JPS62234301A - Manufacture of resistance circuit board - Google Patents
Manufacture of resistance circuit boardInfo
- Publication number
- JPS62234301A JPS62234301A JP7782086A JP7782086A JPS62234301A JP S62234301 A JPS62234301 A JP S62234301A JP 7782086 A JP7782086 A JP 7782086A JP 7782086 A JP7782086 A JP 7782086A JP S62234301 A JPS62234301 A JP S62234301A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- roughened
- circuit board
- plating
- resistance circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000007788 roughening Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000003513 alkali Substances 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 17
- 239000002245 particle Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はＰｔｓめっき法によりセラミック泰板上に抵抗
回路を形成する抵抗回路基板の製造法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing a resistor circuit board in which a resistor circuit is formed on a ceramic plate by Pts plating.
（従来の技術）
無１！績めつきにより絶縁基板上に直接抵抗体？少ない
工程でＭＪ密度に実装する方法が提案されている。(Conventional technology) No 1! Resistor directly on insulating substrate by plating? A method of mounting MJ density with fewer steps has been proposed.
（発明が解決しようとする問題点ン
無電解法によって絶縁基板上に直接抵抗体を形成する方
法は，大量学績，高密度化に通しているが，＋１！抵抗
が得られない、密層強度が弱いという問題がある。本発
明は高抵抗で密着強度に優れる抵抗回路基板の製造法ン
促供するものである。(Problems to be solved by the invention) Although the method of forming a resistor directly on an insulating substrate by an electroless method has led to mass production and high density, +1! There is a problem that the strength is weak.The present invention provides a method for manufacturing a resistive circuit board that has high resistance and excellent adhesion strength.
（問題点を解決するための手段ノ
アルミナセラミック基板を例えば４８０へ４９０℃の溶
融アルカリ中に２０分間浸槓することにより，ガラス質
だけでなく個々のアルミナ粒子を粗化し、表面積を粗化
前の基板の５へ２０倍に増加させる。(A means to solve the problem is to roughen not only the glass but also the individual alumina particles by immersing the alumina ceramic substrate in molten alkali at 480°C to 490°C for 20 minutes to increase the surface area before roughening.) of the substrate by a factor of 20 to 5.
第１図（ａｌはアルミナ基板の粗化前の断面形状を示し
、１はアルミナ粒子、２はガラス質、３は粗化アルミナ
粒子であり、第１ｕ（ｂｒは粗化後の断面形状ン示す。Figure 1 (al indicates the cross-sectional shape of the alumina substrate before roughening, 1 is the alumina particle, 2 is glassy, 3 is the roughened alumina particle, 1u (br is the cross-sectional shape after roughening) .
この表面形状によつてめっき皮膜の密着力を強化させ、
また無電解めっきＹ（１１５〜（１５，ｃａｎの範囲で
行なえば、粗化なし基板に比べてシート抵抗値７１．５
〜３倍増加させることができる。This surface shape strengthens the adhesion of the plating film,
In addition, if electroless plating is performed in the range of Y (115 to (15, can), the sheet resistance value will be 71.5 compared to a substrate without roughening.
It can be increased by ~3 times.
膜厚は重量法で曲［定した値である。The film thickness is a value determined by the gravimetric method.
第２図は、めっき抵抗体の（ａ）平面図、（ｂ）抵抗め
っき部の断面、（Ｃ）電極形成部分の形状乞模式的に示
したもので、４は粗化基板、５は抵抗めっき、６は銅め
っきＫよる電極である。Figure 2 schematically shows (a) a plan view of a plated resistor, (b) a cross section of a resistor plating part, and (C) the shape of an electrode forming part, where 4 is a roughened substrate, and 5 is a resistor. Plating 6 is an electrode made of copper plating K.
（作用）
粗化された表面は被雑な表面形状ンもち、めっき皮膜は
投錨効果によって強固な＠着力χ得る。また粗化基板上
のめつき皮膜はある膜厚範囲においては基板形状に沿っ
て析出しているので、抵抗体の長さ方向の笑効長さはみ
かけよりも長（なる。このため、粗化前基板の場合より
も抵抗が大きくなる。(Function) The roughened surface has a rough surface shape, and the plating film has a strong adhesion force due to the anchoring effect. In addition, the plating film on the roughened substrate is deposited along the substrate shape within a certain film thickness range, so the effective length of the resistor in the length direction is longer than it appears. The resistance is higher than that of the unprocessed substrate.
（実施例）
アルカリ粗化したアルミナセラミック基板を脱脂、感受
性化、活性化の各処理を施した後。(Example) After degreasing, sensitizing, and activating an alkali-roughened alumina ceramic substrate.
＃、′に解ニッケルめっき浴中に浸漬することによりて
、めっき皮膜を形成する。A plating film is formed by immersing # and ' in a decomposed nickel plating bath.
無電解ニッケルめっき浴の組成は次の通りである。The composition of the electroless nickel plating bath is as follows.
塩化ニッケル ３０ ｇ／１
次亜リンリントリウム １０ ｇ／ｌ
酢酸ナトリウム １０ ｇ／１
Ｆ４−１ ５ （ＨＣＪで調整）浴温
４の、６庇、８■
以上の条件でめっきし１こ場合、４０℃では２分から３
０分、６０℃では１分から５分、８０℃では３０秒から
１分の間のめっき時間で０．１５μｍからα５μｍの膜
厚のめ１き皮膜が得られ、シート抵抗値としては約１０
Ｓ２００Ω／が得られた。膜厚は重量法で測定。Nickel chloride 30 g/1 Hypophosphorous thorium 10 g/l Sodium acetate 10 g/1 F4-1 5 (adjusted with HCJ) Bath temperature
4, 6 eaves, 8■ If plating is performed under the above conditions, at 40℃ it will take 2 to 3 minutes.
