JPS6377340U - - Google Patents
Info
- Publication number
- JPS6377340U JPS6377340U JP17313786U JP17313786U JPS6377340U JP S6377340 U JPS6377340 U JP S6377340U JP 17313786 U JP17313786 U JP 17313786U JP 17313786 U JP17313786 U JP 17313786U JP S6377340 U JPS6377340 U JP S6377340U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- sealing device
- ejector pin
- resin sealing
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図〜第３図は本考案の実施例を示すもので
あり、第１図は本考案の構成を備えたマルチプラ
ンジヤー型樹脂封止装置の一部切欠概略正面図、
第２図はその下型の一部切欠拡大斜視図、第３図
は下エジエクター機構部の要部を示す一部切欠斜
視図である。第４図及び第５図は半導体素子の樹
脂封止作用の説明図であつて、第４図は上下両型
の拡大縦断正面図、第５図は型締時における要部
の拡大縦断正面図である。第６図はホルダー部の
他の実施例を示す下型の縦断正面図である。第７
図は取付バーの他の実施例を示す一部切拡大斜視
図である。第８図及び第９図は従来例を示すもの
であり、第８図は従来のエジエクター機構部を備
えた樹脂封止装置の一部切欠概略正面図、第９図
は該装置の要部を示す一部切欠拡大斜視図である
。
（符号の説明） １…下型、２…上型、３…ポ
ツト、４…下キヤビテイ、５…溝部、６…下エジ
エクターピン、６１…基端部、６２…先端部、７
…取付バー、７１…条溝、７２…端部、７３…係
合面、８…ホルダー部、８ａ…ホルダー部、８ｂ
…蓋プレート、９…挿通孔、１０…凹所、１１…
エジエクターバー、１２…連結部材、１２１…連
結バー、１２２…連結ボルト、１３…取付ボルト
、１４…加圧機構、１５…プランジヤー、１６…
嵌合取付部、１７…カル、１８…上キヤビテイ、
１９…ゲート、２０…溶融樹脂材料、２１…半導
体素子、２２…リードフレーム、２３…エアベン
ト、Ｗ…スペース（幅）。
1 to 3 show an embodiment of the present invention, and FIG. 1 is a partially cutaway schematic front view of a multi-plunger type resin sealing device having the configuration of the present invention;
FIG. 2 is a partially cutaway enlarged perspective view of the lower mold, and FIG. 3 is a partially cutaway perspective view showing the main parts of the lower ejector mechanism. 4 and 5 are explanatory diagrams of the resin sealing action of a semiconductor element, in which FIG. 4 is an enlarged longitudinal sectional front view of both the upper and lower molds, and FIG. 5 is an enlarged longitudinal sectional front view of the main parts during mold clamping. It is. FIG. 6 is a vertical sectional front view of the lower die showing another embodiment of the holder part. 7th
The figure is a partially cutaway enlarged perspective view showing another embodiment of the mounting bar. 8 and 9 show conventional examples, FIG. 8 is a partially cutaway schematic front view of a resin sealing device equipped with a conventional ejector mechanism, and FIG. 9 is a main part of the device. It is a partially cutaway enlarged perspective view shown in FIG. (Explanation of symbols) 1...lower die, 2...upper die, 3...pot, 4...lower cavity, 5...groove, 6...lower ejector pin, 6 1 ...base end, 6 2 ...tip, 7
... Mounting bar, 7 1 ... Groove, 7 2 ... End, 7 3 ... Engagement surface, 8 ... Holder part, 8a... Holder part, 8b
...Lid plate, 9...Insertion hole, 10...Recess, 11...
Ejector bar, 12... Connection member, 12 1 ... Connection bar, 12 2 ... Connection bolt, 13... Mounting bolt, 14... Pressure mechanism, 15... Plunger, 16...
Fitting mounting part, 17... Cal, 18... Upper cavity,
19... Gate, 20... Molten resin material, 21... Semiconductor element, 22... Lead frame, 23... Air vent, W... Space (width).
