JPS62219013A - Radiation controlling heat conduction surface - Google Patents

Abstract

PURPOSE:To control the quantity of radiation finely with a low space occupation rate and a simple constitution by bringing a composite layer plate-shaped body, where a plate-shaped member having a high heat conductivity and a plate-shaped member deformed in accordance with the variance of temperature are laminated, into contact with a substrate, which receives heat from a heat source, with a film surface having a high emissivity between them. CONSTITUTION:When the temperature of a substrate 4 is low, small composite layer pieces 7 are not deformed because there is scarecely a difference of expansion between a material 1 having a low thermal expansibility and a material 2 having a high thermal expansibility, and this radiation control heating surface is all covered with a surface 5 having a low emissivity to minimize the quantity of radiation to the external. The difference of expansion between said materials 1 and 2 is increased and small rectangular composite layer pieces 7 are deformed outward according as the temperature of the substrate 4 rises gradually. In this case, since the heat from the substrate 4 is transmitted much and quickly because of the existence of a material 3 having a high heat conductivity, small rectangular composite layer pieces 7 respond quickly and the extent of deformation is large. At this time, a most of the radiation control heating surface is occupied with a surface 6 having a high emissivity, and the quantity of radiation to the external is maximized to suppress the temperature rise of the substrate 4.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a radiation control heat transfer surface, and particularly to a radiation control heat transfer surface suitable for heat control of space equipment and semiconductor heat treatment equipment, for example. be.

[Conventional technology]

As a conventional radiant heat control technique, a technique described in, for example, Japanese Patent Laid-Open No. 154516/1983, which was developed as a heat control device for an artificial satellite, is known.

This technology is related to the control of the amount of heat dissipated from the heat dissipation surface that controls the amount of heat generated inside the satellite, and the blades of the thermal louver, which is a heat controller that is often used in practice to adjust the amount of heat dissipated, are made of bimetal. It is something.

[Problem that the invention seeks to solve]

The technology described in Japanese Patent Application Laid-open No. 59-154516 is an improvement on the complicated structure of thermal louvers that have been used for artificial satellites. be. However, in order to open and close the blade sufficiently, it is necessary to have sufficient displacement of the bimetal, but in a method that uses radiation from the heat sink and heat conduction of the bimetal, However, the problems of operation delay and small amount of bimetal displacement were not considered.

The present invention was made in order to solve the problems of the prior art described above, and aims to provide a radiation control heat transfer surface that occupies a small space, has a simple configuration, and is capable of finely controlling the amount of radiation. , that purpose.

[Means for solving problems]

The configuration of the radiation control heat transfer surface according to the present invention is as follows: 1. A multi-layered structure in which a plate-like member with high thermal conductivity and a plate-like member with good responsiveness that deforms according to temperature changes are laminated on a substrate that receives heat from a heat generation source. The plate-shaped body is brought into contact with a film surface having a high emissivity, and the multi-layered plate-shaped body is provided with a plurality of multi-layered pieces formed by cutting, and an abutment portion serving as one end of each of these laminated pieces is provided. ,
It is designed to be fixed onto the substrate.

[Effect]

According to the above-mentioned technical means, a multi-layer structure formed by a combination of a member with different coefficients of thermal expansion and a member with excellent thermal conductivity, or a combination of a shape memory alloy and a member with excellent thermal conductivity. By attaching one end of each of the plurality of multilayer small pieces of the plate-like body to the heat radiation surface on the substrate, heat from the heat radiation surface is quickly and in large quantities transferred to the plurality of multilayer small pieces. As a result, the multi-layered piece responds quickly and achieves large deformations, greatly improving thermal controllability.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 to 9.

First, FIG. 1 is a perspective view showing the configuration of a radiation control heat transfer surface according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the undeformed multilayer small piece of the radiation control heat transfer surface. , FIG. 3 is a perspective view showing the multilayer small piece when it is deformed.

In FIG. 1, 1 is a small suspension member made of a material with a small coefficient of thermal expansion, such as iron or a nickel alloy, and 2 is a material 1 with a large coefficient of thermal expansion, such as manganese.

It is a thermal expansion material made of copper and nickel alloy, and these small thermal expansion material 1 and large thermal expansion material 2 are made by bonding thin metal plates.
It is a so-called bimetal, and constitutes a highly responsive plate-like member that deforms according to temperature changes. The combination of the small thermal expansion material 1 and the large thermal expansion material 2 is not limited to the above bimetal, but may be a combination of synthetic resin and metal, for example.

