JPS6221006Y2 - - Google Patents
Info
- Publication number
- JPS6221006Y2 JPS6221006Y2 JP7862981U JP7862981U JPS6221006Y2 JP S6221006 Y2 JPS6221006 Y2 JP S6221006Y2 JP 7862981 U JP7862981 U JP 7862981U JP 7862981 U JP7862981 U JP 7862981U JP S6221006 Y2 JPS6221006 Y2 JP S6221006Y2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- workbench
- height adjustment
- circuit board
- adjustment table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 9
- 238000012544 monitoring process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
【考案の詳細な説明】
本考案は、ボンデイング装置を用いて回路基板
に対してボンデイングを行なう際に用いられる回
路基板ボンデイング用高さ調整台に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a height adjustment table for circuit board bonding, which is used when bonding a circuit board using a bonding device.
通常、回路基板の厚さには、数種のものがある
が、ボンデイング作業を行なう際には、基板表
面、即ちボンデイング作業面をＸ−Ｙテーブル上
の一定の高さに保持する必要があることから、高
さ調整台をＸ−Ｙテーブルと基板を塔載保持する
作業台間に挿入し、作業面の高さを調整してい
た。しかし、最近、Ｘ−Ｙテーブルに作業台のセ
ツト方向検出用マイクロスイツチを複数個所設置
すると共に、作業台にマイクロスイツチに対応し
た溝、切欠き等を形成し、作業台によつてマイク
ロスイツチを選択的に「ON」、「OFF」させるこ
とによつて作業台、従つて回路基板のセツト方向
を検出せんとする提案がなされている。こうした
場合、回路基板の厚さが高さ調整台を必要としな
い場合には、作業台がＸ−Ｙテーブル上に直接塔
載されるので、テーブル上のマイクロスイツチは
選択的に作動されるが、調整台を必要とする場合
には、従来の調整台は単なる板状のものだつたの
で、調整台をＸ−Ｙテーブルと作業台との中間に
挿入すると、作業台によるマイクロスイツチの作
動が不可能となり、作業台のセツト方向の検出が
できなくなる不都合が生じる。 Normally, there are several thicknesses of circuit boards, but when performing bonding work, it is necessary to hold the board surface, that is, the bonding work surface, at a constant height above the X-Y table. Therefore, the height of the work surface was adjusted by inserting a height adjustment table between the X-Y table and the work table on which the substrate was mounted. However, recently, multiple micro switches for detecting the setting direction of the workbench have been installed on the X-Y table, and grooves, notches, etc. corresponding to the microswitches have been formed on the workbench, and the workbench can be used to detect the setting direction of the microswitch. Proposals have been made to detect the setting direction of the workbench and therefore of the circuit board by selectively turning it "ON" and "OFF". In these cases, if the thickness of the circuit board does not require a height adjustment table, the worktable may be mounted directly on the X-Y table and the microswitches on the table may be selectively activated. If an adjustment table is required, conventional adjustment tables are simply plate-shaped, so inserting the adjustment table between the X-Y table and the work table will prevent the work table from operating the microswitch. This results in the inconvenience that the setting direction of the workbench cannot be detected.
そこで、本考案は、高さ調整台の、Ｘ−Ｙテー
ブル上に設けられた作業台のセツト方向検出用マ
イクロスイツチに対向した位置に、検出ピンを、
前記作業台と当接した検出ピンがマイクロスイツ
チを作動させ得るように移動自在に設けて構成
し、もつて前述の欠点を解消した回路基板ボンデ
イング用高さ調整台を提供することを目的とする
ものである。 Therefore, in the present invention, a detection pin is placed on the height adjustment table at a position opposite to the micro switch for detecting the setting direction of the worktable provided on the X-Y table.
It is an object of the present invention to provide a height adjustment table for circuit board bonding which eliminates the above-mentioned drawbacks and is configured to be movable so that the detection pin in contact with the worktable can actuate a micro switch. It is something.
以下、図面に示す実施例に基き、本考案を具体
的に説明する。 Hereinafter, the present invention will be specifically explained based on embodiments shown in the drawings.
第１図は本考案による回路基板ボンデイング用
高さ調整台が用いられた、ボンデイング装置の一
例を示す斜視図、第２図はＸ−Ｙテーブルを示す
平面図、第３図は本考案による回路基板ボンデイ
ング用高さ調整台の一実施例を示す断面図であ
る。 Fig. 1 is a perspective view showing an example of a bonding apparatus using the height adjustment table for circuit board bonding according to the present invention, Fig. 2 is a plan view showing an X-Y table, and Fig. 3 is a circuit according to the present invention. FIG. 2 is a sectional view showing an embodiment of a height adjustment table for substrate bonding.
