JPS5875220A - Temperature controller - Google Patents

Abstract

PURPOSE:To improve the heat conduction between a substrate and a contact plate, by forming a thin and wide liquid film which has no change due to the expansion of a container at a place between the substrate and the contact plate. CONSTITUTION:When the heating value of a device 1 increases, a working fluid 10 within a container 7 is heated. As a result, the pressure increases within the container 7, and therefore a bellows 8 forming the container 7 expands. Then a contact plate 9' has a contact with a heat sink 6 by the expansion of the bellows 8 when the pressure within the container 7 increases up to a certain level. Thus the heat transmitted to a substrate 2' from the device 1 is transmitted to a projected part 16 of the plate 9' put into the grooves 17 and 18 from a projected part 15 through a liquid film formed in a gap 19 of the fluid 10 within the grooves 17 and 18. The heat heats up the plate 9' and is discharged to outside through the heat sink 6 that has a contact with the plate 9'.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a temperature control device for controlling the temperature of equipment used in a vacuum to a constant value.

Temperature control in a vacuum, especially in outer space, is done by dissipating heat through radiation heat transfer, so controlling the amount of heat dissipation1-
Therefore, it is difficult to maintain the temperature of the equipment at a predetermined value, and for this reason, the present inventor has proposed a temperature control device shown in FIG. 1c. The structure and mechanism of this temperature control device will be explained using the drawings.

Two substrates made of a material with excellent thermal conductivity on which the equipment 1 to be controlled is mounted are placed at the bottom in the figure with bolts 4 and nuts 5 through heat insulating spacers 3 provided at the corners. It is made of a thermally conductive material and is adiabatically fixed at a distance of 14 to a heat dissipation plate 6 whose lower surface in the figure has been surface-treated to have high thermal emissivity. 7 is a 1A; retractable container placed between the 4x2 and the heat sink 6.

This container 7 is made of a good heat conductive member with a bellows 8 having one end fixed to the back surface of the substrate 2, and the other end of the bellows 8 being provided so as to be in contact with and away from the heat dissipation plate 6 on the closed side. It is composed of a contact plate 9. In this container 7,
A working fluid 1o with a relatively low boiling point is sealed, and a convex portion 2o provided on the back surface of the substrate 2 is partially immersed in at least the working fluid 10, and the container 7 expands and contracts due to the vapor pressure of the working fluid 10. In the figure, reference numeral 11 denotes an adjustment spring for setting the temperature at which the contact plate 9 contacts the heat sink 6, and is a spring whose one end is fixed to the flange of the contact plate 9 and the substrate 2. 111 IC is provided at the other end of the large diameter portion of the guide pin 12.
1? h11 The device 1 that should be visited is the device body 21 and the panel 2.
It is installed on the 2nd and 1st part is installed. Further, reference numeral 13 indicates a gas phase formed in the container 7 containing the working fluid 10, and 1.47'l: liquid phase.

Next, we will explain the operation of the heat radiation amount control device with the above configuration.

The heat generated from device 1, which is the heating element for temperature control, is transferred to board 2.
The working fluid 10 in the retractable volume 57 is further transmitted to the
heat up. In this case, the position of the contact plate 9 of the container 7 facing the heat sink 6 is determined under the condition that the spring force determined by the adjustment spring 11 and the bellows 8 and the vapor pressure of the working fluid 10 in the container 7 are balanced.

When the working fluid 10 is heated to a predetermined temperature υ11 and the vapor pressure increases, the bellows 8 expands and the container 7 expands, and the contact plate 9 is pushed and comes into contact with the heat sink 6, and heat transfer occurs at the contact surface. The heat is radiated from the heat sink plate 6 by radiant heat transfer, and the equipment 1 is cooled.

In this way, when the equipment 1 is cooled to a predetermined value -Alf or more from 1 to t1, the work force 11if in the container 7 + the steam tF of the fluid 10 decreases, which is determined by the adjustment spring 11 and the bellows 8. Spring force tc 1: The container 7 contracts,
The contact plate 9 is separated from the heat sink 6, and heat radiation stops.

Below, the container 7 (rN contact plate 9 and heat sink 6 repeatedly come into contact and separate from each other with the set temperature as a boundary), and the device 1 can be automatically raised to a predetermined crystallinity. .

By the way, On IK City 11 Gong 11 is this Niuna 1%r
) When one operation is complete, the working fluid 10 has a gas phase 13 and a liquid (
l1114 coexists.

In order to achieve good heat transfer from the substrate 2 to the contact plate 9, the surface of the substrate 2 that is in contact with the working fluid, that is, the convex portion 20, is exposed by the action of the liquid phase + R# fluid 1. There must be.

If all the parts of the substrate 2 that are in contact with the working fluid 10 are drained of the gas phase working fluid 1, the heat transfer from the substrate 2 to the contact plate 9 will be significantly reduced, resulting in a decrease in the performance of the warm controller. is possible.

For this reason, it is necessary to ensure that a portion of the convex portion O of the substrate 2 is always covered with the liquid-phase working fluid.

