JPS62219502A - Thin film thermistor - Google Patents
Thin film thermistorInfo
- Publication number
- JPS62219502A JPS62219502A JP6213686A JP6213686A JPS62219502A JP S62219502 A JPS62219502 A JP S62219502A JP 6213686 A JP6213686 A JP 6213686A JP 6213686 A JP6213686 A JP 6213686A JP S62219502 A JPS62219502 A JP S62219502A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- metal plate
- alumina
- terminal
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 239000010408 film Substances 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 238000003466 welding Methods 0.000 description 8
- 230000005496 eutectics Effects 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005219 brazing Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 235000019687 Lamb Nutrition 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、測温すべき対象物と１械的に接触して温度を
検出するサーミスタの構成に関し□、例えば平面状のヒ
ータに接触してその温度調節をするサーミスタや、鍋底
の温度ヲ棲出して鍋の中の調理物の加熱を制御する薄膜
サーミスタに係るもの２１・−１
である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to the structure of a thermistor that detects temperature by mechanically contacting an object to be measured, for example, by contacting a planar heater. 21.-1 relates to a thermistor that adjusts temperature and a thin film thermistor that controls the heating of food in a pot by measuring the temperature at the bottom of the pot.
従来□の技術
従来、このような接触型の薄膜サーミスタとしては、第
３図に示すものが知られている。これはアルミナ基板１
の上面に電極膜２が印刷され、その上部にＳｉＣ等の薄
膜感温抵抗層３が蒸着されている。そしてかかる薄膜サ
ーミスタ素子は、ス□テンレス鋼、コバール合金などの
感熱金属板４にろう付けされている。ろう材６は、共晶
銀ろう箔によりサンドイッチ状にはさまれたチタニウム
箔より成る。チタン原子はアルミナ基板１の表面に侵入
し、これを感熱金属板４に強固にろう付けする。また電
極膜２Ｖｃは、リード線６が接続される。Conventional Art □ Conventionally, as such a contact type thin film thermistor, the one shown in FIG. 3 is known. This is alumina substrate 1
An electrode film 2 is printed on the upper surface of the electrode film 2, and a thin film temperature-sensitive resistance layer 3 made of SiC or the like is deposited on top of the electrode film 2. The thin film thermistor element is brazed to a heat-sensitive metal plate 4 made of stainless steel, Kovar alloy, or the like. The brazing material 6 consists of a titanium foil sandwiched between eutectic silver brazing foils. The titanium atoms penetrate into the surface of the alumina substrate 1 and firmly braze it to the heat-sensitive metal plate 4. Further, the lead wire 6 is connected to the electrode film 2Vc.
絶縁物より成る端子板７は、端子板脚部８（一対の金具
）によって支持され、感熱金属板４に溶接さハ七いる。A terminal plate 7 made of an insulating material is supported by terminal plate legs 8 (a pair of metal fittings) and welded to the heat-sensitive metal plate 4.
この端子板７には、リード端子９が固着され、前記した
リード線６がこのリード端子９にやはり溶接されている
。A lead terminal 9 is fixed to this terminal plate 7, and the aforementioned lead wire 6 is also welded to this lead terminal 9.
このような薄膜サーミスタは、例えばガステープルのコ
ンロバーナ中央部に配置され、鍋底と接３・
触してその温度を検出し、鍋の中の調理物の加熱を制御
している（長井、他［第４回センサシンポジウム論文集
ＪＰ、２４５〜２４９ （１９８４））。Such a thin film thermistor is placed, for example, in the center of the stove burner of a gas stove, and comes into contact with the bottom of the pot to detect its temperature and control the heating of the food in the pot (Nagai et al. [4th Sensor Symposium Proceedings JP, 245-249 (1984)].
またこのほか、このよう外薄膜サーミスタは、例えば松
下電器社製オーブン電子レンジＮＥ−Ａ７１０に組み込
まれている平面状のヒータに接触して、その温度調節を
可能にできる。In addition, such an outer thin film thermistor can be brought into contact with, for example, a planar heater built into an oven/microwave oven NE-A710 manufactured by Matsushita Electric Co., Ltd., thereby making it possible to adjust the temperature thereof.
発明が解決しようとする問題点
ところが前記薄膜サーミスタには、３つの欠点があった
。Problems to be Solved by the Invention However, the thin film thermistor has three drawbacks.
