JPS63161711U - - Google Patents
Info
- Publication number
- JPS63161711U JPS63161711U JP5148287U JP5148287U JPS63161711U JP S63161711 U JPS63161711 U JP S63161711U JP 5148287 U JP5148287 U JP 5148287U JP 5148287 U JP5148287 U JP 5148287U JP S63161711 U JPS63161711 U JP S63161711U
- Authority
- JP
- Japan
- Prior art keywords
- ejector pin
- resin
- sealed molded
- mold release
- sliding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は、本考案に係る装置を備えた半導体素
子の樹脂封止装置の要部を示す一部切欠縦断正面
図である。第２図及び第３図は、本考案装置の第
１実施例を示す一部切欠拡大縦断正面図及びその
作用を説明するための一部切欠拡大縦断正面図で
ある。第４図は、本考案装置の第２実施例を示す
一部切欠縦断正面図である。第５図は、従来の樹
脂封止装置の構成例を示す概略縦断正面図である
。
符号の説明、１…基盤、２…タイバー、３…固
定盤、４…断熱板、５…上型プレート、６…上型
、７…上下動機構、８…可動盤、９…断熱板、１
０…下型プレート、１１…下型、１２…ポツト、
１３…プランジヤー、１４…キヤビテイ、１５…
移送用通路、１５１…カル、１５２…ゲート、１
６…トランスフアーシリンダー、１７…リードフ
レーム、１８…ローデイングフレーム、１９…樹
脂封止成形体、２０…離型装置、２１…エジエク
ターピン、２２…往復摺動機構、２３…断熱ケー
ス、２４…弾性部材、２５…押圧体、２５１…押
圧体（コイルスプリング）、２６…加熱・冷却手
段、２６１…熱媒体部材、２６２…流体循環経路
、２７…往動部材、Ｒ…樹脂材料。
FIG. 1 is a partially cutaway longitudinal sectional front view showing the main parts of a resin sealing device for a semiconductor element equipped with a device according to the present invention. FIGS. 2 and 3 are an enlarged longitudinal sectional front view, partially cut away, showing the first embodiment of the device of the present invention, and an enlarged longitudinal sectional front view, partially cut away, for explaining its operation. FIG. 4 is a partially cutaway longitudinal sectional front view showing a second embodiment of the device of the present invention. FIG. 5 is a schematic longitudinal sectional front view showing a configuration example of a conventional resin sealing device. Explanation of symbols, 1...Base, 2...Tie bar, 3...Fixed plate, 4...Insulating plate, 5...Upper die plate, 6...Upper die, 7...Vertical movement mechanism, 8...Movable plate, 9...Insulating plate, 1
0...lower mold plate, 11...lower mold, 12...pot,
13...Plunger, 14...Cavity, 15...
Transfer passage, 15 1 ... Cal, 15 2 ... Gate, 1
6... Transfer cylinder, 17... Lead frame, 18... Loading frame, 19... Resin sealing molded body, 20... Mold release device, 21... Ejector pin, 22... Reciprocating sliding mechanism, 23... Heat insulation case, 24 ...Elastic member, 25...Press body, 25 1 ...Press body (coil spring), 26...Heating/cooling means, 26 1 ...Heating medium member, 26 2 ...Fluid circulation path, 27...Reciprocating member, R...Resin material .
Claims (1)
該エジエクターピンを樹脂封止成形体の離型方向
へ往動し、且つ、その反対方向へ復動させる上記
エジエクターピンの往復摺動機構とから成り、該
往復摺動機構におけるエジエクターピンの往動部
材を、形状記憶合金により形成したエジエクター
ピンの押圧体と、該押圧体に対する加熱・冷却手
段とから構成したことを特徴とする樹脂封止成形
体の離型装置。 An ejector pin for releasing a resin-sealed molded product,
and a reciprocating sliding mechanism for the ejector pin that moves the ejector pin forward in the mold release direction of the resin-sealed molded body and back in the opposite direction, the ejector pin in the reciprocating sliding mechanism. 1. A mold release device for a resin-sealed molded article, wherein the reciprocating member is composed of a pressing body of an ejector pin made of a shape memory alloy, and heating/cooling means for the pressing body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5148287U JPH0356341Y2 (en) | 1987-04-03 | 1987-04-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5148287U JPH0356341Y2 (en) | 1987-04-03 | 1987-04-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63161711U true JPS63161711U (en) | 1988-10-21 |
| JPH0356341Y2 JPH0356341Y2 (en) | 1991-12-18 |
Family
ID=30875785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5148287U Expired JPH0356341Y2 (en) | 1987-04-03 | 1987-04-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356341Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023809U (en) * | 1988-06-13 | 1990-01-11 | ||
| JP2014067771A (en) * | 2012-09-25 | 2014-04-17 | Mitsubishi Electric Corp | Semiconductor device encapsulation mold, and semiconductor device |
-
1987
- 1987-04-03 JP JP5148287U patent/JPH0356341Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH023809U (en) * | 1988-06-13 | 1990-01-11 | ||
| JP2014067771A (en) * | 2012-09-25 | 2014-04-17 | Mitsubishi Electric Corp | Semiconductor device encapsulation mold, and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0356341Y2 (en) | 1991-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63161711U (en) | ||
| JPS5926244U (en) | Molding equipment for semiconductor resin encapsulation molding | |
| JPS6097815A (en) | Molding method and molding machine | |
| JP3348972B2 (en) | Transfer molding equipment for thermosetting synthetic resin | |
| JP2992982B2 (en) | Mold device for molding resin-sealed parts of electronic components | |
| JPS6389240U (en) | ||
| JPH0113421Y2 (en) | ||
| JP2571719Y2 (en) | Work removal device for semiconductor molding | |
| JPH04451U (en) | ||
| JPS6343062Y2 (en) | ||
| JPS622247U (en) | ||
| JPS6245115U (en) | ||
| JPH03106756U (en) | ||
| JPS6158942U (en) | ||
| JPS6230086B2 (en) | ||
| JPH02192921A (en) | Injection mold | |
| JPH0196298U (en) | ||
| JPS6294015U (en) | ||
| JPS63192015U (en) | ||
| JPH0276838U (en) | ||
| JPH0168815U (en) | ||
| JPS6193218U (en) | ||
| JPH01104028U (en) | ||
| JPS61241109A (en) | Molding die | |
| JPH0351958U (en) |