにマスク穴７
が穿設されている。またマスクの両側にはフレキ基板の
スプロケット穴５・・・と同一ピッチの送り穴８・・・
が穿設されている。マスク６内には円柱状のスキージ９
が設置されている。該スキージはゴム製であり、図示し
ない動力で矢印の如く回転するようになっている。また
スキージ９てマスク６を挟むようにして送りローラｌＯ
が設置されている。スキージ９にはフレキ基板のスプロ
ケット穴と同一ピッチのスプロケット片１１・・・が形
成されており、送りローラ１０には同ピツチのスプロケ
ット溝１２・・・が刻設されている。マスク６内にはク
リームはんだ供給装置であるノズル１３が挿入されてお
り、これは矢印入方向に往復動できるようになっている
。該ノズルは図示しない圧縮機でクリームはんだ１４を
マスク内に供給するものである。符号１５は切断機であ
り、送られてきた長尺のフレキ基板を一定間隔て切断す
るものである。The mask 6 of the cream solder printing device has a cylindrical shape, and the mask hole 7 is located at the same position as the printing location 4 of the flexible board l.
is drilled. Also, on both sides of the mask, there are sprocket holes 8 with the same pitch as the sprocket holes 5 on the flexible board.
is drilled. Inside the mask 6 is a cylindrical squeegee 9.
is installed. The squeegee is made of rubber and rotates as shown by the arrow by power (not shown). Also, use the squeegee 9 to sandwich the mask 6 with the feed roller lO.
is installed. The squeegee 9 is formed with sprocket pieces 11 having the same pitch as the sprocket holes of the flexible board, and the feed roller 10 is provided with sprocket grooves 12 having the same pitch. A nozzle 13, which is a cream solder supply device, is inserted into the mask 6, and is capable of reciprocating in the direction indicated by the arrow. The nozzle supplies cream solder 14 into the mask using a compressor (not shown). Reference numeral 15 is a cutting machine that cuts the long flexible substrate sent to it at regular intervals.
次にもう一つの発明となるクリームはんだの印刷方法に
ついて説明する。Next, a method of printing cream solder, which is another invention, will be explained.
先ずノズル１３を矢印Ａ方向に移動させてクリームはん
だ１４をスキージ９上に均一に塗布する。First, the nozzle 13 is moved in the direction of arrow A to uniformly apply the cream solder 14 onto the squeegee 9.
そしてマスク６のマスク穴７と、該マスク穴で印刷すべ
きフレキ基板ｌの印刷箇所４との位置合わせを行う。そ
の後、スキージ９を回転させると、スキージのスプロケ
ット片１１がマスクの送り穴８、フレキ基板のスプロケ
ット穴５および送りローラのスプロケット溝１２に入り
、マスク６を回転させるとともにフレキ基板を矢印Ｂ方
向に走行させ、さらに送りローラ１０を回転させる。こ
の時、スキージ９上に流出させられたクリームはんだ１
４はスキージの回転にともなってスキージとマスク６０
間に入り込み、スキージで押されてマスク穴７に充填さ
れる。マスク穴に充填されたクリームはんだは、マスク
穴と接触している印刷箇所に付着する。そしてマスクが
さらに回転してマスク穴とフレキ基板が離れると、クリ
ームはんだはフレキ基板の印刷箇所に残るものである。Then, the mask hole 7 of the mask 6 and the printing location 4 of the flexible substrate 1 to be printed using the mask hole are aligned. Thereafter, when the squeegee 9 is rotated, the sprocket piece 11 of the squeegee enters the feed hole 8 of the mask, the sprocket hole 5 of the flexible board, and the sprocket groove 12 of the feed roller, rotating the mask 6 and moving the flexible board in the direction of arrow B. It is run, and the feed roller 10 is further rotated. At this time, the cream solder 1 spilled onto the squeegee 9
4 is the squeegee and mask 60 as the squeegee rotates.
The mask hole 7 is filled by being pushed with a squeegee. The cream solder filled in the mask holes adheres to the printed parts that are in contact with the mask holes. When the mask is further rotated and the mask hole and the flexible substrate are separated, the cream solder remains on the printed portion of the flexible substrate.
ノズル１３はマスク内のクリームはんだの残量によって
適宜、適所に適当量流出させることにより常に一定の印
刷状態を保つことができる。The nozzle 13 can maintain a constant printing state at all times by discharging an appropriate amount of cream solder to an appropriate location depending on the amount of cream solder remaining in the mask.