In this case, the heat transfer ability between the substrate 2 and the contact plate 9 is determined by the thickness and area of the liquid film formed between the convex portion 20 and the contact plate 9, and the liquid film should be made as thin as possible. It is desirable to make the area as wide as possible to improve heat transfer performance.

However, when the degree of heat dissipation of the substrate 2 increases and heat dissipation capability is most required, the container elongates and the thickness of the liquid film increases, which may reduce the heat dissipation capability.

The present invention has been made in view of these circumstances.
The purpose is to form a thin and wide liquid film between the substrate and the contact plate that does not change due to the elongation of the container, thereby improving heat transfer from the substrate to the contact plate.

An embodiment of the present invention will be described below with reference to FIG. Note that the same parts as in FIG. 1 are given the same reference numerals and their explanation will be omitted.

In the figure, reference numeral 15 denotes a plurality of protrusions with a rectangular cross section provided on the back side of the substrate 2' on which the device 1 is mounted.
Reference numeral 16 denotes a plurality of protrusions protruding toward the inner side of the container of the contact plate 9' provided on the container 7 so as to come into contact with and separate from the heat sink 6. Both protrusions 15 and 16 correspond to each other. Groove 17
, 181//: be arranged with a narrow gap 19 in the 1ulI plane. The protrusion height of the protrusion +t1 part 15.16 is the height of the protrusion of the container 7.
The dimensions are set to form a sufficient gap 19 on each corresponding side surface even if the 7 expands and contracts, and the liquid film of the working fluid 10 is
The gap 19 is set so that it does not come out of the liquid even when the gap 19 expands and contracts.As a result, a liquid film is always formed on the side surfaces of the protruding parts 15 and 16 of the gap 19.

With such a configuration, when the heat generation of the device 1 increases, the working fluid 10 in the container 7 is caused by the heat generated in the device 1.
is heated, and as a result, the pressure inside the container 7 increases. Therefore, the bellows 8 forming the container 7 expands, and the container 7
When the FE force within increases to a certain value, the contact plate 9' comes into contact with the heat dissipation plate 6 due to the above expansion. In this case, device 1
The heat I4 transferred from the surface of the protrusion 15, 16 of the working fluid 10 to the heat dissipation plate 6 via the contact plate q due to the conductive action of the thin liquid film formed on the surface t of the protrusion 15, 16 of the working fluid 10. The heat transferred to the substrate 2' is transferred from the protrusion 15 to the groove 17.
．． The protrusion 1 of the contact plate 9'' inserted into the groove 17.18 through the saliva film formed in the gap 19 of the working fluid 10 in 18
6 and heats the contact plate 9', and the heat is radiated to the outside 1 from the heat radiating plate 6 with which the contact plate 9 is in contact. As a result, the temperature on the equipment can be suppressed to a certain value (1).The thickness of the liquid film does not change even if the container 7 expands and contracts, so a stable and thin liquid film can be obtained. , when the calorific value of the device 1 is small (t = 1), the heat transferred to the working fluid 10 also decreases, and when this heat 1 becomes less than a certain value, the temperature inside the container 7 decreases, and as a result, the bellows 8 contracts and the contact plate 9' separates from the heat sink 6.When this happens,
Cooling of the device 1 is suppressed, and the temperature is maintained at a temperature where the heat generation amount of the device 1 and the heat radiation Wt not including the heat sink 6 are balanced. Therefore, if the temperature and the expansion/contraction characteristics of the container 7 are set as desired in advance, the temperature on the device can be kept constant. Also, the protrusion 15 provided on the substrate 2' and the contact plate 9'
．． 16 with a small pitch, the protrusion 15.16
The area of the liquid film formed, that is, the heat transfer area, can be significantly expanded, and the transfer capacity can be increased by 1!4.

As explained above, the present invention (C) provides a temperature control device that can obtain better heat transfer characteristics with a simple configuration, can perform stable functions, and is highly reliable. I can do it.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a temperature control II device, and FIG. 2 is a sectional view showing an embodiment of the present invention. ↓...Equipment, 2'...Hanawa board, 6...Radiation plate, 7 River continuation, 8...Bellows, 9'...Contact plate, 10...
Working/working fluid. 15.16... Protrusion, 17.18... Groove, 19.
··gap. Agent: Patent attorney Kensuke Chika (and 1 other person)

Claims (1)

[Scope of Claims] A board on which a device serving as a heat generating element whose temperature is to be controlled is mounted on one side, a heat sink located on the other side of this board and fixed in an insulating manner at intervals, and this A retractable container is located between the heat sink and the above-mentioned ship board, one end of which is fixed at the edge plate 1c 1iA1, and the other end surface is in contact with and separates from the heat sink; The sealed working fluid, the substrate, and the bottom surface of the container that faces the substrate and contacts the heat sink are respectively interlocked and protruded and sunk inside the container with a minute gap on the side in the direction of expansion and contraction of the container. 1. A heating control device characterized in that the end faces of a plurality of cut protrusions come into contact with a heat radiating plate to radiate heat from the equipment.