第１に端子板脚部８の溶接時に、熱のため感熱金属板４
がンリやすいことである。このようなンＩＪ ｆｆｉ生
じると、測温すべき対象物との密着が悪くなり、サーミ
スタとしての応答性が損ねられる。First, when welding the terminal plate legs 8, the heat-sensitive metal plate 4 due to heat
This is something that is easy to do. When such an IJffi occurs, the close contact with the object whose temperature is to be measured becomes poor, and the responsiveness of the thermistor is impaired.
第２に同じく端子板脚部８の溶接時に、感熱金属板４に
生じる溶接あとのため５測温すべき対象物との接触がこ
の溶接あとの点接触となり、サーミスタとしての応答性
が悪く々る点である。Secondly, when welding the terminal plate leg 8, due to the welding marks that occur on the heat-sensitive metal plate 4, the contact with the object whose temperature is to be measured becomes a point contact after this welding, resulting in poor response as a thermistor. This is the point.
第３に端子板７と端子板脚部８をかしめ、これを感熱金
属板４に溶接する構造が複雑であり、また多くの工程を
要するため、コストを押しあげる要因となっている点で
ある。特にリード線６には、白金線などが用いられるが
、この構造では高価な白金線をたくさん使用せねばなら
ず、大変不利であった。Thirdly, the structure of caulking the terminal plate 7 and the terminal plate legs 8 and welding them to the heat-sensitive metal plate 4 is complicated and requires many steps, which is a factor that drives up the cost. . In particular, a platinum wire or the like is used for the lead wire 6, but this structure requires the use of a large amount of expensive platinum wire, which is very disadvantageous.
本発明はかかる従来の問題を解消するものであり、感熱
金属板と被測温部の密着全良好に保ち５その応答性を改
善するとともに、端子板の周辺の構造を簡素にし、低コ
ス）ｋ実現するものである。The present invention solves such conventional problems, and maintains good adhesion between the heat-sensitive metal plate and the temperature-measured part (5), improves its response, and simplifies the structure around the terminal board, resulting in low cost. k is realized.
問題点を解決するだめの手段
上記問題点を解決するために、本発明の薄膜サーミスタ
は、アルミナにより形成された端子板を、チタニウム感
熱金属板にアルミナ基板とともにろうづけする構成であ
り、この端子板にチタニウム感熱金属板との絶縁をはか
りながら、リード端子を固着するものである。Means for Solving the Problems In order to solve the above problems, the thin film thermistor of the present invention has a structure in which a terminal plate made of alumina is brazed to a titanium heat-sensitive metal plate together with an alumina substrate. Lead terminals are fixed to the plate while insulating it from the titanium heat-sensitive metal plate.
作用
本発明は上記の構成によって、アルミナ端子板を共晶銀
ろう箔などのろう材を介してチタニウム感熱金属板上へ
載置し、真空加熱すると、チタニラム感熱金属板中のチ
タン原子が、共晶銀ろう箔を介してアルミナ端子板の表
面に向って速やかに拡散し５アルミナ端子板の表面に吸
着される。そして端子板と感熱金属板とは、強固に接着
され、十分な引っ張り強度が得られる。チタン原子は第
３図の従来例のように、ろう材の中のチタニウム箔から
供給されるのではなく、感熱金属板そのものから供給さ
れるため、従来のようなチタニウム箔とステンレス鋼な
どより成る感熱金属板とのノ・り離の心配がない。チタ
ニウム板とアルミナとの接着性は、上記理由から極めて
良好であるから、感熱金属板をチタニウムとすることで
５感熱金属板とアルミナ端子板とは強固に接着される。Effect of the present invention With the above-described structure, when an alumina terminal plate is placed on a titanium heat-sensitive metal plate via a brazing material such as eutectic silver solder foil and heated in vacuum, the titanium atoms in the titanium lamb heat-sensitive metal plate are bonded together. It quickly diffuses toward the surface of the alumina terminal board through the crystal silver solder foil and is adsorbed to the surface of the alumina terminal board. The terminal plate and the heat-sensitive metal plate are firmly bonded to each other and have sufficient tensile strength. The titanium atoms are not supplied from the titanium foil in the brazing filler metal as in the conventional example shown in Figure 3, but from the heat-sensitive metal plate itself. There is no need to worry about separation from the heat-sensitive metal plate. The adhesion between the titanium plate and alumina is extremely good for the above reasons, so by using titanium as the heat-sensitive metal plate, the heat-sensitive metal plate and the alumina terminal plate can be firmly bonded.
