JPS63170993U - - Google Patents
Info
- Publication number
- JPS63170993U JPS63170993U JP6343787U JP6343787U JPS63170993U JP S63170993 U JPS63170993 U JP S63170993U JP 6343787 U JP6343787 U JP 6343787U JP 6343787 U JP6343787 U JP 6343787U JP S63170993 U JPS63170993 U JP S63170993U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- thick film
- printed circuit
- film hybrid
- control unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案に係わるコントロールユニツト
の一実施例を示す断面図、第２図は同上実施例に
おける厚膜混成ＩＣの拡大図、第３図は同上実施
例における特性調整方式を示す概略図、第４図は
従来のコントロールユニツトの断面図である。
４……箱状容器、５……プリント基板、６……
厚膜混成ＩＣ、７……フレキシブルプリント基板
、８……回路ブロツク体、９……印刷抵抗、１０
……チツプ部品、１１……ＩＣ（チツプ）、１２
……印刷抵抗、１３……ＩＣ（ミニフラツト）、
１４……デイスクリート部品。
Fig. 1 is a sectional view showing an embodiment of a control unit according to the present invention, Fig. 2 is an enlarged view of a thick film hybrid IC in the above embodiment, and Fig. 3 is a schematic diagram showing a characteristic adjustment method in the above embodiment. , FIG. 4 is a sectional view of a conventional control unit. 4... Box-shaped container, 5... Printed circuit board, 6...
Thick film hybrid IC, 7... Flexible printed circuit board, 8... Circuit block body, 9... Printed resistor, 10
...Chip parts, 11...IC (chip), 12
...Printed resistance, 13...IC (mini flat),
14...Discrete parts.
Claims (1)
配設されたプリント基板上面に立てた状態で支持
されてなる厚膜混成ＩＣに、該厚膜混成ＩＣ面と
間隙を持つて延びるフレキシブルプリント基板を
結合した構成の回路ブロツク体を設け、前記厚膜
混成ＩＣの両面及び前記フレキシブルプリント基
板の外面に夫々電子部品を装備させたことを特徴
とするコントロールユニツト。 A flexible printed circuit board that extends with a gap from the thick film hybrid IC surface is coupled to a thick film hybrid IC that is supported upright on the upper surface of a printed circuit board that is arranged laterally inside the box-shaped container of the control unit. 1. A control unit characterized in that a circuit block body having the above structure is provided, and electronic components are mounted on both sides of the thick film hybrid IC and on the outer surface of the flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6343787U JPH0451515Y2 (en) | 1987-04-28 | 1987-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6343787U JPH0451515Y2 (en) | 1987-04-28 | 1987-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170993U true JPS63170993U (en) | 1988-11-07 |
| JPH0451515Y2 JPH0451515Y2 (en) | 1992-12-03 |
Family
ID=30898662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6343787U Expired JPH0451515Y2 (en) | 1987-04-28 | 1987-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0451515Y2 (en) |
-
1987
- 1987-04-28 JP JP6343787U patent/JPH0451515Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0451515Y2 (en) | 1992-12-03 |