JPH01130897A - Film for feeding solder and its production - Google Patents
Film for feeding solder and its productionInfo
- Publication number
- JPH01130897A JPH01130897A JP62289921A JP28992187A JPH01130897A JP H01130897 A JPH01130897 A JP H01130897A JP 62289921 A JP62289921 A JP 62289921A JP 28992187 A JP28992187 A JP 28992187A JP H01130897 A JPH01130897 A JP H01130897A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hole
- holes
- resin film
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title description 6
- 239000011347 resin Substances 0.000 claims abstract description 17
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 239000006071 cream Substances 0.000 abstract description 8
- 238000005476 soldering Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/731—Location prior to the connecting process
- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
- H01L2224/73104—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子装置等に使用されるパッケージの半田付
けに用いる物とその製造方法に関し、特に微細なピッチ
の表面実装の半田供給用フィルムとその製造方法に関す
る。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a product used for soldering packages used in electronic devices and the like, and a method for manufacturing the same, and in particular to a solder supply film for surface mounting with a fine pitch. and its manufacturing method.
従来、この種の表面実装の半田付けは、第４図（ａ）に
示すように、基板２１上の導体回路２２へ、（ｂ）に示
すように、スクリーン２３、スキージ２４により印刷す
る半田供給方法により半田クリーム２５を供給し、（ｃ
）に示すように、電子部品２６を前記半田クリーム２５
上にパッド２７が重なる様に乗せで、加熱リフローして
洗浄すると、（ｄ）に示すように、前記半田クリーム２
５は半田２８に変わり、完了する。Conventionally, this type of surface mount soldering involves printing solder onto a conductor circuit 22 on a board 21 as shown in FIG. 4(a) and using a screen 23 and a squeegee 24 as shown in FIG. Supplying solder cream 25 by the method (c
), the electronic component 26 is coated with the solder cream 25.
When the pad 27 is placed on top of the pad 27 and heated and reflowed for cleaning, the solder cream 2 is removed as shown in (d).
5 changes to solder 28 and is completed.
上述した従来の表面実装の半田付けでは、導体回路及び
パッドのピッチが微細に成ると、半田クリームの印刷が
かすれて困難になるため適しないという欠点がある。The above-mentioned conventional surface mount soldering has the disadvantage that it is not suitable when the pitch of the conductor circuit and pad becomes fine because printing of the solder cream becomes blurred and difficult.
本発明の半田供給用フィルムは、所望の位置にスルーホ
ールを有し特定の溶剤に溶ける樹脂フィルムと前記スル
ーホール部に充填された半田より成ることを特徴とし、
かつその製造方法は、樹脂フィルムのスルーホールと同
一の位置で、同一の数で、かつ前記スルーホールより大
きい径の凹み穴を有する治具ベースに、スルーホールを
有する樹脂フィルムを重ねる手段と、スルーホールに半
田ボールを入れる手段と、樹脂フィルムのスルーホール
と同一の位置で、同一の数で、かつ前記スルーホールよ
り大きい径の凹み穴を有し、かつ前記治具ベースに重な
る押え治具を乗せて前記半田ボールをつぶす手段とから
構成されたことを特徴としている。The solder supply film of the present invention is characterized by comprising a resin film having through holes at desired positions and soluble in a specific solvent, and solder filled in the through holes,
And the manufacturing method includes: a means for stacking a resin film having through holes on a jig base having recessed holes at the same position, in the same number, and with a larger diameter than the through holes in the resin film; a means for inserting a solder ball into the through hole, and a holding jig having concave holes at the same position, in the same number, and with a larger diameter than the through holes of the resin film, and overlapping with the jig base. and means for crushing the solder ball by placing the solder ball on the solder ball.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of an embodiment of the present invention.
本発明の半田供給用フィルム１０は所望の位置にスルー
ホールを有した樹脂フィルム本体１と前記スルーホール
部に充填され、かつリベットのように前記樹脂フィルム
本体１に固定される半田２より成り、前記樹脂フィルム
本体１は例えば、アクリル系樹脂からなり、特定の溶剤
、例えば、メチルエチルケトンに溶ける。The solder supply film 10 of the present invention consists of a resin film body 1 having through holes at desired positions, and solder 2 filled in the through holes and fixed to the resin film body 1 like a rivet. The resin film body 1 is made of, for example, an acrylic resin, and is soluble in a specific solvent, such as methyl ethyl ketone.