3 is a large heat conductive material made of a material with high thermal conductivity, such as aluminum or copper; and 4 is a high heat conductive material.

This is a board that receives heat from a heating element.

The surface of the small thermal expansion material 1 forms a low emissivity surface 5 such as a film with a low emissivity, for example, a silver vapor-deposited mirror finish film. Also,
The surface of the substrate 4 serves as a heat dissipation surface by forming a high emissivity surface 6 such as a film with a high emissivity, such as a silver Teflon film.

In this way, a multilayer plate-like body in which a plate-like member made of the small thermal expansion material 1 and the large thermal expansion material 2 and a plate-like member made of the large thermal conductive material 3 are laminated is formed on the substrate 4 with a high emissivity. It is configured to abut via the surface 6. Then, by making partial incisions in a U-shape at multiple locations on this multilayer plate-like body and abutting the high emissivity surface 6 and the large heat conductive material 3 in a separated state, a rectangular multilayer small piece is formed. A plurality of small multilayer pieces 7 are formed, and the abutting portions serving as one ends of each of these multilayer small pieces 7 are fixed to the substrate 4 to constitute the radiation control heat transfer surface of this embodiment.

Next, the operation of the radiation control heat transfer surface of this example is shown in Figures 2 and 3.
This will be explained with reference to the figures.

First, when the temperature of the substrate 4 is low, there is almost no difference in expansion between the small thermal expansion material 1 and the large thermal expansion material 2, so the rectangular multilayer small piece 7 does not deform as shown in FIG. , the entire surface of this radiation control heat transfer surface is covered with a low emissivity surface 5. At this time, the amount of radiation to the outside becomes minimum.

As the temperature of the substrate 4 gradually rises, the small thermal expansion material 1
, the expansion difference of the large thermal expansion material 2 increases, and the rectangular multilayer small piece 7 deforms outward. In this case, due to the presence of the large heat conductive material 3, heat from the substrate 4 is quickly and in large quantities transferred to the thermally expandable material 2, so the response of the rectangular multilayer small piece 7 becomes faster and the deformation occurs. You can get a large amount. FIG. 3 shows a state in which the plurality of multilayer pieces 7 are sufficiently deformed. At this time, the high emissivity surface 6 occupies most of the surface of this radiation control heat transfer surface.

The amount of radiated heat to the outside is maximized, and the temperature rise of the substrate 4 is suppressed.

Next, FIG. 4 is a perspective view showing an example in which the multilayer small piece portion in FIG. 1 is further divided. In the figure, the same reference numerals as in FIG. 1 are the same parts as in the embodiment of FIG. 1, so the explanation thereof will be omitted.

In the embodiment shown in FIG. 4, the number of divisions of the rectangular multilayer small piece is increased, and the multilayer small piece 8 is obtained by further making a plurality of cuts in the multilayer small piece 7 shown in FIG. . In this way, it is possible to control the amount of radiation more precisely than in the embodiment shown in FIG.

Next, FIG. 5 is a perspective view showing the configuration of a radiation control heat transfer surface according to another embodiment of the present invention. Since they are equivalent parts, their explanation will be omitted.

In the embodiment shown in FIG. 5, a plate-like member made by laminating two types of members with different coefficients of thermal expansion is partially cut out, and the laminated member is made of a small thermal expansion material 1' and a fire thermal expansion material 2'. exists partially in a triangular shape.

The portion of the large heat conductive material 3 is formed into a rectangular shape similar to the embodiment shown in FIG. 4, and the triangular portion and the rectangular heat conductive material 3 constitute a multilayer small piece 9.

According to such a radiation controlled heat transfer surface, the first-order Fig. 1 and Fig. 4
In addition to the same effects as shown in the figure, it is also possible to reduce the weight of the radiation control heat transfer surface.

Next, still another embodiment of the present invention will be described with reference to FIGS. 6 and 7.

Here, FIG. 6 is a perspective view showing the configuration of a radiation control heat transfer surface according to still another embodiment of the present invention, and FIG. 7 is a perspective view showing an example in which the multilayer small piece part in FIG. 6 is further divided. It is a diagram. In the drawings, the same reference numerals as those in FIGS. 1 to 4 are the same parts as in the previous embodiment, so the explanation thereof will be omitted.

