JPH05343259A - Ceramic electronic component and its manufacture - Google Patents

Ceramic electronic component and its manufacture

Info

Publication number
JPH05343259A
JPH05343259A JP15218192A JP15218192A JPH05343259A JP H05343259 A JPH05343259 A JP H05343259A JP 15218192 A JP15218192 A JP 15218192A JP 15218192 A JP15218192 A JP 15218192A JP H05343259 A JPH05343259 A JP H05343259A
Authority
JP
Japan
Prior art keywords
electronic component
ceramic electronic
ceramic base
external electrode
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP15218192A
Other languages
Japanese (ja)
Inventor
Nobuo Kaihara
Takatsugu Nohara
Masaaki Taniguchi
伸男 海原
雅朗 谷口
啓継 野原
Original Assignee
Tdk Corp
ティーディーケイ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp, ティーディーケイ株式会社 filed Critical Tdk Corp
Priority to JP15218192A priority Critical patent/JPH05343259A/en
Publication of JPH05343259A publication Critical patent/JPH05343259A/en
Withdrawn legal-status Critical Current

Links

Abstract

(57) [Summary] [Purpose] To form an electroless plated film as an external electrode having a mechanism for bonding with a ceramic base without roughening the surface of the ceramic base. [Structure] Glass powder 5 is dispersed in electroless plated film 4 as an external electrode. By heat treatment after plating, the glass powder 5 is softened and comes into close contact with the ceramic base 2. As a result, the adhesion strength of the electroless plated film 4 can be increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a chip type electronic component such as a chip capacitor, a chip inductor and a chip thermistor, a disc capacitor, a PTC thermistor, a varistor, a ceramic filter and a resonator, as well as an LC composite component and a composite circuit. The present invention relates to a ceramic electronic component such as a component having a ceramic body as a main body and electrodes inside or on the surface thereof and a method for manufacturing the same.

[0002]

2. Description of the Related Art For example, an electroless plating film is formed as an external electrode of a ceramic electronic component such as a PTC thermistor. In forming this electroless plating film, a ceramic substrate and an external electrode are not used. In order to improve the adhesion to the electrolytic plating film, it was necessary to previously etch the surface of the ceramic base with an inorganic chemical to roughen it.

FIG. 3 shows such a conventional ceramic electronic component. The surface of the ceramic base 12 of the ceramic electronic component 11 has a rough surface 13 formed by etching in advance, and then an electroless plating film 14 as an external electrode. Are formed.

As described above, the surface of the ceramic base 12 is roughened before the formation of the electroless plating film 14 by simply forming the electroless plating film 14 as it is. This is a measure to prevent the electroless plating film 14, that is, the external electrode, from being easily peeled off because the adhesiveness is weak because it has no mechanism for bonding.

[0005]

In the conventional ceramic electronic component, since the ceramic base is roughened and the electroless plating film is formed on this surface, various problems occur due to the roughening. There's a problem.

For example, it is necessary to change the surface roughening conditions due to changes in the composition and sinterability of the ceramic base,
There is also a change in the performance of the etching solution with time, and further, there arise problems such as a change in the thickness of the ceramic base material and a characteristic deterioration due to the penetration of the etching solution into the ceramic base material.

The present invention has been made in consideration of the above problems. An electroless plating film as an external electrode is formed by providing a mechanism for bonding to a ceramic base without roughening the ceramic base. It is an object of the present invention to provide a ceramic electronic component and a method for manufacturing the same.

[0008]

In order to achieve the above object, the present invention is a ceramic electronic component having an external electrode made of an electroless plating film on the surface of a ceramic substrate, wherein glass powder is dispersed in the external electrode. It is characterized by that.

Another aspect of the present invention is characterized in that the electroless plated film is made of copper or nickel.

Further, another aspect of the present invention is characterized in that a metal film having excellent solder wettability is formed on the electroless plating film.

Still another aspect of the present invention is characterized in that the metal film excellent in solder wettability is made of any one of silver, tin and tin-lead alloy.

Still another aspect of the present invention is a method for manufacturing a ceramic electronic component having an external electrode made of an electroless plating film on the surface of a ceramic substrate, wherein glass powder is dispersed and formed as the electroless plating film, The ceramic base is heat-treated at a temperature equal to or higher than the softening point of glass.

[0013]

According to the structure of the present invention as set forth in claim 1, the glass powder is dispersed in the electroless plating film as the external electrode, whereby the adhesion to the ceramic base is enhanced without roughening the surface of the ceramic base. An electroless plated film can be formed.

According to the second aspect of the present invention, an excellent external electrode can be formed by using copper or nickel as the electroless plating film.

According to the third aspect of the present invention, by forming the metal film having excellent solder wettability on the electroless plated film, the external electrode having good solder wettability can be formed.

According to the structure of the present invention described in claim 4, an external electrode having good solder wettability is formed by selecting either silver, tin or tin-lead alloy as the metal film having excellent solder wettability. be able to.

