JPS63167732U

JPS63167732U -

Info

Publication number: JPS63167732U
Application number: JP6204187U
Authority: JP
Priority date: 1987-04-23
Filing date: 1987-04-23
Publication date: 1988-11-01

Description

[Brief explanation of the drawing]

第１図は、本考案に係る半導体素子の樹脂封止
装置の要部を示す一部切欠縦断正面図である。第
２図の・の及び・・は、いずれもキ
ヤビテイブロツクの形成例を示す概略説明図であ
る。符号の説明、１……上型（固定型）、２……下
型（可動型）、２_１……セツト用溝部、３……キ
ヤビテイブロツク、４……キヤビテイブロツク、
５……キヤビテイ、６……キヤビテイ、７……空
気排出用通路、８……空気排出用通路、９……エ
ジエクターピン、１０……エジエクターピン、１
１……ポツト、１２……プランジヤー、１３……
移送用通路、１３_１……カル、１３_２……ゲート
、１４……リードフレーム、１４_１……縁枠、１
５……粒子、１６……連続状細孔。 FIG. 1 is a partially cutaway longitudinal sectional front view showing the main parts of a resin sealing device for a semiconductor element according to the present invention. . . . in FIG. 2 are schematic explanatory diagrams showing examples of the formation of cavity blocks. Explanation of symbols: 1...Upper die (fixed type), 2...Lower die (movable type), ₂₁ ...Settling groove, 3...Cavity block, 4...Cavity block,
5... Cavity, 6... Cavity, 7... Air exhaust passage, 8... Air exhaust passage, 9... Ejector pin, 10... Ejector pin, 1
1...pot, 12...plunger, 13...
Transfer passage, 13 ₁ ... Cull, 13 ₂ ... Gate, 14 ... Lead frame, 14 ₁ ... Edge frame, 1
5... Particles, 16... Continuous pores.

Claims

[Scope of Claim for Utility Model Registration] (1) A fixed mold, a movable mold disposed opposite to the fixed mold, and both cavities having resin molding cavity portions disposed opposite to the parting line surfaces of both molds. a block, a pot for supplying resin material disposed on either side of the molds, a plunger for pressurizing the resin material fitted into the pot, and a molten resin communicating between the cavity and the pot. A resin encapsulation of a semiconductor element comprising a material transfer path, a semiconductor lead frame set at a predetermined position in the cavity of both of the molds, and a release member for a semiconductor resin encapsulation molded body molded within the cavity. 1. A resin sealing device for a semiconductor element, wherein both of the cavity blocks are made of a porous metal material that is impermeable to molten resin material and permeable to air. (2) The resin sealing device for a semiconductor element according to claim (1) of the utility model registration, wherein the front side of both cavity blocks and the required vacuum source side are communicated through an air exhaust passage. (3) Utility model registration in which both cavity blocks are formed by pressure forming fine powder metal and sintering, so that the inside of the cavity and the air exhaust passage communicate with each other through a large number of continuous pores. A resin sealing device for a semiconductor element according to claim (1) or (2). (4) The interior of the cavity and the air exhaust passage in both cavity blocks form at least 10% of all the continuous pores that are open to the inner surface of the pair of cavities and communicate with each other. A resin sealing device for a semiconductor element according to claim 2 or 3 of the utility model registration claims communicated by. (5) Utility model registration claim No. (2) in which continuous pores are formed such that the maximum opening diameter on the inner surface of the cavity is 0.1 μ to 5.0 μ or less.
The resin sealing device for a semiconductor element according to item (3) or item (4).