一方、アルミナ端子板にはリード端子が固着されるため
、引っ張り強度として数に９以上を保証しなければなら
ない。本発明の構成であれば５端子板は感熱金属板と強
固に接着されているから、上記強度はクリアでき、よっ
てリード端子を固着できる。On the other hand, since lead terminals are fixed to the alumina terminal plate, it is necessary to ensure a tensile strength of 9 or more. With the structure of the present invention, since the five-terminal plate is firmly bonded to the heat-sensitive metal plate, the above-mentioned strength can be met and the lead terminals can be fixed.
実施例 以下、本発明の一実施例を図面に基いて説明する。Example Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図は本発明の一実施例である接触型薄膜サーミスタ
の構成を示す斜視図、第２図は同断面図である。アルミ
ナ基板１の上面には２電極膜２が印刷され、その上部に
薄膜感温抵抗層３が蒸着されているのは、第３図の従来
例と同様である。FIG. 1 is a perspective view showing the structure of a contact type thin film thermistor which is an embodiment of the present invention, and FIG. 2 is a sectional view thereof. Similar to the conventional example shown in FIG. 3, a two-electrode film 2 is printed on the upper surface of the alumina substrate 1, and a thin film temperature-sensitive resistance layer 3 is deposited on top of the two-electrode film 2.
薄膜感温抵抗層３は、Ｆｅ、Ｎｉ、Ｇｏ、Ｍｎなどの複
合金属酸化物、 ＳｉＣなどが用いられ、真空蒸着やス
パッタ蒸着法などによシ、数μｍ程度の薄い膜厚で形成
される。とりわけＳｉＣの薄膜が、耐熱性、密着性の点
で優れている。The thin film temperature-sensitive resistance layer 3 is made of composite metal oxides such as Fe, Ni, Go, and Mn, SiC, etc., and is formed with a thin film thickness of about several μm by vacuum deposition, sputter deposition, etc. . In particular, SiC thin films are excellent in terms of heat resistance and adhesion.
電極膜２は、ムｕ−Ｐｔ 、 Ａｙ−Ｐｄ 、 Ｐｔ、
Ｐｄ、Ａｕなどのペーストをスクリーン印刷法により
印刷し、高温で焼成した数μｍ〜数十μｍの膜厚のもの
や、０ｒ−Ａｕ、０ｒ−Ｃｕ、０ｒ−Ｐｔ、０ｒ−Ｐｄ
、ムｌなどを真空蒸着法などにより形成した数μｍの膜
厚のものが適用される。The electrode film 2 is made of Mu-Pt, Ay-Pd, Pt,
Pastes such as Pd and Au are printed by screen printing and fired at high temperatures to a thickness of several μm to several tens of μm, as well as Or-Au, Or-Cu, Or-Pt, and Or-Pd.
A film with a thickness of several micrometers formed by vacuum evaporation or the like is used.
アルミナ端子板１０は５中央にアルミナ基板１を嵌入さ
せるための窓部１２１に有し、チタニウム７・
感熱金属板１１に共晶銀ろう箔１３を介して、ろうづけ
される。−またリード端子９は、リード端子支持部１４
にカシメられる。The alumina terminal plate 10 has a window 121 in the center of the plate 5 for inserting the alumina substrate 1, and is brazed to the titanium 7/heat-sensitive metal plate 11 via a eutectic silver solder foil 13. - Also, the lead terminal 9 is connected to the lead terminal support part 14.
It is caulked.
チタニウム感熱金属板１１の上に共晶銀ろう箔１３を置
き、その上にアルミナ端子板１０を配置して、かつその
窓部１２にアルミナ基板１を嵌入せしめた後、真空加熱
すると２チタニウム感熱金属板１１からチタン原子が、
共晶銀ろう箔１３を介して、アルミナ端子板１０および
アルミナ基板１の表面に向って速やかに拡散し、アルミ
ナ端子板１０とアルミナ基板１の表面に吸着される。チ
タン原子は感熱金属板そのものから供給されるので、ア
ルミナ端子板との接着強度は、すこぶる良好である。こ
のためアルミナ端子板１０に設けた貫通孔のあるリード
端子支持部１４Ｋ、リード端子９をカシメても、十分な
引っ張り強度が得られる。−例を挙げると、リード端子
の引っ張り強度試験をしたところ、あるサンプルでは６
〜７１ｇの引っ張り強度を有し、しかも破壊はリード端
子支持部１４の根元で起り、ろうづけ面はなお強固に接
着されていた。よって感熱金属板をチタニウムとし、こ
れにアルミナで形成された端子板をろうづけすることに
よシ、強固な接着が可能となり、端子板にリード端子を
固着できる。After placing the eutectic silver solder foil 13 on the titanium heat-sensitive metal plate 11 and placing the alumina terminal plate 10 on top of it and fitting the alumina substrate 1 into the window 12, vacuum heating is performed to make the titanium heat-sensitive metal plate 13. Titanium atoms from the metal plate 11,
It quickly diffuses toward the surfaces of the alumina terminal plate 10 and alumina substrate 1 through the eutectic silver solder foil 13 and is adsorbed to the surfaces of the alumina terminal plate 10 and alumina substrate 1. Since the titanium atoms are supplied from the heat-sensitive metal plate itself, the adhesive strength with the alumina terminal plate is extremely good. Therefore, even if the lead terminal support portion 14K having the through hole provided in the alumina terminal plate 10 and the lead terminal 9 are caulked, sufficient tensile strength can be obtained. -For example, when we conducted a tensile strength test on lead terminals, we found that one sample had a tensile strength of 6.
