JPS6221006Y2 - - Google Patents

Info

Publication number
JPS6221006Y2
JPS6221006Y2 JP7862981U JP7862981U JPS6221006Y2 JP S6221006 Y2 JPS6221006 Y2 JP S6221006Y2 JP 7862981 U JP7862981 U JP 7862981U JP 7862981 U JP7862981 U JP 7862981U JP S6221006 Y2 JPS6221006 Y2 JP S6221006Y2
Authority
JP
Japan
Prior art keywords
bonding
workbench
height adjustment
circuit board
adjustment table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7862981U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57191047U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7862981U priority Critical patent/JPS6221006Y2/ja
Publication of JPS57191047U publication Critical patent/JPS57191047U/ja
Application granted granted Critical
Publication of JPS6221006Y2 publication Critical patent/JPS6221006Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP7862981U 1981-05-29 1981-05-29 Expired JPS6221006Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7862981U JPS6221006Y2 (enExample) 1981-05-29 1981-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7862981U JPS6221006Y2 (enExample) 1981-05-29 1981-05-29

Publications (2)

Publication Number Publication Date
JPS57191047U JPS57191047U (enExample) 1982-12-03
JPS6221006Y2 true JPS6221006Y2 (enExample) 1987-05-28

Family

ID=29874252

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7862981U Expired JPS6221006Y2 (enExample) 1981-05-29 1981-05-29

Country Status (1)

Country Link
JP (1) JPS6221006Y2 (enExample)

Also Published As

Publication number Publication date
JPS57191047U (enExample) 1982-12-03

Similar Documents

Publication Publication Date Title
US4847990A (en) Vibrating component insertion tool
JPS6221006Y2 (enExample)
JPH0370881B2 (enExample)
CN219456277U (zh) 一种用于三端瓷介电容器的测试夹具
JP2003311560A (ja) Ｘｙステージ
JPH05251304A (ja) 位置決め装置
JPH11216680A (ja) ワーク位置決め装置
JPS6053067U (ja) 回路基板の検査装置
JP2725880B2 (ja) 位置決め機構
JPH10163676A (ja) 回路基板上の検出位置を記録する装置
JPH0239310Y2 (enExample)
JPH0452906Y2 (enExample)
JPH0715187Y2 (ja) 制御機器のカバー取付構造
JPS6351244A (ja) マグネツト式テ−プフレ−ム位置決め装置
JP3283827B2 (ja) 平板状精密部品の位置決め方法及び装置
KR200321082Y1 (ko) 기판 작업대
JPH086341Y2 (ja) ツマミの取り付け機構
JPH0677126U (ja) 照光式押釦スイッチ
JPH10149745A (ja) 多方向操作体
JP3005496U (ja) 電気特性検査用プローブ
JPS6311759Y2 (enExample)
JPH0136147Y2 (enExample)
JPS5896746A (ja) 半導体基板の検査装置
JPH0246080Y2 (enExample)
JPH0412412Y2 (enExample)