JPS622280U - - Google Patents
Info
- Publication number
- JPS622280U JPS622280U JP9313685U JP9313685U JPS622280U JP S622280 U JPS622280 U JP S622280U JP 9313685 U JP9313685 U JP 9313685U JP 9313685 U JP9313685 U JP 9313685U JP S622280 U JPS622280 U JP S622280U
- Authority
- JP
- Japan
- Prior art keywords
- base
- holes
- electronic device
- package
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例におけるパツケージの
ステムとキヤツプの分解斜視図、第２図は電子デ
バイス完成状態の断面図、第３図は第２図の電子
デバイス装置側基板へ半田付けした時の部分拡大
断面図、第４図は従来の一例の斜視図、第５図は
第４図のパツケージを用いた電子デバイスをプリ
ント板へ実装した状態を示す断面図である。
１……ベース、２……内部接続端子、４……ラ
ンド、５……スルーホール、６……側端面凹部、
７……キヤツプ、８……逃げ、９……プリント板
、１０……ランド、１１……半田。
Figure 1 is an exploded perspective view of the stem and cap of the package in the embodiment of the present invention, Figure 2 is a sectional view of the completed electronic device, and Figure 3 is the electronic device when soldered to the side board of the electronic device in Figure 2. 4 is a perspective view of a conventional example, and FIG. 5 is a sectional view showing a state in which an electronic device using the package of FIG. 4 is mounted on a printed board. 1...Base, 2...Internal connection terminal, 4...Land, 5...Through hole, 6...Side end surface recess,
7...cap, 8...escape, 9...printed board, 10...land, 11...solder.
Claims (1)
らなるパツケージにおいて、前記ステムが、ベー
スとこのベースのスルーホールに固定された複数
個の内部接続端子と、前記スルーホールに近接し
たベース側端面に前記スルーホールと１対１対応
で設けられた凹部と、前記凹部を覆いかつ前記対
応のスルーホールのベース両面のランドに接続す
る導体パターンとより構成されていることを特徴
とする電子デバイス用パツケージ。 In a package that houses an electronic device and includes a stem and a cap, the stem includes a base, a plurality of internal connection terminals fixed to through holes in the base, and a plurality of internal connection terminals fixed to the through holes on the base side end surface near the through holes. 1. A package for an electronic device, comprising a recess provided in one-to-one correspondence with a hole, and a conductor pattern that covers the recess and connects to lands on both sides of the base of the corresponding through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9313685U JPS622280U (en) | 1985-06-20 | 1985-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9313685U JPS622280U (en) | 1985-06-20 | 1985-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622280U true JPS622280U (en) | 1987-01-08 |
Family
ID=30650543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9313685U Pending JPS622280U (en) | 1985-06-20 | 1985-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622280U (en) |
-
1985
- 1985-06-20 JP JP9313685U patent/JPS622280U/ja active Pending