JPS61238465A - Creamy solder coating equipment - Google Patents

Creamy solder coating equipment

Info

Publication number
JPS61238465A
JPS61238465A JP8082185A JP8082185A JPS61238465A JP S61238465 A JPS61238465 A JP S61238465A JP 8082185 A JP8082185 A JP 8082185A JP 8082185 A JP8082185 A JP 8082185A JP S61238465 A JPS61238465 A JP S61238465A
Authority
JP
Japan
Prior art keywords
solder
electronic circuit
circuit board
metal strip
screen printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8082185A
Other languages
Japanese (ja)
Inventor
Toshio Nagase
長瀬 敏雄
Yukio Fujigaya
藤ケ谷 行男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP8082185A priority Critical patent/JPS61238465A/en
Publication of JPS61238465A publication Critical patent/JPS61238465A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Abstract

PURPOSE:To enable the soldering on electronic circuit board surely in short time of the adequate quantity of solder even for the minute shaped pattern by using both the solder coating mechanism in a screen printing method and the air pressure mechanism in a dispenser method. CONSTITUTION:A notched hole 6 is provided on the continuous metal strip 1 having flexibility and the solder 5 filled up in the notched hole 6 by the coating mechanism 2 is adhered with its dislocation on the electronic circuit board 4 by the air jet when the metal strip 1 comes under the air jet mechanism 3 with turning. By using both the solder coating mechanism in the screen printing method and the air pressure mechanism in the dispenser method like this the adequate solder quantity can be coated on the electronic circuit board surely and yet in short time even for the minute shaped pattern.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、電子回路板組立に用いるクリームはんだ塗布
装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cream solder applicator used for assembling electronic circuit boards.

〔従来の技術〕[Conventional technology]

従来のクリームはんだ塗布装置としては第2図に示すよ
うなスクリーン印刷装置および第3図に示すようなディ
スペンサ装置とがある。
Conventional cream solder applicators include a screen printing device as shown in FIG. 2 and a dispenser device as shown in FIG. 3.

第2図に示すスクリーン印刷装置は、クリームはんだ5
をはんだ塗布1110112によりスクリーンの切欠穴
6を通過させて電子回路板4に塗布するものであり、第
3図に示すディスペンサ装置は、クリームはんだ5を空
気噴出機構3で、噴出させ電子回路板4に塗布するもの
である。
The screen printing device shown in FIG.
The solder paste 1110112 is applied to the electronic circuit board 4 by passing through the cutout hole 6 of the screen, and the dispenser device shown in FIG. It is applied to

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

このうち、第2図に示すようなスクリーン印刷装置にお
いては、スクリーン版の厚さにより、はんだの塗布量を
調節する方式であるため、塗布パターンをあまり小さく
できない欠点がある。また、印刷面に突起物があっては
印刷できないため、他の部品を搭載する前に印刷しなけ
ればならない欠点がある。
Among these, in the screen printing apparatus shown in FIG. 2, the amount of solder applied is adjusted depending on the thickness of the screen plate, so there is a drawback that the applied pattern cannot be made very small. Furthermore, since it is impossible to print if there are protrusions on the printing surface, there is a drawback that printing must be performed before mounting other parts.

また、第3図に示すようなディスペンサー装置において
は、針状の吐出口からクリームはんだを空気圧にて吐出
させる方式であるため、印刷方式に比べて周囲の突起物
の影響をうけにくい利点があるが、一方、一点づつ吐出
させていくため塗布時間が長くかかることおよび吐出景
を一定に調節しにくいことなどの欠点がある。
In addition, the dispenser device shown in Figure 3 uses a method that uses air pressure to discharge cream solder from a needle-shaped discharge port, so it has the advantage that it is less susceptible to the effects of surrounding protrusions than the printing method. However, on the other hand, there are drawbacks such as the long coating time required for discharging one point at a time and the difficulty in adjusting the discharge pattern to a constant level.

〔問題点を解決するための手段〕[Means for solving problems]

本発明のクリームはんだ塗布装置は、複数個の切欠穴を
有する連続した可撓性のある金属帯と、この金属帯に密
接してクリームはんだを付着させるはんだ塗布機構と、
金属帯に付着したクリームはんだを離脱させる空気噴出
機構とを有している。
The cream solder applicator of the present invention includes: a continuous flexible metal band having a plurality of notched holes; a solder applicator mechanism for closely adhering cream solder to the metal band;
It has an air jetting mechanism that releases cream solder adhering to the metal strip.