It had a tensile strength of ~71 g, and the breakage occurred at the base of the lead terminal support 14, and the brazed surfaces were still firmly bonded. Therefore, by using titanium as the heat-sensitive metal plate and brazing the terminal plate made of alumina to the heat-sensitive metal plate, strong adhesion becomes possible, and the lead terminal can be fixed to the terminal plate.
これらのろうづけは、 １ｏ ’Ｔｏｒｒ以下の真空中
で約８００〜８６０″ｃに加熱することで達成される。These brazes are accomplished by heating to approximately 800-860''C in a vacuum of less than 10'Torr.
ろうづけの厚みは数十μｍである。なお共晶銀ろう箔は
、共晶銀ろうペーストであってもよいＯ
リード端子９は、さまざまな導電材料が使用可能である
が、耐蝕性に富み、線膨張係数が比較的アルミナに近い
Ｓ Ｕ Ｓ ３０４が好適である（ ５ＵＳ３０４の線
膨張係数は１７×１０−６／℃、アルミナは７．９×１
０−６／℃である）。The thickness of the brazing is several tens of μm. Note that the eutectic silver solder foil may be a eutectic silver solder paste.O The lead terminal 9 can be made of various conductive materials, but S is highly corrosion resistant and has a coefficient of linear expansion that is relatively close to that of alumina. US 304 is suitable (the linear expansion coefficient of 5 US 304 is 17 x 10-6/℃, and that of alumina is 7.9 x 1
0-6/°C).
このリード端子９と電極膜２とは、リード線６によって
電気的に接続される。リード線６には。The lead terminal 9 and the electrode film 2 are electrically connected by the lead wire 6. For lead wire 6.
Ｐｔ、 Ａｕ、ムｅ、Ｔｉ、Ｎｉ、 ステアＶ７．鋼な
どの線材が利用できるが、高温および腐蝕性雰囲気中で
最も安定なｐｔ（！金）線が高価ではあるが最適である
。端子板が本発明のように感熱金属板に直接９、、
接着されるので、従来のように長い白金線を使わなくと
もよく、この点でも低コストを実現できる。Pt, Au, Mue, Ti, Ni, Steer V7. Wires such as steel can be used, but PT (!gold) wire is most stable at high temperatures and corrosive atmospheres, although it is more expensive. Since the terminal plate is directly bonded to the heat-sensitive metal plate as in the present invention, there is no need to use a long platinum wire as in the conventional method, and in this respect, costs can also be reduced.
製造工程も端子板とアルミナ基板を同一工程でろうづけ
でき、従来の端子板溶接工程を省略できる。端子板の構
成もシンプルで、従来の一対の端子板脚部をカシメる必
要が々い。The manufacturing process also allows the terminal plate and alumina substrate to be brazed in the same process, eliminating the conventional terminal plate welding process. The structure of the terminal board is simple, and there is no need to caulk a pair of conventional terminal board legs.
発明の効果
以上のように本発明の薄膜サーミスタによれば、次の効
果が得られる。Effects of the Invention As described above, the thin film thermistor of the present invention provides the following effects.
（１）アルミナ端子板をゲニウム感熱金属板にろうづけ
するので、従来の溶接による取付のように局部的な発熱
を生じることがなく、よってチタニウム感熱金属板のソ
リを防止でき５測温す・ べき対象物と、良好な密着を
保つことができる。(1) Since the alumina terminal plate is brazed to the genium heat-sensitive metal plate, there is no local heat generation unlike conventional welding installation, which prevents warping of the titanium heat-sensitive metal plate. It is possible to maintain good contact with the target object.