ボンデイング装置１は、第１図に示すように、
互いに直交する２方向である矢印Ｘ及びＹ方向に
移動駆動自在な正方形状のＸ−Ｙテーブル２を有
しており、Ｘ−Ｙテーブル２の４辺の中央部に
は、第２図に示すように、作業台のセツト方向検
出用マイクロスイツチ３Ａ、３Ｂ、３Ｄ、３Ｅが
作動子３ｆをテープル２上に突出させた形で中心
に対し90度づれた位置に埋設されている。テーブ
ル２上には本考案による高さ調整台５が設置され
ており、高さ調整台５のマイクロスイツチ３Ａ、
３Ｂ、３Ｄ、６Ｅと対向した位置には、第３図に
示すように、穴５ａがそれぞれ貫通穿設されてい
る。各穴５ａにはブラケツト５ｂが形成されてお
り、更に穴５ａには図中上下端に平板状の作動部
６ａ、６ｂが形成された検出ピン６が、矢印Ａ、
Ｂ方向に移動自在に係合している。作動部６ａ及
びブラケツト５ｂ間にはコイルばね７がピン６を
被覆する形で縮設されており、コイルばね７はピ
ン６を常時矢印Ｂ方向へ付勢している。高さ調整
台５上には作業台９が塔載されており、作業台９
のＸ−Ｙテーブル２側にはＴ字形の溝９ａが形成
されている。作業台９上には電子部品１０が実装
された厚さＴなる回路基板１１が塔載されてお
り、基板１１の上方にはボンデイングチツプ１２
が矢印Ｃ、Ｄ方向に移動駆動自在に設けられてい
る。 As shown in FIG. 1, the bonding device 1 includes:
It has a square-shaped X-Y table 2 that can be freely moved and driven in the directions of arrows X and Y, which are two directions orthogonal to each other. Micro-switches 3A, 3B, 3D, and 3E for detecting the setting direction of the workbench are buried at positions offset from the center by 90 degrees with actuators 3f protruding above the table 2. The height adjustment table 5 according to the present invention is installed on the table 2, and the micro switch 3A of the height adjustment table 5,
As shown in FIG. 3, holes 5a are formed through holes 5a at positions facing 3B, 3D, and 6E. A bracket 5b is formed in each hole 5a, and a detection pin 6 with flat plate-like actuating parts 6a, 6b formed at the upper and lower ends in the figure is located in the hole 5a as indicated by the arrow A.
They are engaged so as to be movable in the B direction. A coil spring 7 is provided between the actuating portion 6a and the bracket 5b so as to cover the pin 6, and the coil spring 7 always urges the pin 6 in the direction of arrow B. A workbench 9 is mounted on the height adjustment table 5.
A T-shaped groove 9a is formed on the X-Y table 2 side. A circuit board 11 with a thickness T on which electronic components 10 are mounted is mounted on the workbench 9, and above the board 11 is a bonding chip 12.
is provided so as to be freely movable and driven in the directions of arrows C and D.
本考案は、以上のような構成を有するので、回
路基板１１上の電子部品１０等に対してボンデイ
ング作業を行なうには、Ｘ−Ｙテーブル２を適宜
矢印Ｘ及びＹ方向に移動させ、ボンデイングチツ
プ１２の先端１２ａと基板１１上のボンデイング
すべき位置を整合させる。次に、チツプ１２を矢
印Ｃ方向、即ち基板１１方向に移動させ、チツプ
先端１２ａをボンデイング作業面である基板表面
１１ａと当接させ、チツプ１２を通電する。する
と、チツプ先端１２ａはジユール熱を発し、ボン
デイング動作が行なわれる。この際、基板表面１
１ａは、高さ調整台５によりＸ−Ｙテーブル２に
対して適正な高さ位置に設定されているので、チ
ツプ１２によるボンデイング動作は適正に行なわ
れる。ボンデイング動作が終了するとチツプ１２
をＤ方向に移動させ、Ｘ−Ｙテーブル２を駆動し
て次にボンデイングすべき位置とチツプ先端１２
ａを整合させ、同様の手順でボンデイング作業を
行なう。こうして、順次作業を遂行してゆくが、
ボンデイング作業は電子部品１０の配列等によ
り、基板１１の同一方向から全て行なうことはで
きず、基板１１を作業台９（基板は作業台と通常
ネジ等で固定されている。）と共に90゜ずつ矢印
Ｅ、Ｆ方向に手で基板１１と作業台９を検出ピン
６と当接しない位置まで持ち上げて回転させて行
なう。この際、作業者は、作業台９、従つて基板
１１が今どの方向にセツトされているかを知る必
要があるが、作業台９にはＴ字形の溝９ａが形成
されているので、溝９ａが形成された部分に対向
した高さ調整台５上の検出ピン６はコイルばね７
の弾性により、第３図に示すように、作動部６ａ
が溝９ａ中に突出し、従つて作動部６ｂはブラケ
ツト５ｂと当接係合してＸ−Ｙテーブル２上のマ
イクロスイツチの作動子３ｆとは非係合状態とな
り、スイツチは「OFF」状態になつている。ま
た、溝９ａと対向していない検出ピン６（検出ピ
ン６はマイクロスイツチ３Ａ、３Ｂ、３Ｄ、３Ｅ
に対向して設けられているので、第２図に示すよ
うに、４個の検出ピン６のうち必ず１個は溝９ａ
と対向しない状態となる。）は、作業台９によつ
て作動部６ａがばね７の弾性に抗する形で矢印Ａ
方向、即ちＸ−Ｙテーブル２側に押圧され、作動
部６ｂがマイクロスイツチの作動子３ｆに当接係
合し、作動子３ｆを矢印Ａ方向に押し下げて作動
させ、スイツチを「ON」状態にする。即ち、第
２図について説明すると、溝９ａに調整台５を介
して対向したマイクロスイツチ３Ａ、３Ｂ、３Ｄ
は検出ピン６と非係合状態となつているので、い
ずれも「OFF」状態となつており、溝１ａと対
向しないスイツチ３Ｅは検出ピン６に押圧されて
「ON」状態となつている。基板１１は作業台９と
共に90゜ずつ矢印Ｅ、Ｆ方向に回転されるので、
作業台９、従つて基板１１の向きに対応して、ス
イツチ３Ａ、３Ｂ、３Ｄ、３Ｅのうちいずれか１
個だけが「ON」状態となる。そこで、作業者は
スイツチ３Ａ、３Ｂ、３Ｄ、３Ｅのうち「ON」
状態となつているスイツチを監視することによ