第２図は本発明の一実施例の製造方法を示す縦断面図で
ある。（ａ）に示すように、凹み穴３を有する治具４に
、スルーホール５が前記凹み穴３に合うように樹脂フィ
ルム本体１を重ねて、次に（ｂ）に示すように、スルー
ホール５に前記スルーホール５部の体積より大きい半田
ボール６を入れ、次に（ｃ）に示すように、治具４の凹
み穴３と同じ穴７を有する押え治具８を、凹み穴７が前
記スルーホール５や凹み穴３に合うように重ねて押さえ
つける。治具４と治具８を外すことにより第１図に示す
ような半田供給用フィルムが完成する。FIG. 2 is a longitudinal sectional view showing a manufacturing method according to an embodiment of the present invention. As shown in (a), the resin film body 1 is stacked on a jig 4 having a recessed hole 3 so that the through hole 5 matches the recessed hole 3, and then as shown in (b), the through hole is A solder ball 6 larger than the volume of the through hole 5 is inserted into the through hole 5, and then, as shown in (c), a holding jig 8 having the same hole 7 as the recessed hole 3 of the jig 4 is inserted. They are stacked and pressed so that they fit into the through holes 5 and recessed holes 3. By removing the jig 4 and the jig 8, a solder supply film as shown in FIG. 1 is completed.
第３図は本発明の一実施例を用いる半田付けを示す縦断
面図である。（ａ）に示すように、基板 。FIG. 3 is a longitudinal sectional view showing soldering using an embodiment of the present invention. As shown in (a), the substrate.
１１上の導体回路１２に半田２が合うように半田供給用
フィルム１０を重ねて、更に、電子部品１３を半田２に
パッド１４が合うように乗せ、（ｂ）に示すように、加
熱リフローして半田付けして、（Ｃ）に示すように、樹
脂フィルムｌを特定の溶剤で溶かして取り除き、完了す
る。樹脂フィルム１が例えば、アクリル系樹脂の時、特
定の溶剤としては、例えば、メチルエチルケトンが用い
られる。本発明の半田供給用フィルムは、基板への電子
部品の半田付けについて説明したが、基板及び電子部品
への予備半田にも用いることが可能である。The solder supply film 10 is placed on top of the solder supply film 10 so that the solder 2 matches the conductor circuit 12 on the top 11, and then the electronic component 13 is placed so that the pad 14 matches the solder 2, and as shown in (b), heat reflow is performed. Then, as shown in (C), the resin film 1 is dissolved and removed with a specific solvent to complete the process. When the resin film 1 is made of acrylic resin, for example, methyl ethyl ketone is used as the specific solvent. Although the solder supply film of the present invention has been described for soldering electronic components to a board, it can also be used for preliminary soldering to a board and electronic components.
本発明の半田供給用フィルムは、半田クリームの印刷時
のかすれによる半田量のバラツキを少なくでき、流動性
の半田クリームが無くすことで取扱いが容易になる効果
がある。The solder supply film of the present invention has the effect of reducing variations in the amount of solder due to blurring of the solder cream during printing, and facilitates handling by eliminating fluid solder cream.
第１図は本発明の一実施例を示す縦断面、第２図は本発
明の一実施例の製造方法を示す縦断面、第３図は本発明
の一実施例を用いる半田付けを示す縦断面、第４図は従
来の一例を示す断面図である。
１・・・・・・樹脂フィルム本体、２，２８・・・・・
・半田、３．７・・・・・・凹み穴、４・・・・・・治
具、５・・・・・・スルーホール、６・・・・・・半田
ボール、８・・・・・・押え治具、１０・・・・・・半
田供給用フィルム、１１．２１・・・・・・基板、１２
．２２・・・・・・導体回路、１３，２６・・・・・・
電子部品、１４．２７・・・・・・パッド、２３・・・
・・・スクリーン、２４・・・・・・スキージ、２５・
・・・・・半田クリーム。
代理人 弁理士 内 原 音
悄ｆ図
第２図
躬３図FIG. 1 is a longitudinal section showing an embodiment of the present invention, FIG. 2 is a longitudinal section showing a manufacturing method of an embodiment of the invention, and FIG. 3 is a longitudinal section showing soldering using an embodiment of the invention. FIG. 4 is a sectional view showing an example of the conventional method. 1... Resin film body, 2, 28...
