JPS5987520A - Temperature control device - Google Patents

Abstract

PURPOSE:To raise a transfer capacity of heat by forming a thin and wide liquid film which is not varied by elongation of a vessel between a substrate on which a heating element is loaded, and a contact plate which is provided on the bottom part of an elastic vessel and contacts with and is separated from a radiator plate. CONSTITUTION:Plural projecting parts 15 consisting of a good heat conductive member are provided on the reverse side of a substrate 2' on which a heating apparatus 1 is loaded, and also plural projecting parts 16 consisting of a good heat conductive member are provided on a contact plate 9' which is provided on a vessel 7 so as to contact with and be separated from a radiator plate 6. The projecting parts 15, 16 have a narrow gap 19 and are placed on the side face of corresponding grooves 17, 18 which are formed respectively, and a liquid quantity of an operating fluid 10 is set to a quantity by which the gap 19 does not go out from the liquid even if the vessel 7 expands and contracts by a bellows 8. As a result, a liquid film is always formed on the side face of the projecting parts 15, 16 of the gap 19, a heat transfer area formed on the projecting parts 15, 16 is expanded, and a large heat transfer capacity can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical field to which the invention pertains] The present invention relates to a temperature control device for controlling the temperature of equipment used in a vacuum to a constant level.

[Prior art and its problems]

Temperature control in a vacuum, especially in outer space, is performed by dissipating heat through radiant heat transfer, so it is difficult to maintain the temperature of equipment at a predetermined value by controlling the amount of heat dissipation. Additionally, equipment operating in space requires small plates, light weight, and long life. For this reason, we proposed the temperature control device shown in FIG. 1 to the present inventor. The structure and mechanism of this temperature control device will be explained using the drawings.

A board 2, which is made of a welded material of a member with excellent thermal conductivity and a strength member, on which a device 1 to be temperature controlled is mounted, is connected to a bolt 4 and a nut 5 through a heat insulating spacer 3 provided at its corner. It is adiabatically fixed at intervals to a heat dissipation plate 6 which is made of a member with good thermal conductivity and whose lower surface in the figure has been surface-treated to have a high thermal emissivity. Reference numeral 7 denotes an expandable container placed between the substrate 2 and the heat sink 6, and this container 7 has a bellows 8 made of a strength member fixed to the back surface of the substrate 2 at one end.
It is comprised of a contact plate 9 which closes the other end of the bellows 8 and is made of a welded material of a good heat conductive member and a strength member, which are provided so as to be in contact with and separate from the heat sink plate 6. Further, a working fluid 10 having a relatively low boiling point is sealed in the container 7, and a convex portion provided on the back surface of the substrate 2 is at least partially immersed in the working fluid 10. The container 7 expands and contracts due to the steam pressure. In the figure, reference numeral 11 denotes an adjustment spring for setting the temperature at which the contact plate 9 contacts the heat dissipation plate 6. One end of the spring 11 is fixed to the flange of the contact plate 9 and the substrate 2, and the other end of the guide pin 12 has a large diameter. It is located between the sections. Further, in the figure, the device 1 whose temperature is to be controlled is constructed by mounting a device body 21 on a panel 22.

Further, reference numeral 13 denotes a container 7 in which the working fluid 10 is stored.
It is a gas phase formed within the 14-phase liquid phase. Further, in the figure, parts 23 and 24 are strength members, and parts 20 and 9 are members with excellent thermal conductivity.

Next, the operation of the heat radiation amount control device having the above configuration will be explained.

The heat generated from the equipment, which is the heating element whose temperature should be controlled, is transferred to the board 2.
The working fluid 10 in the expandable container 7 is further heated. In this case, the spring force determined by the heat radiating plate 6 and the opposed rose 8 and the vapor pressure of the working fluid 10 in the container 7 are determined under a condition that they are in equilibrium.

When the working fluid 10 is heated to a predetermined temperature or higher and its vapor pressure increases, the bellows 8 stretches, the container 7 expands, and the contact plate 9
is pressed and comes into contact with the heat radiating plate 6, heat is transferred on this contact surface, and heat is further radiated from the heat radiating plate 6 by radiant heat transfer, thereby cooling the device 1.

When the equipment 1 is cooled to a predetermined temperature or lower in this way, the vapor pressure of the working fluid 10 in the container 7 decreases, and the container 7 is cooled by the spring force determined by the adjustment spring 11 and the bellows 8. Upon contraction, the contact plate 9 separates from the heat sink 6, and heat radiation stops.

By repeating contact and separation between the contact plate 9 of the container 7 and the heat sink 6 after reaching the set temperature, the device 1 can be automatically controlled to a predetermined temperature.

By the way, when the temperature controller operates in this manner, the working fluid 10 is in a state where the gas phase 13 and the liquid phase 14 coexist.

In order to perform good heat transfer from the substrate 2 to the contact plate 9, the surface of the substrate 2 that is in contact with the working fluid, that is, the convex portion 2
0 must be covered by the working fluid in liquid phase.

If the entire surface of the substrate 2 that is in contact with the working fluid 10 is covered with the gas-phase working fluid, the heat transfer Fi from the substrate 2 to the contact plate 9 will drop significantly, and the temperature 1itlJ'@J will also deteriorate in performance. I can think of it as k-ra-ding.

