JPH01137569U - - Google Patents
Info
- Publication number
- JPH01137569U JPH01137569U JP3428988U JP3428988U JPH01137569U JP H01137569 U JPH01137569 U JP H01137569U JP 3428988 U JP3428988 U JP 3428988U JP 3428988 U JP3428988 U JP 3428988U JP H01137569 U JPH01137569 U JP H01137569U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- holes
- integrated circuit
- substrate
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の一実施例の厚膜混成集積回路
の一部を示す斜視図、第２図は従来の厚膜混成集
積回路の一部を示す斜視図である。
１，１１……スルーホール、２，１２……基板
、３……厚膜導体ペーストが塗布される方向、４
，１４……厚膜導体、５，１５……貫通孔、６，
１６……チツプ部品、７，１７……厚膜抵抗。
FIG. 1 is a perspective view showing a part of a thick film hybrid integrated circuit according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a part of a conventional thick film hybrid integrated circuit. 1, 11...Through hole, 2, 12...Substrate, 3...Direction in which thick film conductor paste is applied, 4
, 14... Thick film conductor, 5, 15... Through hole, 6,
16... Chip parts, 7, 17... Thick film resistor.
Claims (1)
あり、前記基板に塗つた厚膜導体ペーストが印刷
焼成してある厚膜混成集積回路において、前記各
貫通孔が楕円形をなしており、それらの各楕円の
長径が互いに平行であることを特徴とする厚膜混
成集積回路。 In a thick film hybrid integrated circuit in which a plurality of through holes for through holes are provided in a substrate, and a thick film conductor paste applied to the substrate is printed and fired, each of the through holes has an oval shape; A thick film hybrid integrated circuit characterized in that the major axes of each ellipse are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3428988U JPH01137569U (en) | 1988-03-14 | 1988-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3428988U JPH01137569U (en) | 1988-03-14 | 1988-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01137569U true JPH01137569U (en) | 1989-09-20 |
Family
ID=31261006
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3428988U Pending JPH01137569U (en) | 1988-03-14 | 1988-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01137569U (en) |
-
1988
- 1988-03-14 JP JP3428988U patent/JPH01137569U/ja active Pending