JPS6224502B2 - - Google Patents

Info

Publication number
JPS6224502B2
JPS6224502B2 JP58051253A JP5125383A JPS6224502B2 JP S6224502 B2 JPS6224502 B2 JP S6224502B2 JP 58051253 A JP58051253 A JP 58051253A JP 5125383 A JP5125383 A JP 5125383A JP S6224502 B2 JPS6224502 B2 JP S6224502B2
Authority
JP
Japan
Prior art keywords
vacuum
tank
sample
vacuum chamber
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58051253A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59177367A (ja
Inventor
Hiroshi Saeki
Tanejiro Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP5125383A priority Critical patent/JPS59177367A/ja
Publication of JPS59177367A publication Critical patent/JPS59177367A/ja
Publication of JPS6224502B2 publication Critical patent/JPS6224502B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP5125383A 1983-03-25 1983-03-25 試料搬送機構を有する真空蒸着装置 Granted JPS59177367A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5125383A JPS59177367A (ja) 1983-03-25 1983-03-25 試料搬送機構を有する真空蒸着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5125383A JPS59177367A (ja) 1983-03-25 1983-03-25 試料搬送機構を有する真空蒸着装置

Publications (2)

Publication Number Publication Date
JPS59177367A JPS59177367A (ja) 1984-10-08
JPS6224502B2 true JPS6224502B2 (US07122547-20061017-C00273.png) 1987-05-28

Family

ID=12881780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5125383A Granted JPS59177367A (ja) 1983-03-25 1983-03-25 試料搬送機構を有する真空蒸着装置

Country Status (1)

Country Link
JP (1) JPS59177367A (US07122547-20061017-C00273.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101011U (US07122547-20061017-C00273.png) * 1990-02-01 1991-10-22

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4684414B2 (ja) * 2000-12-27 2011-05-18 株式会社アドバンテスト 蒸着装置、蒸着方法、電子ビーム露光装置、偏向装置及び偏向装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526047B2 (US07122547-20061017-C00273.png) * 1976-05-06 1980-07-10
JPS5698478A (en) * 1980-01-08 1981-08-07 Toshiba Corp Vacuum treating device
JPS5763678A (en) * 1980-10-03 1982-04-17 Hitachi Ltd Sputtering device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58696Y2 (ja) * 1978-08-07 1983-01-07 株式会社徳田製作所 試料処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5526047B2 (US07122547-20061017-C00273.png) * 1976-05-06 1980-07-10
JPS5698478A (en) * 1980-01-08 1981-08-07 Toshiba Corp Vacuum treating device
JPS5763678A (en) * 1980-10-03 1982-04-17 Hitachi Ltd Sputtering device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03101011U (US07122547-20061017-C00273.png) * 1990-02-01 1991-10-22

Also Published As

Publication number Publication date
JPS59177367A (ja) 1984-10-08

Similar Documents

Publication Publication Date Title
DE69525881T2 (de) Hochgeschwidigkeitsbewegung für Arbeitsstücke in Vakuum-Behandlung
US3968885A (en) Method and apparatus for handling workpieces
DE3650710T2 (de) System und Methode für Vakuum-Behandlung
DE3854270T2 (de) System zur chemischen abscheidung aus der dampfphase.
DE4210110C2 (de) Halbleitereinrichtung-Herstellungsvorrichtung und Verfahren zum Herstellen einer Halbleitereinrichtung
JPH0336735B2 (US07122547-20061017-C00273.png)
JPS6224502B2 (US07122547-20061017-C00273.png)
JPS6339741A (ja) 部品組付装置
US1338782A (en) Coating apparatus and method of coating
JPH02196441A (ja) ウェーハ搬送装置
JPS62996B2 (US07122547-20061017-C00273.png)
JPS609103B2 (ja) 連続スパッタ装置
JP2501687Y2 (ja) 基板交換装置
JPS63190338A (ja) ホルダ供給装置
JPS6015917A (ja) 分子線エピタキシ装置
JP2741552B2 (ja) イオンビーム加工装置および該装置の試料交換方法
JPS5935505B2 (ja) 半導体装置の製造装置
JPS6257377B2 (US07122547-20061017-C00273.png)
JPS609102B2 (ja) 連続真空処理装置
JP3264983B2 (ja) イオン注入装置
JPS6380455A (ja) 真空処理室装置
JPH0266932A (ja) 電解コンデンサの自動整列真空含浸方法及び装置
DE70484C (de) Schleifmaschine mit drehbarem Tisch zum Schleifen und Poliren von Tafelglas
JPH05290788A (ja) クランプ機構
JPH0823066B2 (ja) イオン注入装置