（２）チタニウム感熱金属板に従来のような溶接ちとか
生じないので、被測温部と門好な面接触がはかれ、サー
ミスタとしての応答性を向上できる。(2) Since the titanium heat-sensitive metal plate does not have welding cracks as in the conventional case, smooth surface contact with the temperature-measuring part can be achieved, and the responsiveness of the thermistor can be improved.
（３） アルミナ基板と端子板とを同一工程でろうづ
けでき、工程を大幅に簡素化できる。(3) The alumina substrate and the terminal board can be brazed in the same process, greatly simplifying the process.
１ｏ−飄−。1o-飄-.
（４）従来の端子板脚部（一対の金具）が不要となり、
また高価な白金リード線も従来より短くでき、低コスト
を実現できる。(4) The conventional terminal board legs (a pair of metal fittings) are no longer necessary,
Furthermore, the expensive platinum lead wire can be made shorter than before, resulting in lower costs.
（６）感熱金属板そのものをチタニウムとしたので２こ
れとアルミナ端子板の接着強度を強固にでき。(6) Since the heat-sensitive metal plate itself is made of titanium, the adhesive strength between it and the alumina terminal plate can be strengthened.
リード端子を端子板に固着しても、十分な引っ張り強度
が得られる。Even if the lead terminal is fixed to the terminal board, sufficient tensile strength can be obtained.
第１図は本発明の一実施例を示す薄膜サーミスタの斜視
図、第２図は同断面図、第３図は従来例を示す斜視図で
ある。
１・・・・アルミナ基板、２・・・・・・電極膜、３・
・・・・・薄膜感温抵抗層、９・・・・・・リード端子
、１ｏ・・・・・・アルミナ端子板、１１・・・・・・
チタニウム感熱金属板。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第２
図
第３図FIG. 1 is a perspective view of a thin film thermistor showing an embodiment of the present invention, FIG. 2 is a cross-sectional view of the same, and FIG. 3 is a perspective view of a conventional example. 1... Alumina substrate, 2... Electrode film, 3...
...Thin film temperature-sensitive resistance layer, 9...Lead terminal, 1o...Alumina terminal board, 11...
Titanium heat-sensitive metal plate. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 3
Claims (1)
電極膜および薄膜感温抵抗層と、被測温部位に接触する
チタニウム板より成る感熱金属板と、アルミナで形成さ
れた端子板と、前記端子板に固着されるリード端子とよ
り成り、前記アルミナ基板および端子板は、前記感熱金
属板にろうづけされ、かつ前記リード端子と前記アルミ
ナ基板の電極膜とは、電気的に接続されていることを特
徴とする薄膜サーミスタ。an alumina substrate, an electrode film and a thin film temperature-sensitive resistance layer formed on the surface of the alumina substrate, a heat-sensitive metal plate made of a titanium plate that comes into contact with the temperature-measured area, a terminal plate made of alumina, and the terminal plate. The alumina substrate and the terminal plate are brazed to the heat-sensitive metal plate, and the lead terminal and the electrode film of the alumina substrate are electrically connected. Characteristic thin film thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61062136A JPH0638363B2 (en) | 1986-03-19 | 1986-03-19 | Thin film thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61062136A JPH0638363B2 (en) | 1986-03-19 | 1986-03-19 | Thin film thermistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62219502A true JPS62219502A (en) | 1987-09-26 |
| JPH0638363B2 JPH0638363B2 (en) | 1994-05-18 |
Family
ID=13191365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61062136A Expired - Lifetime JPH0638363B2 (en) | 1986-03-19 | 1986-03-19 | Thin film thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638363B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01200601A (en) * | 1987-12-18 | 1989-08-11 | Emerson Electric Co | Temperature detector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884404A (en) * | 1981-11-12 | 1983-05-20 | 松下電器産業株式会社 | Thin film thermistor |
| JPS5951503A (en) * | 1983-08-01 | 1984-03-26 | 松下電器産業株式会社 | Thermistor |
-
1986
- 1986-03-19 JP JP61062136A patent/JPH0638363B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884404A (en) * | 1981-11-12 | 1983-05-20 | 松下電器産業株式会社 | Thin film thermistor |
| JPS5951503A (en) * | 1983-08-01 | 1984-03-26 | 松下電器産業株式会社 | Thermistor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01200601A (en) * | 1987-12-18 | 1989-08-11 | Emerson Electric Co | Temperature detector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0638363B2 (en) | 1994-05-18 |
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