According to the structure of the present invention described in claim 5, it is possible to manufacture a ceramic electronic component having an electroless plating film having improved adhesion to the ceramic base material without roughening the ceramic base material.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a first ceramic electronic component of the present invention.
FIG. 3 is a cross-sectional view showing an embodiment of the above, showing an example applied to a PTC thermistor. Example 1 Ceramic Electronic Component 1
Has a ceramic base 2 made of a barium titanate-based PTC material, and an electroless plating film 4 formed on the surface of the ceramic base 2 and having glass powder 5 dispersed therein as an external electrode.

As an example, an electroless nickel plating solution is used, and a softening point of 350 ° C. lead borosilicate-based particle size 0.2
Glass of μm was dispersed to form an electroless plating film 4 made of nickel and glass powder on the surface of the ceramic base 2. Subsequently, the ceramic base material 2 was heat-treated at about 400 ° C. for 2 hours to soften the glass powder existing at the interface of the ceramic base material 2 and form the electroless plating film 4 as an external electrode bonded to the ceramic base material. .

According to such an embodiment, the electroless plated film 4 in which the glass powder 5 is dispersed is formed on the ceramic substrate 2 as an external electrode, so that the ceramic substrate 2 is bonded to the electroless plated film 4. You will be able to have a working mechanism. Therefore, it is possible to form the electroless plating film 4 as an external electrode having improved adhesion to the ceramic base 2 without roughening the ceramic base 2.

Accordingly, it is possible to eliminate various inconveniences caused by roughening the ceramic base as in the conventional case. That is, it is possible to prevent the composition and sinterability of the ceramic base from fluctuating, to prevent the influence of the residual components of the etching solution, and to improve the problem of characteristic deterioration.

The ceramic electronic component 1 obtained by the embodiment of FIG. 1 was subjected to a peeling test, and the result was 0.5 kg.
The above values were obtained, and when the vertical tensile strength was measured, a value of 3 kg or more was obtained. These values are almost the same as those of the ceramic electronic component obtained by the conventional surface roughening, indicating that there is no practical problem even if the surface is not roughened.

FIG. 2 is a cross-sectional view showing a second embodiment of the present invention, which is excellent in solder wettability on the electroless plated film 4 of the ceramic electronic component 1 obtained in the first embodiment of FIG. 3 shows an example in which a metal film 6 such as silver, tin or a tin-lead alloy (solder) is formed. As a result, the same effect as that of the embodiment of FIG. 1 can be obtained, and in addition, an external electrode having particularly excellent solder wettability can be formed.

The glass powder 5 and the electroless plating film 4 in which the glass powder 5 is dispersed in each embodiment are not limited to specific materials, and other materials may be used. For example, electroless plating film 4
In addition to nickel shown in the examples, excellent copper can be used as an electrode material. Also, glass powder 5
As a material of lead borosilicate, if an electroless plating film made of a desired electrode material is plated and then heat-treated at a temperature according to the electrode material, as long as it has a softening point equal to or lower than this heat-treatment temperature. It is not limited to glass of system.

The heat treatment temperature is set to 400 ° C. or lower when an electroless plated film made of nickel is formed, and 600 when an electroless plated film made of copper is formed.
Set below ℃. By performing heat treatment after forming the electroless plated film in this way, the glass powder 5 softens and comes into close contact with the ceramic base 2. Therefore, the density strength of the electroless plated film 4 is high due to the anchor effect of the glass powder. Become.

Further, if the particle size of the glass powder 5 is too large, it will not be dispersed well, so if it is selected in the range of approximately 0.05 to 1.0 μm, it will be easily dispersed.

[0028]

As described above, according to the present invention, glass powder is dispersed in the electroless plating film as an external electrode formed on the ceramic base material, and the glass powder is bonded to the ceramic base material by heat treatment. Since the electroless plating film having a mechanism for bonding with the ceramic base can be formed without roughening the ceramic base, various problems caused by the roughening can be eliminated.

[Brief description of drawings]

FIG. 1 is a sectional view showing a first embodiment of a ceramic electronic component of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the ceramic electronic component of the present invention.

FIG. 3 is a sectional view showing a conventional ceramic electronic component.

[Explanation of symbols]

 1 Ceramic electronic parts 2 Ceramic base 4 Electroless plating film 5 Glass powder 6 Metal film with excellent solder wettability

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H01G 1/14 F 9174-5E // H05K 3/24 A 7511-4E

Claims (5)

[Claims]
1. A ceramic electronic component having an external electrode made of an electroless plating film on the surface of a ceramic substrate,
A ceramic electronic component, wherein glass powder is dispersed in the external electrode.
2. The ceramic electronic component according to claim 1, wherein the electroless plated film is made of copper or nickel.
3. The ceramic electronic component according to claim 1, wherein a metal film having excellent solder wettability is formed on the electroless plated film.
4. The metal film excellent in solder wettability is silver,
The ceramic electronic component according to claim 3, which is made of either tin or a tin-lead alloy.
5. A method of manufacturing a ceramic electronic component having an external electrode made of an electroless plating film on the surface of a ceramic substrate, wherein glass powder is dispersed to form the electroless plating film, and then the ceramic substrate is softened by glass. A method of manufacturing a ceramic electronic component, comprising heat-treating at a temperature equal to or higher than a point.
JP15218192A 1992-06-11 1992-06-11 Ceramic electronic component and its manufacture Withdrawn JPH05343259A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15218192A JPH05343259A (en) 1992-06-11 1992-06-11 Ceramic electronic component and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15218192A JPH05343259A (en) 1992-06-11 1992-06-11 Ceramic electronic component and its manufacture

