JPS5844755A - Forcibly cooling heat sink - Google Patents

Forcibly cooling heat sink

Info

Publication number
JPS5844755A
JPS5844755A JP14412281A JP14412281A JPS5844755A JP S5844755 A JPS5844755 A JP S5844755A JP 14412281 A JP14412281 A JP 14412281A JP 14412281 A JP14412281 A JP 14412281A JP S5844755 A JPS5844755 A JP S5844755A
Authority
JP
Japan
Prior art keywords
heat sink
heat
fins
temperature
bimetal structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14412281A
Other languages
Japanese (ja)
Other versions
JPS6219073B2 (en
Inventor
Tsuneaki Tajima
田島 恒明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14412281A priority Critical patent/JPS5844755A/en
Publication of JPS5844755A publication Critical patent/JPS5844755A/en
Publication of JPS6219073B2 publication Critical patent/JPS6219073B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a heat sink which has preferable heat dissipating characteristic by dividing part of metal cooling fins implanted in parallel with each other in a bimetal structure. CONSTITUTION:A heat sink 5 is integrally mounted on the back surface of a substrate 2 which carries a heat generating body, and fins 3 and a bimetal structure 6 are provided in parallel with each other. When the quantity of heat is increased and the heat sink 5 becomes high temperature, a bimetal structure 6 is bent, causing the flow of the fluid to be disordered. Accordingly, the heat dissipating characteristic of the heat sink is enhanced. The bent is increased as the temperature rises, thereby increasing the effect, followed by operating to maintain the temperature of the heat generating body constant.

Description

【発明の詳細な説明】 本発明は、強制冷却用のと−tシ/りに関する。[Detailed description of the invention] TECHNICAL FIELD The present invention relates to a tormentor for forced cooling.

電子装置において、L8I等の発熱体の温度を一定に保
つことは装置の動作信頼性の上から非常に重要なことで
ある。
In electronic devices, it is very important to maintain a constant temperature of a heating element such as an L8I from the viewpoint of operational reliability of the device.

従来、この種の装置に強制冷却用として用いられている
ヒートシンクは、第1図に示すように、フィン3が矩形
平面形状をしており複数のフィンが平行してヒートシン
ク1上に植立されている。ヒートシンク1の放熱特性は
、ヒートシンク1から周囲流体4へ伝達される熱量を一
定としたとき、ヒートシンクlと周囲流体4との温度差
の大小によって決まり、その温度差が小さいほど優れて
いる。ヒート7ンク1と周囲流体4との温度差へTは次
の(1)式で表わされる。
Conventionally, in the heat sink used for forced cooling in this type of device, the fins 3 have a rectangular planar shape, and a plurality of fins are installed in parallel on the heat sink 1, as shown in FIG. ing. The heat dissipation characteristics of the heat sink 1 are determined by the size of the temperature difference between the heat sink 1 and the surrounding fluid 4, assuming that the amount of heat transferred from the heat sink 1 to the surrounding fluid 4 is constant, and the smaller the temperature difference, the better. The temperature difference T between the heat 7 tank 1 and the surrounding fluid 4 is expressed by the following equation (1).

ΔT=Q/(αx8xφ)・・・・−・−・−・(1)
ここで Q:ヒートシンク1から周囲流体4へ伝達され
る熱α:熱伝達係数 8:ヒートシンク1の周囲流体4と接する表拘積φ:ヒ
ートシンク1のフィン3の効率 (1)式においてSとφは゛ヒートシンクlの形状によ
って決まる値でるり、またQFi一定と考えられるから
、△Tはαに反比例し、αが大きい程ヒートシンク1と
周囲流体4との温度差が小さいことがわかる。またαは
周囲流体4の流れの乱れの程度によって変化し、流れが
乱れているほど大きくなる。従ってヒートシンク1と周
囲流体4との温度差△Tは、周囲流体4の流れが乱れて
いる程小さくなる・ ところが従来のヒートシンクの場合、この乱れが少なi
ために放熱特性が低いとiう欠点があつた。
ΔT=Q/(αx8xφ)・・・・−・−・−・(1)
Here, Q: Heat transferred from heat sink 1 to surrounding fluid 4 α: Heat transfer coefficient 8: Surface constraint of heat sink 1 in contact with surrounding fluid 4 φ: Efficiency of fin 3 of heat sink 1 In equation (1), S and φ It is determined by the shape of the heat sink 1, and since QFi is considered to be constant, ΔT is inversely proportional to α, and it can be seen that the larger α is, the smaller the temperature difference between the heat sink 1 and the surrounding fluid 4 is. Further, α changes depending on the degree of turbulence in the flow of the surrounding fluid 4, and becomes larger as the flow becomes more turbulent. Therefore, the temperature difference △T between the heat sink 1 and the surrounding fluid 4 becomes smaller as the flow of the surrounding fluid 4 becomes more turbulent. However, in the case of a conventional heat sink, when this turbulence is less
Therefore, it had the disadvantage of poor heat dissipation characteristics.