In FIG. 6, 10 is a shape memory alloy member, which constitutes a responsive plate member that deforms according to temperature changes. Reference numeral 3 denotes a large heat conductive material made of, for example, aluminum or copper, which is the same as that explained in FIG. A multi-layered plate-like body in which the shape memory alloy member 1o and the large heat conductive material 3 are laminated,
It is configured to abut on the substrate 4 via the high emissivity surface 6.

Then, by making partial incisions in a U-shape at multiple locations on this multilayer plate-like body and abutting the high emissivity surface 6 and the large heat conductive material 3 in a separated state, a rectangular multilayer small piece is formed. A plurality of small multi-layer pieces 11 are formed, and the abutting portions serving as one ends of each of these multilayer pieces 11 are fixed to the substrate 4 to constitute the radiation control heat transfer surface of this embodiment.

The operation of the radiation control heat transfer surface of the embodiment shown in FIG. 6 will now be described.

When the temperature of the substrate 4 is low and is below the transformation temperature of the shape memory alloy member 10, the rectangular multilayer small piece 11 does not deform, and the entire surface of this radiation control heat transfer surface is covered with the low emissivity surface 5. . At this time, the amount of radiation to the outside becomes minimum.

When the temperature of the substrate 4 rises and exceeds the transformation temperature of the shape memory alloy member 10, the rectangular multilayer piece 11 deforms outward. In this case, due to the presence of the large heat conductive material 3, heat from the substrate 4 is quickly and in large quantities transferred to the shape memory alloy member 1.
0, the response of the shape memory alloy member 10 is fast and the controllability is extremely good.When the plurality of multilayer small pieces 11 are sufficiently deformed, the surface of this radiation control heat transfer surface becomes a high emissivity surface 6. As a result, the amount of radiant heat radiated to the outside is maximized, and the temperature rise of the substrate 4 is suppressed.

Next, in the embodiment shown in FIG. 7, the number of divisions of the multilayer small piece is increased, and the multilayer small piece 12 is obtained by further making a plurality of cuts in the multilayer small piece 11 shown in FIG. In this way, it is possible to control the amount of radiation more precisely than in the embodiment shown in FIG.

Each of the above embodiments is a lightweight and highly reliable radiation control heat transfer surface that can be applied to heat control of space equipment such as artificial satellites, but the present invention is applicable not only to space equipment but also to semiconductor heat treatment equipment, etc. , it is also suitable for realizing fine-grained temperature pattern control as an alternative to conventional electric heater control.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to provide a radiation control heat transfer surface that can perform fine radiation amount control with a small space occupation rate and a simple configuration.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the configuration of a radiation control heat transfer surface according to an embodiment of the present invention, FIG. 2 is a perspective view showing the undeformed multilayer small piece of the radiation control heat transfer surface; 3 is a perspective view showing the deformation of the multilayer small piece, FIG. 4 is a perspective view showing an example in which the multilayer small piece in FIG. 1 is further divided, and FIG. 5 is a perspective view showing another embodiment of the present invention. FIG. 6 is a perspective view showing the configuration of a radiation control heat transfer surface according to yet another embodiment of the present invention; FIG. It is a perspective view which shows the example which further divided the multilayer small piece part in . 1.1'...Low thermal expansion material, 2,2'...Large thermal expansion material. 3... High heat conductive material, 4... Substrate, 5... Low emissivity surface, 6... High emissivity surface, 7, 8, 9, 11.12...
・Multilayer small piece, 1o...shape memory alloy member. ￥I 1 Eye 7-・-4J, l-gate 2nd figure I tJ+ M50 Yu￥r, + Ronet [4-1-nohay5 mouth 7th figure

Claims (1)

[Claims] 1. A multilayer plate-like body in which a plate-like member with high thermal conductivity and a plate-like member with good responsiveness that deforms according to temperature changes are laminated on a substrate that receives heat from a heat generation source, The multilayer plate-shaped body is provided with a plurality of multilayer small pieces formed by notches, and the abutting portion, which is one end of each of these multilayer small pieces, is brought into contact with the substrate through a film surface having a high emissivity. A radiation control heat transfer surface configured to be firmly fixed to the surface. 2. In the item described in claim 1, the responsive plate member that deforms in accordance with temperature changes is a radiation controlled transmission member formed by laminating at least two types of members having different coefficients of thermal expansion. Thermal side. 3. The radiation control heat transfer surface according to claim 1, wherein the responsive plate member that deforms according to temperature changes is formed of a shape memory alloy.