A plating film with a thickness of 0.15 μm to α5 μm can be obtained with a plating time of 0 minutes, 1 minute to 5 minutes at 60°C, and 30 seconds to 1 minute at 80°C, and the sheet resistance value is approximately 10
S200Ω/ was obtained. Film thickness is measured gravimetrically.
同様の条件で粗化前アルミナセラミックス基板にめっき
した場合、Ｑ１５−μｍから０５μｍの膜厚のめっき皮
膜では約５へ２０Ω／しか得られなかった。こ八は粗化
基板上に形成した場合の１／！〜１／ｆｏである。When a pre-roughened alumina ceramic substrate was plated under similar conditions, a plating film with a thickness of Q15-05 μm only had a resistance of about 5 to 20 Ω/. This is 1/1 of that when formed on a roughened substrate! ~1/fo.
（発明の効果）
本方法によｎは、絶縁２！ｌ！板上に直媛密看力の強い
皮Ｐａを形成でき、また、皮膜を工（１１５μｍから［
１，５μｍの膜厚範囲で粗化なしＪｋ数上に形成し′ｒ
−場合の２倍から１０倍のシート抵抗が得られる。(Effect of the invention) According to this method, the insulation is 2! l! It is possible to form a skin Pa with strong direct adhesive force on the board, and it is also possible to form a film (from 115 μm to [
Formed on the Jk number without roughening in the film thickness range of 1.5μm
- A sheet resistance that is 2 to 10 times that of the - case can be obtained.
第１図（ａｔ （ｂｌはアルミナ奉板の断面図、第２図
【工抵抗回路基叛ン示すもので、（ａ）は平面図ｓ （
ｂ九（ｃｌは断面図である。
符号の説明
１ アルミナ粒子 ２ ガラス質
６ 粗化アルミナ粒子 ４ 粗化基板５ 抵抗めっき
６ 銅めっきによるｉ＆、他代理人升埋士
ＭＲｆＩ！Ａ 軍τ−：（α）Ｎ化前
（ｂ）粗化後筒２図 ５１氏抗力
・き６、銅鶴きｌ；よる電極
＝Figure 1 (at) is a cross-sectional view of the alumina plate, Figure 2 (a) is a plan view of the resistor circuit board, and (a) is a plan view of the alumina plate.
b9 (cl is a cross-sectional view. Explanation of symbols 1 Alumina particles 2 Glassy 6 Roughened alumina particles 4 Roughened substrate 5 Resistance plating 6 I & other agents by copper plating
MRfI! A Army τ-: (α) Before N conversion
(b) Figure 2 of the cylinder after roughening 51 drag force 6, copper crane l; electrode =
Claims (1)
において０．１５μｍから０．５μｍの範囲に抵抗導体
回路を無電解めっきにより形成することを特徴とする抵
抗回路基板の製造法。 ２、セラミック基板が、溶融したアルカリによって粗化
処理されたアルミナセラミック基板である特許請求範囲
第１項記載の抵抗回路基板の製造法。 ３、粗化基板の表面積が粗化前に比べて５倍から２０倍
になっていることを特徴とする特許請求第１項又は第２
項記載の抵抗回路基板の製造法。[Claims] 1. A resistance circuit characterized in that a resistance conductor circuit is formed on a roughened ceramic substrate by electroless plating to have a film thickness in the range of 0.15 μm to 0.5 μm as measured by gravimetric method. Substrate manufacturing method. 2. The method for manufacturing a resistance circuit board according to claim 1, wherein the ceramic substrate is an alumina ceramic substrate roughened with molten alkali. 3. Patent claim 1 or 2, characterized in that the surface area of the roughened substrate is 5 to 20 times larger than that before roughening.
2. Method for manufacturing a resistor circuit board as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7782086A JPS62234301A (en) | 1986-04-04 | 1986-04-04 | Manufacture of resistance circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7782086A JPS62234301A (en) | 1986-04-04 | 1986-04-04 | Manufacture of resistance circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62234301A true JPS62234301A (en) | 1987-10-14 |
Family
ID=13644671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7782086A Pending JPS62234301A (en) | 1986-04-04 | 1986-04-04 | Manufacture of resistance circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62234301A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01235291A (en) * | 1988-03-15 | 1989-09-20 | Matsushita Electric Works Ltd | Manufacture of ceramic circuit board with resistor |
| JPWO2005002303A1 (en) * | 2003-06-30 | 2006-11-24 | イビデン株式会社 | Printed wiring board |
-
1986
- 1986-04-04 JP JP7782086A patent/JPS62234301A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01235291A (en) * | 1988-03-15 | 1989-09-20 | Matsushita Electric Works Ltd | Manufacture of ceramic circuit board with resistor |
| JPWO2005002303A1 (en) * | 2003-06-30 | 2006-11-24 | イビデン株式会社 | Printed wiring board |
| JP4606329B2 (en) * | 2003-06-30 | 2011-01-05 | イビデン株式会社 | Printed wiring board |
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