本発明の目的は放熱特性の優れた構造のヒートシンクを
提供することにある。
An object of the present invention is to provide a heat sink having a structure with excellent heat dissipation characteristics.

前記目的を達成するために、本発明に上る強制冷却用ヒ
ートシンクは、金属平面板の片函に矩形平板状のフィン
を平行に複数植立させたヒートシンクにおいて、前記フ
ィンの一部を区切りバイメタル構造にしである。
In order to achieve the above object, the forced cooling heat sink according to the present invention is a heat sink in which a plurality of rectangular flat plate-like fins are planted in parallel on a metal flat plate box, in which a part of the fins is separated to form a bimetal structure. It's Nishide.

上記構成によれば、温度が上昇するとバイメタル構造を
したフィンが湾曲し、周囲流体の流れを乱し、放熱特性
が向上するので、本発明の目的は完全に達成される。
According to the above configuration, when the temperature rises, the bimetallic structure fins curve, which disturbs the flow of the surrounding fluid and improves the heat dissipation characteristics, so that the object of the present invention is completely achieved.

次に本発明について図面を参照して詳細に説明する。第
2図は本発明の害施例を示す斜視図である。
Next, the present invention will be explained in detail with reference to the drawings. FIG. 2 is a perspective view showing an embodiment of the present invention.

図示しないL8I等の発熱体を複数搭載した基板2の裏
面にヒートシンク5が一体的に設けられており、ヒート
シンク5K[従来と同様のフィン3とバイメタル構造を
有するバイメタル構造部6が並設され、並設されたフィ
ン3、およ立されている。
A heat sink 5 is integrally provided on the back surface of a substrate 2 on which a plurality of heat generating elements such as L8I (not shown) are mounted, and a heat sink 5K [similar to conventional fins 3 and a bimetal structure section 6 having a bimetal structure are arranged in parallel, The fins 3 arranged in parallel are also erected.

このように構成された本発明によるヒートシンクは、発
ハ体の発熱量が少なくヒートシンク5の温度が低い時に
、第2図(1)に示すように従来のヒートシンク1と同
じフィン形状をしているが4発熱体の発熱量が増してヒ
ートシンク5の温度が高くなると、第2図(b) K示
すように、フィン3のバイメタル構造を有する部分、1
かth方バイメタル構造部6妻埋ぶ]が湾曲して、流体
に対1.て突出部を形成し流れを乱す効果を発揮する。
The heat sink according to the present invention configured as described above has the same fin shape as the conventional heat sink 1 as shown in FIG. When the heat generation amount of the fin 3 increases and the temperature of the heat sink 5 increases, as shown in FIG.
The bimetallic structure (6 ends) is curved to allow fluid to flow through the 1. This creates a protrusion and has the effect of disrupting the flow.

つ1す、前述の(1)式のαが大きくなりヒートシンク
5の放熱特性を高揚させることができる。この効果け、
ヒートシンク5の温度がさらに高くなると、バイメタル
構造部6の湾曲がさらに大きくなるので増大し、発熱体
の温度を一定にする方向に作用する。
First, α in the above-mentioned equation (1) becomes large, and the heat dissipation characteristics of the heat sink 5 can be improved. This effect,
As the temperature of the heat sink 5 becomes higher, the curvature of the bimetal structure 6 becomes larger and increases, which acts to keep the temperature of the heating element constant.

なお、以上説明した本発明の実施例に示すバイメタル構
造部6の湾曲方向および位[Fi−例で麿ノリ、湾曲方
向が一定方向だけでなi場合および複数のバイメタル構
造部6を4する場合等も、本発明に包括される。
Note that the bending direction and position of the bimetal structure 6 shown in the embodiments of the present invention described above are different from each other. etc. are also included in the present invention.

