JPS62230990A - 印刷配線板の製造法 - Google Patents

印刷配線板の製造法

Info

Publication number
JPS62230990A
JPS62230990A JP7383286A JP7383286A JPS62230990A JP S62230990 A JPS62230990 A JP S62230990A JP 7383286 A JP7383286 A JP 7383286A JP 7383286 A JP7383286 A JP 7383286A JP S62230990 A JPS62230990 A JP S62230990A
Authority
JP
Japan
Prior art keywords
catalyst
plating
printed wiring
wiring board
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7383286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0450389B2 (enrdf_load_stackoverflow
Inventor
▲つる▼　義之
Yoshiyuki Tsuru
Toshiro Okamura
岡村　寿郎
Masayoshi Ikeda
正義 池田
Tetsuya Okishima
沖島　哲哉
Masahiro Kawamura
川村　昌広
Akishi Nakaso
昭士 中祖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP7383286A priority Critical patent/JPS62230990A/ja
Publication of JPS62230990A publication Critical patent/JPS62230990A/ja
Publication of JPH0450389B2 publication Critical patent/JPH0450389B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP7383286A 1986-03-31 1986-03-31 印刷配線板の製造法 Granted JPS62230990A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7383286A JPS62230990A (ja) 1986-03-31 1986-03-31 印刷配線板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7383286A JPS62230990A (ja) 1986-03-31 1986-03-31 印刷配線板の製造法

Publications (2)

Publication Number Publication Date
JPS62230990A true JPS62230990A (ja) 1987-10-09
JPH0450389B2 JPH0450389B2 (enrdf_load_stackoverflow) 1992-08-14

Family

ID=13529506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7383286A Granted JPS62230990A (ja) 1986-03-31 1986-03-31 印刷配線板の製造法

Country Status (1)

Country Link
JP (1) JPS62230990A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0450389B2 (enrdf_load_stackoverflow) 1992-08-14

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