り、基板１１のセツト方向を知ることができる。 Since the present invention has the above-described configuration, in order to perform bonding work on the electronic components 10 etc. on the circuit board 11, the X-Y table 2 is appropriately moved in the directions of the arrows X and Y, and the bonding chip is 12 and the position on the substrate 11 to be bonded. Next, the chip 12 is moved in the direction of arrow C, that is, in the direction of the substrate 11, the tip end 12a of the chip is brought into contact with the substrate surface 11a, which is the bonding work surface, and the chip 12 is energized. Then, the tip end 12a generates joule heat, and a bonding operation is performed. At this time, the substrate surface 1
1a is set at an appropriate height position with respect to the X-Y table 2 by the height adjustment table 5, so that the bonding operation by the chip 12 is properly performed. When the bonding operation is completed, the tip 12
is moved in the direction D, and the X-Y table 2 is driven to determine the next bonding position and tip tip 12
a and perform the bonding operation in the same manner. In this way, the work is carried out sequentially, but
Due to the arrangement of the electronic components 10, etc., the bonding work cannot be performed from the same direction of the board 11, so the board 11 and the work table 9 (the board is usually fixed to the work table with screws, etc.) are placed at 90° angles. This is carried out by lifting and rotating the board 11 and workbench 9 by hand in the directions of arrows E and F to a position where they do not come into contact with the detection pins 6. At this time, the operator needs to know in which direction the workbench 9 and therefore the board 11 are currently set, but since the workbench 9 has a T-shaped groove 9a, The detection pin 6 on the height adjustment table 5 facing the part where is formed is connected to the coil spring 7.
Due to the elasticity of the actuating portion 6a, as shown in FIG.
protrudes into the groove 9a, and therefore the actuating portion 6b abuts and engages with the bracket 5b, and is disengaged from the actuator 3f of the micro switch on the X-Y table 2, so that the switch is in the "OFF" state. It's summery. In addition, the detection pin 6 that does not face the groove 9a (the detection pin 6 is connected to the micro switch 3A, 3B, 3D, 3E)
As shown in FIG. 2, one of the four detection pins 6 is always in the groove 9a.
It becomes a state where you do not face. ), the actuating part 6a is moved by the arrow A by the workbench 9 in a manner that resists the elasticity of the spring 7.
direction, that is, the X-Y table 2 side, the actuating part 6b abuts and engages the actuator 3f of the micro switch, and pushes the actuator 3f down in the direction of arrow A to actuate it, turning the switch into the "ON" state. do. That is, to explain FIG. 2, the micro switches 3A, 3B, 3D facing the groove 9a via the adjustment table 5
are not engaged with the detection pin 6, so they are both in the "OFF" state, and the switch 3E, which does not face the groove 1a, is pressed by the detection pin 6 and is in the "ON" state. Since the board 11 is rotated by 90 degrees together with the workbench 9 in the directions of arrows E and F,
Depending on the orientation of the workbench 9 and therefore the board 11, one of the switches 3A, 3B, 3D, and 3E is selected.