本発明は以上説明した工うに、ヒートシンクのフィンの
一部をバイメタル構造にすることにより、発熱体の温度
上昇とともにバイメタル構造部が湾曲して周囲流体の流
れを乱すことにより、放熱特性を高揚させることができ
るという効果がある。
As explained above, the present invention improves heat dissipation characteristics by forming part of the fins of the heat sink into a bimetallic structure, so that the bimetallic structure curves as the temperature of the heating element rises and disturbs the flow of the surrounding fluid. It has the effect of being able to

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のヒートン/りを示す斜視図、第2図は本
発明によるヒートシンクの実施例を示す斜視図である。 1.5・・・ヒートシンク  2・・・基板3・・・フ
ィン       4・・・周囲流体6・・・バイメタ
ル構造部 特許出願人  日本電気株式会社 代理人 升埋士 井) ロ   壽 才1図 第2図 (a) (b) 265−
FIG. 1 is a perspective view showing a conventional heat sink, and FIG. 2 is a perspective view showing an embodiment of a heat sink according to the present invention. 1.5...Heat sink 2...Substrate 3...Fin 4...Surrounding fluid 6...Bimetal structure Patent applicant NEC Corporation Agent Masuji I) B Jusai Figure 1 Figure 2 (a) (b) 265-

Claims (1)

【特許請求の範囲】[Claims] 金属平面板の片面に矩形平板状のフィンを平行に複数植
立させたヒートシンクにおいて、前記フィンの一部を区
切りバイメタル構造にしたことを特徴とする強制冷却用
ヒートシンク。
1. A heat sink for forced cooling comprising a plurality of rectangular flat plate-shaped fins planted in parallel on one side of a flat metal plate, characterized in that a portion of the fins is separated to form a bimetallic structure.
JP14412281A 1981-09-11 1981-09-11 Forcibly cooling heat sink Granted JPS5844755A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14412281A JPS5844755A (en) 1981-09-11 1981-09-11 Forcibly cooling heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14412281A JPS5844755A (en) 1981-09-11 1981-09-11 Forcibly cooling heat sink

Publications (2)

Publication Number Publication Date
JPS5844755A true JPS5844755A (en) 1983-03-15
JPS6219073B2 JPS6219073B2 (en) 1987-04-25

Family

ID=15354700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14412281A Granted JPS5844755A (en) 1981-09-11 1981-09-11 Forcibly cooling heat sink

Country Status (1)

Country Link
JP (1) JPS5844755A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994023449A1 (en) * 1993-03-31 1994-10-13 Yong Nak Lee Heat sink apparatus
US20110296826A1 (en) * 2010-06-02 2011-12-08 GM Global Technology Operations LLC Controlling heat in a system using smart materials
JP2013002735A (en) * 2011-06-16 2013-01-07 Fujitsu Ltd Heat exchanger and information processing system using the same
JP2013242740A (en) * 2012-05-22 2013-12-05 Hitachi Ltd Cooling method of multiprocessor server
EP3644697A1 (en) * 2018-10-22 2020-04-29 ZF Friedrichshafen AG Cooling module for a vehicle control device, vehicle control device comprising a cooling module and method for water cooling of a vehicle control device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012209765A1 (en) * 2011-06-16 2012-12-20 GM Global Technology Operations LLC (n.d. Ges. d. Staates Delaware) Cooling assembly adapted for use with exothermic system, has active material element is operable to undergo reversible change in fundamental property when exposed to or occluded from activation signal

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994023449A1 (en) * 1993-03-31 1994-10-13 Yong Nak Lee Heat sink apparatus
US20110296826A1 (en) * 2010-06-02 2011-12-08 GM Global Technology Operations LLC Controlling heat in a system using smart materials
US8640455B2 (en) * 2010-06-02 2014-02-04 GM Global Technology Operations LLC Controlling heat in a system using smart materials
JP2013002735A (en) * 2011-06-16 2013-01-07 Fujitsu Ltd Heat exchanger and information processing system using the same
JP2013242740A (en) * 2012-05-22 2013-12-05 Hitachi Ltd Cooling method of multiprocessor server
EP3644697A1 (en) * 2018-10-22 2020-04-29 ZF Friedrichshafen AG Cooling module for a vehicle control device, vehicle control device comprising a cooling module and method for water cooling of a vehicle control device

Also Published As

Publication number Publication date
JPS6219073B2 (en) 1987-04-25

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