JPS622247U - - Google Patents
Info
- Publication number
- JPS622247U JPS622247U JP9264985U JP9264985U JPS622247U JP S622247 U JPS622247 U JP S622247U JP 9264985 U JP9264985 U JP 9264985U JP 9264985 U JP9264985 U JP 9264985U JP S622247 U JPS622247 U JP S622247U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sliding member
- detection mechanism
- resin material
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 239000012530 fluid Substances 0.000 claims 3
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図乃至第３図は本考案金型装置の実施例を
示すものであり、第１図はその要部の一部切欠正
面図、第２図及び第３図はいずれもその要部拡大
縦断面図である。第４図は圧力検知機構の他の実
施例を示す縦断面図である。第５図はポツトとプ
ランジヤーとの間隙（クリアランス）の広狭に基
づく樹脂成形加圧力と樹脂成形効率との関係を示
す図表である。
２……固定側金型（上型）、３……可動側金型
（下型）、４……ポツト、５……キヤビテイ、６
……カル部、８……移送通路、９……連通孔、１
０……摺動部材、１１……加圧押動体、２７……
プランジヤー、２８……可動ホルダー、Ｄ，Ｄ′
……圧力検知機構。
Figures 1 to 3 show an embodiment of the mold device of the present invention. Figure 1 is a partially cutaway front view of the main part, and Figures 2 and 3 are enlarged views of the main part. FIG. FIG. 4 is a longitudinal sectional view showing another embodiment of the pressure detection mechanism. FIG. 5 is a chart showing the relationship between resin molding pressure and resin molding efficiency based on the width of the gap (clearance) between the pot and the plunger. 2...Fixed side mold (upper mold), 3...Movable side mold (lower mold), 4...Pot, 5...Cavity, 6
... Cull part, 8 ... Transfer passage, 9 ... Communication hole, 1
0...Sliding member, 11...Pressure pushing body, 27...
Plunger, 28...Movable holder, D, D'
...Pressure detection mechanism.
Claims (1)
た可動側金型と、該両金型のいずれかに配置した
所要数個の樹脂材料供給用のポツトと、上記両金
型間に夫々配設した所要数のキヤビテイと、該キ
ヤビテイとポツト間を連通させる溶融樹脂材料の
移送通路と、上記ポツトの配設位置及び数に対応
して配設した所要数の樹脂材料加圧用プランジヤ
ーを備えた金型装置において、上記溶融樹脂材料
の移送通路におけるカル部に、該カル部と連通す
る連通孔を形成すると共に、該連通孔には、所要
形状の摺動部材を密に嵌合し、且つ、該摺動部材
を上記樹脂材料加圧用プランジヤーによる加圧押
動作用により、進退摺動可能に配設し、更に、上
記摺動部材の摺動により作動される上記移送通路
内の所要圧力検知機構を配置して構成したことを
特徴とする半導体素子の樹脂封止成形用金型装置
。 (2) 圧力検知機構が、摺動部材の摺動作用によ
つてＯＮ―ＯＦＦ操作される電気的な検知機構か
ら構成された実用新案登録請求の範囲第(1)項に
記載の半導体素子の樹脂封止成形用金型装置。 (3) 圧力検知機構が、摺動部材の摺動作用によ
り、流体を加圧することによつて作動するように
構成された実用新案登録請求の範囲第(1)項に記
載の半導体素子の樹脂封止成形用金型装置。 (4) 圧力検知機構が、摺動部材の摺動作用によ
り流体の流体圧力を変化させることによつて作動
するように構成された実用新案登録請求の範囲第
(1)項に記載の半導体素子の樹脂封止成形用金型
装置。[Scope of Claim for Utility Model Registration] (1) A stationary side mold, a movable side mold placed opposite to the fixed side mold, and a required number of resin material supplying pieces placed on either of the two molds. pots, a required number of cavities respectively arranged between the two molds, a transfer passage for the molten resin material communicating between the cavities and the pots, and arranged corresponding to the arrangement position and number of the pots. In the mold device equipped with a required number of resin material pressurizing plungers, a communicating hole communicating with the cull portion is formed in the cull portion in the transfer passage for the molten resin material, and the communicating hole has a predetermined shape. The sliding member is tightly fitted, and the sliding member is arranged to be able to slide forward and backward by the pressing operation of the plunger for pressurizing the resin material, and further, the sliding member 1. A mold apparatus for resin-sealing molding of a semiconductor element, characterized in that a required pressure detection mechanism in the transfer passage operated by is arranged. (2) The semiconductor device according to claim 1, wherein the pressure detection mechanism is an electrical detection mechanism that is turned on and off by the sliding action of a sliding member. Mold equipment for resin sealing molding. (3) The resin of the semiconductor element according to claim (1) of the utility model registration claim, in which the pressure detection mechanism is configured to operate by pressurizing a fluid through the sliding action of a sliding member. Mold equipment for sealing molding. (4) Utility model registration claim No. 1 in which the pressure detection mechanism is configured to operate by changing the fluid pressure of the fluid due to the sliding action of the sliding member.
A mold device for resin-sealing molding of a semiconductor element according to item (1).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985092649U JPH0356051Y2 (en) | 1985-06-19 | 1985-06-19 | |
| US06/796,814 US4723899A (en) | 1984-11-12 | 1985-11-12 | Molding apparatus for enclosing semiconductor chips with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985092649U JPH0356051Y2 (en) | 1985-06-19 | 1985-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS622247U true JPS622247U (en) | 1987-01-08 |
| JPH0356051Y2 JPH0356051Y2 (en) | 1991-12-16 |
Family
ID=30649633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985092649U Expired JPH0356051Y2 (en) | 1984-11-12 | 1985-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356051Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054845A (en) * | 1983-09-06 | 1985-03-29 | 東洋製罐株式会社 | Adherent structure |
-
1985
- 1985-06-19 JP JP1985092649U patent/JPH0356051Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054845A (en) * | 1983-09-06 | 1985-03-29 | 東洋製罐株式会社 | Adherent structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356051Y2 (en) | 1991-12-16 |
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