Publications (1)

Publication Number Publication Date
JPH05343259A true JPH05343259A (en) 1993-12-24

Family

ID=15534828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15218192A Withdrawn JPH05343259A (en) 1992-06-11 1992-06-11 Ceramic electronic component and its manufacture

Country Status (1)

Country Link
JP (1) JPH05343259A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194555A (en) * 2000-12-25 2002-07-10 Murata Mfg Co Ltd Method for electroless plating gold and electronic component
WO2008062602A1 (en) * 2006-11-22 2008-05-29 Murata Manufacturing Co., Ltd. Laminated electronic component and method for manufacturing the same
US7589951B2 (en) 2006-02-27 2009-09-15 Murata Manufacturing Co., Ltd. Laminated electronic component and method for manufacturing the same
JP2009212298A (en) * 2008-03-04 2009-09-17 Murata Mfg Co Ltd Multilayer electronic component and method of manufacturing the same thereof
JP2009267191A (en) * 2008-04-28 2009-11-12 Murata Mfg Co Ltd Ceramic electronic component and method for manufacturing same
JP2009302129A (en) * 2008-06-10 2009-12-24 Murata Mfg Co Ltd Ceramic electronic component and method for manufacturing ceramic electronic component
JP2009302128A (en) * 2008-06-10 2009-12-24 Murata Mfg Co Ltd Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component
JP2012009813A (en) * 2010-05-27 2012-01-12 Murata Mfg Co Ltd Ceramic electronic component and manufacturing method for the same
US8154849B2 (en) 2005-10-28 2012-04-10 Murata Manufacturing Co. Ltd. Laminated electronic component
US20150243438A1 (en) * 2014-02-27 2015-08-27 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
JPWO2016032005A1 (en) * 2014-08-29 2017-06-01 京セラ株式会社 Electronic components, inductor core members and inductors

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194555A (en) * 2000-12-25 2002-07-10 Murata Mfg Co Ltd Method for electroless plating gold and electronic component
US8154849B2 (en) 2005-10-28 2012-04-10 Murata Manufacturing Co. Ltd. Laminated electronic component
US7589951B2 (en) 2006-02-27 2009-09-15 Murata Manufacturing Co., Ltd. Laminated electronic component and method for manufacturing the same
JPWO2008062602A1 (en) * 2006-11-22 2010-03-04 株式会社村田製作所 Multilayer electronic component and manufacturing method thereof
WO2008062602A1 (en) * 2006-11-22 2008-05-29 Murata Manufacturing Co., Ltd. Laminated electronic component and method for manufacturing the same
US7589952B2 (en) 2006-11-22 2009-09-15 Murata Manufacturing Co., Ltd. Multilayer electronic device and method for manufacturing the same
KR100979066B1 (en) * 2006-11-22 2010-08-30 가부시키가이샤 무라타 세이사쿠쇼 Multilayer electronic device and method for manufacturing the same
JP4807410B2 (en) * 2006-11-22 2011-11-02 株式会社村田製作所 Multilayer electronic component and manufacturing method thereof
JP2009212298A (en) * 2008-03-04 2009-09-17 Murata Mfg Co Ltd Multilayer electronic component and method of manufacturing the same thereof
US8240016B2 (en) 2008-03-04 2012-08-14 Murata Manufacturing Co., Ltd. Method for manufacturing multilayer electronic component
JP2009267191A (en) * 2008-04-28 2009-11-12 Murata Mfg Co Ltd Ceramic electronic component and method for manufacturing same
US8130485B2 (en) 2008-04-28 2012-03-06 Murata Manufacturing Co., Ltd. Ceramic electronic component and method for manufacturing the same
US8102640B2 (en) 2008-06-10 2012-01-24 Murata Manufacturing Co., Ltd. Monolithic ceramic electronic component and method of manufacturing monolithic ceramic electronic component
JP2009302128A (en) * 2008-06-10 2009-12-24 Murata Mfg Co Ltd Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component
JP2009302129A (en) * 2008-06-10 2009-12-24 Murata Mfg Co Ltd Ceramic electronic component and method for manufacturing ceramic electronic component
US8315036B2 (en) 2008-06-10 2012-11-20 Murata Manufacturing Co., Ltd. Ceramic electronic component and method for manufacturing the same
JP2012009813A (en) * 2010-05-27 2012-01-12 Murata Mfg Co Ltd Ceramic electronic component and manufacturing method for the same
US20150243438A1 (en) * 2014-02-27 2015-08-27 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
US9685272B2 (en) 2014-02-27 2017-06-20 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor having multilayer external electrodes and board having the same
JPWO2016032005A1 (en) * 2014-08-29 2017-06-01 京セラ株式会社 Electronic components, inductor core members and inductors

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990831