JPS62247538A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS62247538A
JPS62247538A JP62001601A JP160187A JPS62247538A JP S62247538 A JPS62247538 A JP S62247538A JP 62001601 A JP62001601 A JP 62001601A JP 160187 A JP160187 A JP 160187A JP S62247538 A JPS62247538 A JP S62247538A
Authority
JP
Japan
Prior art keywords
bonding
wire
load
cam
capillary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62001601A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6350856B2 (enrdf_load_stackoverflow
Inventor
Yuzo Taniguchi
雄三 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62001601A priority Critical patent/JPS62247538A/ja
Publication of JPS62247538A publication Critical patent/JPS62247538A/ja
Publication of JPS6350856B2 publication Critical patent/JPS6350856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP62001601A 1987-01-09 1987-01-09 ワイヤボンデイング装置 Granted JPS62247538A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62001601A JPS62247538A (ja) 1987-01-09 1987-01-09 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62001601A JPS62247538A (ja) 1987-01-09 1987-01-09 ワイヤボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP730478A Division JPS54101667A (en) 1978-01-27 1978-01-27 Wire bonding unit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1232791A Division JPH02119149A (ja) 1989-09-11 1989-09-11 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPS62247538A true JPS62247538A (ja) 1987-10-28
JPS6350856B2 JPS6350856B2 (enrdf_load_stackoverflow) 1988-10-12

Family

ID=11506019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62001601A Granted JPS62247538A (ja) 1987-01-09 1987-01-09 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS62247538A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02231736A (ja) * 1989-03-06 1990-09-13 Shinkawa Ltd ワイヤボンデイング方法
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279863U (enrdf_load_stackoverflow) * 1975-12-12 1977-06-14
JPS5345970A (en) * 1976-10-07 1978-04-25 Tesu Kk Apparatus for bonding

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279863U (enrdf_load_stackoverflow) * 1975-12-12 1977-06-14
JPS5345970A (en) * 1976-10-07 1978-04-25 Tesu Kk Apparatus for bonding

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02231736A (ja) * 1989-03-06 1990-09-13 Shinkawa Ltd ワイヤボンデイング方法
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator

Also Published As

Publication number Publication date
JPS6350856B2 (enrdf_load_stackoverflow) 1988-10-12

Similar Documents

Publication Publication Date Title
US4563964A (en) Sewing machine drive control
JPS62247538A (ja) ワイヤボンデイング装置
JP2736914B2 (ja) ワイヤボンデイング方法
US5775567A (en) Apparatus for wirebonding using a tubular piezoelectric ultrasonic transducer
KR960002769B1 (ko) 와이어 본딩방법 및 장치
JPH02119149A (ja) ワイヤボンディング装置
JP2860650B2 (ja) ワイヤボンディング方法
JPH0783039B2 (ja) ワイヤボンデイング装置
JPS6363980B2 (enrdf_load_stackoverflow)
JPH0232391B2 (ja) Shishunuimishinnosokudoseigyosochi
US3940047A (en) Bonding apparatus utilizing pivotally mounted bonding arm
JPS6113377B2 (enrdf_load_stackoverflow)
JP2940259B2 (ja) ボンディング方法
JP3221191B2 (ja) ボンディング装置及びボンディング方法
JP3022209B2 (ja) ワイヤボンディング方法
EP0227132A2 (en) Sewing machine with control device for the needle driving motor
JP3724948B2 (ja) モータ類の位置制御時の加重制御方法
JPH0779113B2 (ja) ワイヤボンディング装置
JPS633895A (ja) ミシン
JPS6364274B2 (enrdf_load_stackoverflow)
JPH0693471B2 (ja) ワイヤボンデイング装置
JP2725102B2 (ja) ワイヤボンディング方法
JPH0153505B2 (enrdf_load_stackoverflow)
JPH02241396A (ja) フレキシブルディスクドライブ等のステッピングモータ駆動回路
JPS6244293A (ja) ミシン制御装置