For this reason, it is necessary that a portion of the convex portion 20 of the substrate 2 is always covered with the liquid-phase working fluid.

In this case, the heat transfer ability between the substrate 2 and the contact plate 9 is determined mainly by the thickness and area of the liquid film formed between the convex portion 20 and the contact plate 9. In terms of heat transfer performance, it is desirable to make the liquid film as thin as possible and make the area as wide as possible.

However, when the temperature of the substrate 2 becomes high and heat dissipation capability is most required, the container stretches and the liquid film becomes thicker, which may reduce the heat dissipation capability.

[Purpose of the invention]

The present invention has been made in view of these circumstances.
There is a thin (
The purpose is to form a wide liquid film and improve heat transfer from the substrate to the contact plate.

An embodiment of the present invention will be described below with reference to FIG. Note that the same parts as in FIG. 1 are given the same reference numerals and their explanations will be omitted.

In the figure, reference numeral 15 indicates a protrusion made of a plurality of highly thermally conductive members with a rectangular cross-sectional shape provided on the back surface of the board 2' on which the device 1 is mounted, and 16 indicates a protrusion that connects and separates from the heat sink 6. Similar to the plurality of protrusions 15 protruding from the inner surface of the container 9' of the contact plate 9' provided on the container 7, these protrusions are made of a material with good thermal conductivity, and the corresponding grooves formed in each of the protrusions 15 and 16Fi are 17 and 18 with a narrow gap 19 between the sides. The protrusion heights of the protrusions 1.5 and 16 are set to such a size that even when the container 7 expands and contracts, a light-sized gap 19 is formed on each corresponding side surface, and the amount of the working fluid 10 is adjusted so that the volume of the working fluid 10 is determined according to the expansion and contraction of the container 7. The gap 19 is also set to an amount that does not come out from within the liquid. As a result, a liquid film is always formed on the side surfaces of the protrusions 15 and 16 in the gap 19.

With such a configuration, when the amount of heat generated by the device 1 increases, the heat generated by the device 1 causes the working fluid 10 in the container 7 to
is heated, and as a result, the pressure inside the container 7 increases. For this reason, the bellows 8 constituting the container 7 expands, and the container 7
When the internal pressure rises to a certain value, the contact plate 9' comes into contact with the heat sink 6 due to the above expansion. In this case, the heat transferred from the device 1 through the substrate 2' is transferred to the heat sink 6 through the contact plate 9' due to the conduction effect of the thin liquid film formed on the surface of the protruding portions 15 and 16 of the working fluid 10. transmitted to. That is, the heat transferred to the substrate 2' is transferred from the protrusion 15 to the groove 17.
, 18 through the liquid film formed in the gap 19 of the working fluid 10 to the protrusion 16 of the contact plate 9' inserted in the groove 17, 1.8, heating the contact plate 9' and causing the contact plate to heat up. 9
' is radiated to the outside from the heat sink 6 that is in contact with the heat dissipation plate 6. This allows the temperature of the device 1 to be suppressed to a certain value.

Since the thickness of the liquid film does not change even if the container 7 expands and contracts, a stable and thin liquid film can be obtained. On the other hand, device 1
When the amount of heat generated is small, the amount of heat transferred to the working fluid 10 is also small. When this amount of heat becomes less than a certain value, the pressure inside the container 7 decreases, and as a result, the bellows 8 5 contracts and the contact plate 9' is separated from the heat sink 6. This happens when,
Cooling of the device 1 is suppressed, and the device 1 is maintained at a temperature where the amount of heat generated and the amount of heat radiated without the heat sink 6 are balanced. However, if the temperature and the expansion/contraction characteristics of the container 7 are set as desired in advance, the temperature of the device 1 can be kept constant. Also, the protrusion 15 provided on the substrate 2' and the contact plate 9'
, 16 are provided at a small pitch, the protrusions 15 , 1
The area of the liquid film formed in 6, that is, the heat transfer area can be significantly expanded, and a large transfer capacity can be obtained.

As explained above, according to the present invention, it is possible to obtain better heat transfer characteristics with a simple configuration, to be compact and lightweight, to exhibit stable functions for a long time, and to achieve highly reliable temperature control. We can provide equipment.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a temperature control device, and FIG. 2 is a sectional view showing an embodiment of the present invention. Left...equipment, 2'...board, 6...heat sink, 7.
...Container, 8...Bellows, 9'...Contact plate, 1o
...Working fluid, 15°16...Protrusion, 17, 1
8...Groove, 19...Gap.

Claims (1)

[Claims] A board on which a device serving as a heat generating element whose temperature is to be controlled is mounted on one side, a heat sink located on the other side of the board and fixed adiabatically at a distance from the board, and a heat sink and the board mounted on one side. an expandable container located between the substrate and fixed to one end of the substrate and provided with the other end surface in contact with the heat sink; and the container facing the substrate and in contact with the heat sink. A temperature control device characterized in that the entire device has a simple and compact structure by using a welded material made of a strong material and a light and heat conductive material on the bottom surface.