Only one is in the "ON" state. Therefore, the operator turned on switches 3A, 3B, 3D, and 3E.
By monitoring the status of the switch, the direction in which the board 11 is set can be known.
なお、基板１１の厚さＴが厚く、基板表面１１
ａの高さ位置を調整するために高さ調整台５を用
いる必要がない場合には、Ｘ−Ｙテーブル２上に
作業台９を直接塔載する。すると、調整台５を用
いた場合と全く同じ態様で溝９ａと対向した３個
のマイクロスイツチ「OFF」状態となり、対向
しない１個のスイツチ「ON」状態となるので、
基板１１のセツト方向は容易に確認できる。 Note that the thickness T of the substrate 11 is large, and the substrate surface 11
If it is not necessary to use the height adjustment table 5 to adjust the height position of a, the worktable 9 is directly mounted on the XY table 2. Then, in exactly the same manner as when using the adjustment table 5, the three micro-switches facing the groove 9a will be in the "OFF" state, and the one switch that is not facing will be in the "ON" state.
The direction in which the substrate 11 is set can be easily confirmed.
以上説明したように、高さ調整台５の、Ｘ−Ｙ
テーブル２上に設けられた作業台９のセツト方向
検出用マイクロスイツチ３Ａ、３Ｂ、３Ｄ、３Ｅ
に対向した位置に、検出ピン６を、作業台９と当
接したピン６がマイクロスイツチ３Ａ、３Ｂ、３
Ｄ、３Ｅを作動させ得るように移動自在に設けた
ので、高さ調整台５を用いてボンデイング作業を
行なう場合でもマイクロスイツチ３Ａ、３Ｂ、３
Ｄ、３Ｅの選択的作動が可能となり、作業台９、
従つて回路基板１１のセツト方向の検出が可能と
なる。 As explained above, the X-Y
Micro switches 3A, 3B, 3D, 3E for detecting the setting direction of the workbench 9 provided on the table 2
The detection pin 6 is placed in a position opposite to the micro switch 3A, 3B, 3.
Since the micro switches 3A, 3B, and 3E are movable so that they can be operated, even when performing bonding work using the height adjustment table 5, the micro switches 3A, 3B, and 3
D, 3E can be selectively operated, and the workbench 9,
Therefore, the setting direction of the circuit board 11 can be detected.
第１図は本考案による回路基板ボンデイング用
高さ調整台が用いられたボンデイング装置の一例
を示す斜視図、第２図はＸ−Ｙテーブルを示す平
面図、第３図は本考案による回路基板ボンデイン
グ用高さ調整台の一実施例を示す断面図である。
１……ボンデイング装置、２……Ｘ−Ｙテーブ
ル、３Ａ，３Ｂ，３Ｄ，３Ｅ……マイクロスイツ
チ、５……高さ調整台、６……検出ピン、９……
作業台、１１……回路基板。
Fig. 1 is a perspective view showing an example of a bonding apparatus using a height adjustment table for circuit board bonding according to the present invention, Fig. 2 is a plan view showing an X-Y table, and Fig. 3 is a circuit board according to the present invention. It is a sectional view showing one example of a height adjustment stand for bonding. 1... Bonding device, 2... X-Y table, 3A, 3B, 3D, 3E... Micro switch, 5... Height adjustment table, 6... Detection pin, 9...
Workbench, 11...Circuit board.
Claims (1)
を搭載したＴ字形溝を有する作業台の間に挿入さ
れるものにおいて、該Ｘ−Ｙテーブルに作動子を
有するマイクロスイツチを中心に対して互に90度
ずれた位置に４個設けるとともに、作業台と当接
したピンが該作動子とコイルバネ圧により作動部
を介して接する様構成したことを特徴とする回路
基板ボンデイング用高さ調整台。 In a device inserted between an X-Y table of a bonding device and a workbench having a T-shaped groove on which a circuit board is mounted, microswitches having actuators on the X-Y table are placed at 90 degrees to each other with respect to the center. A height adjustment table for circuit board bonding, characterized in that four pins are provided at shifted positions, and the pins in contact with the workbench are in contact with the actuator via the actuating part by the pressure of a coil spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7862981U JPS6221006Y2 (en) | 1981-05-29 | 1981-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7862981U JPS6221006Y2 (en) | 1981-05-29 | 1981-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57191047U JPS57191047U (en) | 1982-12-03 |
| JPS6221006Y2 true JPS6221006Y2 (en) | 1987-05-28 |
Family
ID=29874252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7862981U Expired JPS6221006Y2 (en) | 1981-05-29 | 1981-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6221006Y2 (en) |
-
1981
- 1981-05-29 JP JP7862981U patent/JPS6221006Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57191047U (en) | 1982-12-03 |
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