Claims (1)
させた可動側の金型とを備えると共に、その一方
側の金型におけるパーテイングライン面には樹脂
材料供給用のポツトと所要数のキヤビテイを形成
し、また、その他方側の金型におけるパーテイン
グライン面には上記ポツト及び各キヤビテイとの
対応位置にカル及びキヤビテイをそれぞれ形成し
かつ該カルと各キヤビテイとを連通形成し、また
、少なくとも上記各キヤビテイ位置に樹脂成形体
突出用のエジエクターピンを往復摺動自在に嵌装
し、更に、上記ポツトには樹脂材料加圧用のプラ
ンジヤーを嵌装させて構成した半導体素子の樹脂
封止装置において、上記パーテイングライン面と
は反対側となる両金型の各型面に、上記各エジエ
クターピンの基端部を係合止着させる該エジエク
ターピンの取付バー及び該取付バーを支持させる
ホルダー部とをそれぞれ配設し、かつ、上記取付
バーを上記ホルダー部に形成したエジエクターピ
ンの摺動方向に沿う嵌合用凹所に摺動自在に嵌合
装着すると共に、両金型における上記各エジエク
ターピン取付バーのそれぞれを同時に往復摺動さ
せるように構成したことを特徴とする半導体素子
の樹脂封止装置。 (2) ホルダー部が独立した構成部材として形成
されている実用新案登録請求の範囲第(1)項に記
載の半導体素子の樹脂封止装置。 (3) ホルダー部が両金型にそれぞれ一体として
形成されている実用新案登録請求の範囲第(1)項
に記載の半導体素子の樹脂封止装置。 (4) エジエクターピンの取付バーに、該ピンの
位置決め用の係合面が形成されている実用新案登
録請求の範囲第(1)項に記載の半導体素子の樹脂
封止装置。[Claims for Utility Model Registration] (1) A mold on the fixed side and a mold on the movable side disposed opposite to the fixed side mold, and on the parting line surface of the mold on one side. A pot for supplying resin material and the required number of cavities are formed, and a cull and a cavity are formed on the parting line surface of the mold on the other side at positions corresponding to the pot and each cavity. and each cavity is connected to each other, and an ejector pin for protruding the resin molded body is fitted in at least the position of each cavity so as to be able to slide back and forth, and furthermore, a plunger for pressurizing the resin material is fitted in the pot. In a resin sealing device for a semiconductor element configured by fitting, the base ends of each of the ejector pins are engaged and fixed to each mold surface of both molds opposite to the parting line surface. A mounting bar for the ejector pin and a holder portion for supporting the mounting bar are respectively provided, and the mounting bar is slid into a fitting recess formed in the holder portion along the sliding direction of the ejector pin. 1. A resin sealing device for a semiconductor device, characterized in that the resin sealing device for a semiconductor device is configured to be movably fitted and mounted, and each of the ejector pin attachment bars in both molds is simultaneously slid back and forth. (2) The resin sealing device for a semiconductor element according to claim (1), wherein the holder portion is formed as an independent component. (3) The resin sealing device for a semiconductor element according to claim (1), wherein the holder portion is formed integrally with both molds. (4) The resin sealing device for a semiconductor element according to claim (1), wherein an engagement surface for positioning the ejector pin is formed on the mounting bar of the ejector pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17313786U JPH0423320Y2 (en) | 1986-11-10 | 1986-11-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17313786U JPH0423320Y2 (en) | 1986-11-10 | 1986-11-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6377340U true JPS6377340U (en) | 1988-05-23 |
| JPH0423320Y2 JPH0423320Y2 (en) | 1992-05-29 |
Family
ID=31110316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17313786U Expired JPH0423320Y2 (en) | 1986-11-10 | 1986-11-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423320Y2 (en) |
-
1986
- 1986-11-10 JP JP17313786U patent/JPH0423320Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423320Y2 (en) | 1992-05-29 |
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