JPS6446208U - - Google Patents

Info

Publication number
JPS6446208U
JPS6446208U JP14277087U JP14277087U JPS6446208U JP S6446208 U JPS6446208 U JP S6446208U JP 14277087 U JP14277087 U JP 14277087U JP 14277087 U JP14277087 U JP 14277087U JP S6446208 U JPS6446208 U JP S6446208U
Authority
JP
Japan
Prior art keywords
plunger
resin material
pot
reciprocating sliding
sliding mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14277087U
Other languages
Japanese (ja)
Other versions
JPH0422975Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987142770U priority Critical patent/JPH0422975Y2/ja
Publication of JPS6446208U publication Critical patent/JPS6446208U/ja
Application granted granted Critical
Publication of JPH0422975Y2 publication Critical patent/JPH0422975Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図は、本考案に係る半導体素子の樹脂封止装置
の要部を示す一部切欠縦断正面図であり、上下両
型の型締時及びプランジヤーによる樹脂材料加圧
時の状態を示している。 （符号の説明）、１…固定上型、２…可動下型
、３…ポツト、４…プランジヤー、５…キヤビテ
イ、６…樹脂材料移送用通路、７…プランジヤー
ホルダー、８…上下往復摺動機構、９…弾性押圧
部材、１２…サーボモータ、１３…水平回転軸、
１４…回転ナツト部材、１５…スクリユーシヤフ
ト、１７…荷重計、１７１…圧力検出信号、１８
…自動制御回路、１８１…制御信号。 The figure is a partially cutaway vertical front view showing the main parts of the resin sealing device for semiconductor elements according to the present invention, and shows the state when both the upper and lower molds are clamped and when the resin material is pressurized by the plunger. (Explanation of symbols), 1...Fixed upper mold, 2...Movable lower mold, 3...Pot, 4...Plunger, 5...Cavity, 6...Resin material transfer passage, 7...Plunger holder, 8...Vertical reciprocating sliding Mechanism, 9... Elastic pressing member, 12... Servo motor, 13... Horizontal rotating shaft,
14... Rotating nut member, 15... Screw shaft, 17... Load cell, 17 1 ... Pressure detection signal, 18
... automatic control circuit, 18 1 ... control signal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 固定型と、該固定型に対向配置させた可動型と
、これらの両型におけるいずれか一方側の型に配
置した樹脂材料供給用のポツトと、該ポツトに嵌
装させる樹脂材料加圧用のプランジヤーと、該プ
ランジヤーの往復摺動機構とを備えた半導体素子
の樹脂封止装置において、上記プランジヤーの往
復摺動機構を電動スクリユージヤツキ機構から構
成したことを特徴とする半導体素子の樹脂封止装
置。 A fixed mold, a movable mold placed opposite to the fixed mold, a pot for supplying resin material placed on either side of both molds, and a plunger for pressurizing the resin material fitted into the pot. and a reciprocating sliding mechanism for the plunger, characterized in that the reciprocating sliding mechanism for the plunger is constituted by an electric screw jack mechanism. .
JP1987142770U 1987-09-17 1987-09-17 Expired JPH0422975Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987142770U JPH0422975Y2 (en) 1987-09-17 1987-09-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987142770U JPH0422975Y2 (en) 1987-09-17 1987-09-17

Publications (2)

Publication Number Publication Date
JPS6446208U true JPS6446208U (en) 1989-03-22
JPH0422975Y2 JPH0422975Y2 (en) 1992-05-27

Family

ID=31408998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987142770U Expired JPH0422975Y2 (en) 1987-09-17 1987-09-17

Country Status (1)

Country Link
JP (1) JPH0422975Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384122U (en) * 1989-12-15 1991-08-27
EP0778116A1 (en) 1995-12-05 1997-06-11 Apic Yamada Corporation Resin molding machine

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183533U (en) * 1981-05-18 1982-11-20
JPS61185943A (en) * 1985-02-13 1986-08-19 Mitsubishi Electric Corp Resin-sealing device for semiconductor element
JPS61148610U (en) * 1985-03-08 1986-09-13
JPS6244417A (en) * 1985-08-23 1987-02-26 Toyoda Autom Loom Works Ltd Control method of screw thrust of injection molding machine
JPS6278839A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57183533U (en) * 1981-05-18 1982-11-20
JPS61185943A (en) * 1985-02-13 1986-08-19 Mitsubishi Electric Corp Resin-sealing device for semiconductor element
JPS61148610U (en) * 1985-03-08 1986-09-13
JPS6244417A (en) * 1985-08-23 1987-02-26 Toyoda Autom Loom Works Ltd Control method of screw thrust of injection molding machine
JPS6278839A (en) * 1985-09-30 1987-04-11 Mitsubishi Electric Corp Resin sealing device for semiconductor element

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0384122U (en) * 1989-12-15 1991-08-27
EP0778116A1 (en) 1995-12-05 1997-06-11 Apic Yamada Corporation Resin molding machine

Also Published As

Publication number Publication date
JPH0422975Y2 (en) 1992-05-27

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