クリームはんだが印刷箇所に塗布されたフレキ基板は一
つのパターン毎に切断機１５で切断してからその後の部
品搭載・リフロー等の処理を行ってもよいし、或は長尺
のまま、その後の処理を行うこともできる。The flexible circuit board with cream solder applied to the printed areas may be cut pattern by pattern using the cutting machine 15 and then subjected to processing such as mounting parts and reflowing, or it may be left as a long piece for subsequent processing. Processing can also be performed.
本発明によれば、非常に柔軟性のあるフレキ基板であっ
てもフレキ基板をいちいち治具に固定する必要がないた
め、生産性は著しく向上するものであり、またフレキ基
板とマスクの位置合わせも最初の位置合わせを行うたけ
て以後位置合わせをしなくとも正確な印刷が連続して行
えるという、従来にない優れた効果を奏することができ
る。According to the present invention, there is no need to fix each flexible substrate to a jig even if the flexible substrate is extremely flexible, so productivity is significantly improved. It is also possible to achieve an unprecedented and excellent effect in that accurate printing can be performed continuously even after the initial alignment is performed without any further alignment.
第１図は本発明のクリームはんだの印刷Ｈ置の斜視図、
第２図は同正面断面図、第３図は第２図■−■線断面図
、第４図はアンコイラ−１切断機が付設された正面断面
図である。
ｌ・・・フレキ基板 ６・・・円筒状のマスク ７・・
・マスクの穴 ９・・・スキージ １３・・・ノズル
１４・・・クリームはんだFIG. 1 is a perspective view of the printing position H of the cream solder of the present invention;
FIG. 2 is a front sectional view of the same, FIG. 3 is a sectional view taken along the line ■--■ in FIG. 2, and FIG. 4 is a front sectional view with an uncoiler-1 cutting machine attached. l...Flexible board 6...Cylindrical mask 7...
・Mask hole 9... Squeegee 13... Nozzle
14...Cream solder
Claims (2)
に設置された円柱状のスキージ；マスク内に設置された
クリームはんだ供給装置；前記スキージの下部に設置さ
れた送りローラ；から構成されていることを特徴とする
クリームはんだの印刷装置。(1) A cylindrical mask with predetermined holes drilled; a cylindrical squeegee installed inside the mask; a cream solder supply device installed inside the mask; a feed roller installed at the bottom of the squeegee; A cream solder printing device comprising:
とともにマスクの内側にクリーム半田を供給し、該クリ
ームはんだをマスク内に置かれたスキージで押圧するこ
とにより、マスクの穴からクリームはんだを押出してス
キージとマスクの接触面の反対側を走行するプリント基
板にクリームはんだを印刷することを特徴とするクリー
ムはんだの印刷方法(2) By rotating a cylindrical mask with predetermined holes, supplying cream solder to the inside of the mask, and pressing the cream solder with a squeegee placed inside the mask, the cream solder is removed from the holes in the mask. A cream solder printing method characterized by extruding cream solder and printing the cream solder on a printed circuit board running on the opposite side of the contact surface of the squeegee and mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24269890A JPH04123486A (en) | 1990-09-14 | 1990-09-14 | Cream solder printing apparatus and its preparation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24269890A JPH04123486A (en) | 1990-09-14 | 1990-09-14 | Cream solder printing apparatus and its preparation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04123486A true JPH04123486A (en) | 1992-04-23 |
Family
ID=17092916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24269890A Pending JPH04123486A (en) | 1990-09-14 | 1990-09-14 | Cream solder printing apparatus and its preparation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04123486A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010076149A (en) * | 2008-09-24 | 2010-04-08 | Dainippon Printing Co Ltd | Printer |
| CN103568502A (en) * | 2013-08-22 | 2014-02-12 | 张金春 | Supercapacitor and lithium battery electrode printing and coating device and printing process thereof |
-
1990
- 1990-09-14 JP JP24269890A patent/JPH04123486A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010076149A (en) * | 2008-09-24 | 2010-04-08 | Dainippon Printing Co Ltd | Printer |
| CN103568502A (en) * | 2013-08-22 | 2014-02-12 | 张金春 | Supercapacitor and lithium battery electrode printing and coating device and printing process thereof |
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