・Solder, 3.7... Recessed hole, 4... Jig, 5... Through hole, 6... Solder ball, 8... ...Press jig, 10... Solder supply film, 11.21... Board, 12
．． 22... Conductor circuit, 13, 26...
Electronic parts, 14.27...Pad, 23...
... Screen, 24 ... Squeegee, 25.
...Solder cream. Agent Patent Attorney Otohara Uchihara Figure 2 Figure 3
Claims (2)
ける樹脂フィルムと少なくとも前記スルーホール部に充
填された半田より成ることを特徴とする半田供給用フィ
ルム。(1) A solder supply film comprising a resin film having through holes at desired positions and soluble in a specific solvent, and solder filling at least the through holes.
一の数で、かつ前記スルーホールより大きい径の凹み穴
を有する治具ベースに、スルーホールを有する樹脂フィ
ルムを重ねる手段と、スルーホールに半田ボールを入れ
る手段と、樹脂フィルムのスルーホールと同一の位置で
、同一の数で、かつ前記スルーホールより大きい径の凹
み穴を有し、かつ前記治具ベースに重なる押え治具を乗
せて前記半田ボールをつぶす手段とから構成されたこと
を特徴とする半田供給用フィルム製造方法。(2) means for stacking a resin film having through holes on a jig base having recessed holes in the same position, in the same number, and with a larger diameter than the through holes in the resin film; A means for inserting the solder balls, and a holding jig having recessed holes at the same position, the same number, and a diameter larger than the through holes of the resin film, and overlapping with the jig base. and a means for crushing the solder balls.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62289921A JP2551053B2 (en) | 1987-11-16 | 1987-11-16 | Film for supplying solder and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62289921A JP2551053B2 (en) | 1987-11-16 | 1987-11-16 | Film for supplying solder and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01130897A true JPH01130897A (en) | 1989-05-23 |
| JP2551053B2 JP2551053B2 (en) | 1996-11-06 |
Family
ID=17749489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62289921A Expired - Fee Related JP2551053B2 (en) | 1987-11-16 | 1987-11-16 | Film for supplying solder and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2551053B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0673188A1 (en) * | 1994-03-15 | 1995-09-20 | Siemens Nixdorf Informationssysteme AG | Belt for providing solder depots for soldering components on a printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57189696U (en) * | 1981-05-28 | 1982-12-01 | ||
| JPS5849473U (en) * | 1981-09-29 | 1983-04-04 | 富士通株式会社 | Ring solder sheet for soldering terminal pins on printed circuit boards |
| JPS61172697A (en) * | 1985-01-28 | 1986-08-04 | Victor Co Of Japan Ltd | Solder assemblage |
| JPS63211655A (en) * | 1987-02-27 | 1988-09-02 | Hitachi Ltd | Solder-buried resist sheet |
-
1987
- 1987-11-16 JP JP62289921A patent/JP2551053B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57189696U (en) * | 1981-05-28 | 1982-12-01 | ||
| JPS5849473U (en) * | 1981-09-29 | 1983-04-04 | 富士通株式会社 | Ring solder sheet for soldering terminal pins on printed circuit boards |
| JPS61172697A (en) * | 1985-01-28 | 1986-08-04 | Victor Co Of Japan Ltd | Solder assemblage |
| JPS63211655A (en) * | 1987-02-27 | 1988-09-02 | Hitachi Ltd | Solder-buried resist sheet |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0673188A1 (en) * | 1994-03-15 | 1995-09-20 | Siemens Nixdorf Informationssysteme AG | Belt for providing solder depots for soldering components on a printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2551053B2 (en) | 1996-11-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |