JPH0390918U - - Google Patents
Info
- Publication number
- JPH0390918U JPH0390918U JP15216389U JP15216389U JPH0390918U JP H0390918 U JPH0390918 U JP H0390918U JP 15216389 U JP15216389 U JP 15216389U JP 15216389 U JP15216389 U JP 15216389U JP H0390918 U JPH0390918 U JP H0390918U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- gap
- molding device
- cavity
- resin molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000008188 pellet Substances 0.000 claims 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案に係る樹脂モールド
装置の異なる状態を示す縦断正面図である。第３
図は樹脂封止型半導体装置の一部断面斜視図、第
４図及び第５図は従来の樹脂モールド装置の異な
る状態を示す縦断正面図である。
１……放熱板、１ａ……表面、１ｂ……取付穴
、１ｄ……裏面、６……キヤビテイ、７……一方
の金型、８……他方の金型、１０……溶融樹脂、
１３……ピン、１４……空気溜り用間隙、ｄ１…
…一方の金型と放熱板の裏面との間隔、ｄ２……
他方の金型と放熱板の表面との間隙。
1 and 2 are longitudinal sectional front views showing different states of the resin molding device according to the present invention. Third
The figure is a partially sectional perspective view of a resin-sealed semiconductor device, and FIGS. 4 and 5 are longitudinal sectional front views showing different states of a conventional resin molding device. DESCRIPTION OF SYMBOLS 1... Heat sink, 1a... Surface, 1b... Mounting hole, 1d... Back surface, 6... Cavity, 7... One mold, 8... Other mold, 10... Molten resin,
13...Pin, 14...Air pocket gap, d1 ...
...The distance between one mold and the back surface of the heat sink, d2 ...
Gap between the other mold and the surface of the heat sink.
Claims (1)
トした放熱板を衝合する二つの金型間のキヤビテ
イ内に、放熱板の裏面側の間隔を、放熱板の表面
側の間隔よりも狭く保つて収容し、放熱板の取付
穴内にピンを遊挿して、キヤビテイ内に溶融樹脂
を注入してモールド成形する樹脂モールド装置に
おいて、 上記ピンは金型との対向面間に、空気溜り用の
間隙を設けて配置したことを特徴とする樹脂モー
ルド装置。[Claim for Utility Model Registration] In a cavity between two molds for abutting a heat sink with mounting holes and semiconductor pellets mounted on the surface, the gap on the back side of the heat sink should be adjusted to the surface of the heat sink. In a resin molding device, the pin is loosely inserted into the mounting hole of the heat sink, and the molten resin is injected into the cavity to form the mold. A resin molding device characterized in that a gap is provided for an air pocket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15216389U JPH0390918U (en) | 1989-12-28 | 1989-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15216389U JPH0390918U (en) | 1989-12-28 | 1989-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0390918U true JPH0390918U (en) | 1991-09-17 |
Family
ID=31698438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15216389U Pending JPH0390918U (en) | 1989-12-28 | 1989-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0390918U (en) |
-
1989
- 1989-12-28 JP JP15216389U patent/JPH0390918U/ja active Pending