JPS6221543U - - Google Patents

Info

Publication number
JPS6221543U
JPS6221543U JP11409385U JP11409385U JPS6221543U JP S6221543 U JPS6221543 U JP S6221543U JP 11409385 U JP11409385 U JP 11409385U JP 11409385 U JP11409385 U JP 11409385U JP S6221543 U JPS6221543 U JP S6221543U
Authority
JP
Japan
Prior art keywords
substrate
containers
sides
cooling device
heat generating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11409385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11409385U priority Critical patent/JPS6221543U/ja
Publication of JPS6221543U publication Critical patent/JPS6221543U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図はそれぞれ本考案の第1実施
例及び第2実施例を示す断面図、第3図は従来の
冷却装置の構造を示す正断面図、第4図はその一
部切欠側面図、第5図は従来装置における欠点を
説明する図である。 1:プリント基板、2:発熱部品、3:可撓性
容器、4:ケース、5:一次冷媒、6:可撓性膜
、7:冷却体、8:蒸気溜。
Figures 1 and 2 are sectional views showing the first and second embodiments of the present invention, respectively, Figure 3 is a front sectional view showing the structure of a conventional cooling device, and Figure 4 is a partially cutaway view. The side view, FIG. 5, is a diagram illustrating the drawbacks of the conventional device. 1: Printed circuit board, 2: Heat generating component, 3: Flexible container, 4: Case, 5: Primary refrigerant, 6: Flexible film, 7: Cooling body, 8: Steam reservoir.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発熱部品が実装されている基板と冷却体との間
に一次冷媒を封じ込んだ可撓性膜からなる容器を
介在させた冷却装置において、前記容器を基板の
両側に配置し、かつその両側に配置された容器を
互いに連絡したことを特徴とする半導体素子等の
冷却装置。
In a cooling device in which a container made of a flexible film containing a primary refrigerant is interposed between a substrate on which heat generating components are mounted and a cooling body, the containers are arranged on both sides of the substrate, and the containers are placed on both sides of the substrate. 1. A cooling device for semiconductor devices, etc., characterized in that arranged containers are connected to each other.
JP11409385U 1985-07-24 1985-07-24 Pending JPS6221543U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11409385U JPS6221543U (en) 1985-07-24 1985-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11409385U JPS6221543U (en) 1985-07-24 1985-07-24

Publications (1)

Publication Number Publication Date
JPS6221543U true JPS6221543U (en) 1987-02-09

Family

ID=30996510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11409385U Pending JPS6221543U (en) 1985-07-24 1985-07-24

Country Status (1)

Country Link
JP (1) JPS6221543U (en)

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