〔実施例〕〔Example〕

次に、本発明の実施例について、図面を参照して説明す
る。
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を示す縦断面図である。FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention.

第1図に示すクリームはんだ塗布装置において、金属帯
1には切欠穴6があり、塗布機構2により切欠穴6に充
填されたけんだ5は金属帯1が回転して空気噴出機構3
の下にきたとき、空気噴出により電子回路板4に転移付
着される。金属帯1の切欠穴6はたとえば第4図に示す
ように配置しておけば、電子回路板4に同様な形状では
んだを塗布することができる。
In the cream solder applicator shown in FIG. 1, a metal strip 1 has a cutout hole 6, and the solder 5 filled in the cutout hole 6 by the applicator mechanism 2 is transferred to an air jet mechanism 3 by rotation of the metal strip 1.
When it reaches the bottom, it is transferred and adhered to the electronic circuit board 4 by the air jet. If the cutout holes 6 of the metal strip 1 are arranged as shown in FIG. 4, for example, it is possible to apply solder to the electronic circuit board 4 in a similar shape.

〔発明の効果〕〔Effect of the invention〕

本発明のクリームはんだ塗布装置は、スクリーン印刷方
式におけるはんだ塗布機構と、ディスペンサ一方式にお
ける空気加圧機溝とを併用することによシ、微細形状パ
ターンに対しても適切なはんだ量を確実にしかも短時間
で電子回路板に塗着できるという効果がある。
The cream solder applicator of the present invention uses a solder applicator mechanism based on a screen printing method in combination with an air pressure machine groove in a single dispenser type, thereby ensuring an appropriate amount of solder even for finely shaped patterns. It has the effect of being able to be applied to electronic circuit boards in a short time.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す縦断面図、第2図は従
来のスクリーン印刷装置の一例を示す縦断面図、第3図
は従来のディスペンサー装置の一例を示す縦断面図、第
4図は第1図に示す実施例における金属帯の切欠式配置
図である。
FIG. 1 is a longitudinal sectional view showing an example of the present invention, FIG. 2 is a longitudinal sectional view showing an example of a conventional screen printing device, and FIG. 3 is a longitudinal sectional view showing an example of a conventional dispenser device. FIG. 4 is a cutaway layout diagram of the metal strips in the embodiment shown in FIG. 1.

Claims (1)

【特許請求の範囲】[Claims]  複数個の切欠穴を有する連続した可撓性の金属帯と、
前記金属帯に密接してクリームはんだを付着させるはん
だ塗布機構と、前記金属帯の切欠穴に付着したクリーム
はんだを離脱させる空気噴出機構とを含むことを特徴と
するクリームはんだ塗布装置。
a continuous flexible metal strip having a plurality of cut holes;
A cream solder applicator comprising: a solder applicator that applies cream solder in close contact with the metal band; and an air jet mechanism that removes the cream solder that adheres to the cutout hole of the metal band.
JP8082185A 1985-04-16 1985-04-16 Creamy solder coating equipment Pending JPS61238465A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8082185A JPS61238465A (en) 1985-04-16 1985-04-16 Creamy solder coating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8082185A JPS61238465A (en) 1985-04-16 1985-04-16 Creamy solder coating equipment

Publications (1)

Publication Number Publication Date
JPS61238465A true JPS61238465A (en) 1986-10-23

Family

ID=13729099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8082185A Pending JPS61238465A (en) 1985-04-16 1985-04-16 Creamy solder coating equipment

Country Status (1)

Country Link
JP (1) JPS61238465A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999041081A1 (en) * 1998-02-13 1999-08-19 Stork Textile Printing Group B.V. Device and method for applying a medium to a substrate, system having a plurality of such devices, and use of such device, method and system
EP1002645A1 (en) * 1998-11-20 2000-05-24 Gomes Technology S.p.A. A process and device for realising silk screen prints on objects

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999041081A1 (en) * 1998-02-13 1999-08-19 Stork Textile Printing Group B.V. Device and method for applying a medium to a substrate, system having a plurality of such devices, and use of such device, method and system
EP1002645A1 (en) * 1998-11-20 2000-05-24 Gomes Technology S.p.A. A process and device for realising silk screen prints on objects

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