JP2004055751A - Clamping device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a clamping device for testing a substrate, which improves the flexibility of a pattern layout by reducing a dead space on a printing substrate as much as possible and which is capable of contriving the miniaturization of the printing substrate by permitting high-density mounting. <P>SOLUTION: The clamping device is provided with a plurality of support pins (the terminal parts 40 of the test pins 23) for supporting a sheet-type work (printing substrate 9) on a support board 22 (test pin board 22) from the lower side of the work, a plurality of pressure bars 33 for pushing the work 9 against the support pins 40 from the upper side of the work, operating means (a clamp lever 26, a clamp rod 27 and a push plate 28) for making the push rod 33 operate vertically between the clamping position and the clamp-releasing position of the work 9, and a plurality of positioning pins 32, provided on the supporting board 22 and engaged with the work 9, while being projected toward the upper surface side of the work 9. In such a clamping device, the pressure bars 33 are provided at the upper side of the pins 32 so as to be aligned with them, and holes 34 for fitting in the upper ends of the positioning pins 32 projected from the upper side of the work 9 are formed at the pushing surface side of the pressure bars 33. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a clamp device used in a printed circuit board test device or the like.
[0002]
[Prior art]
A printed circuit board forming a controller for an automobile engine and other various control devices is subjected to a circuit continuity test and a functional test after the circuit is formed. In this test device, a substrate is placed on the upper end of a test pin such as a needle-like probe or a pin having a small ring-shaped contact on the head, and the test is performed by pressing the substrate against the test pin from above with a clamp device. .
[0003]
FIGS. 5A and 5B are explanatory diagrams of a configuration of a clamp device used in a conventional printed circuit board test apparatus, wherein FIG. 5A shows a clamp released state, and FIG. 5B shows a clamp state.
[0004]
FIG. 6 is an explanatory view showing the shape of the printed circuit board and the arrangement of the clamp members in the clamped state.
[0005]
The clamp device 1 constituting the substrate testing device has a plurality (two in the figure) of test pins 3 projecting from the upper surface of a test pin board 2 serving as a support base. The test pin 3 has a terminal portion 10 at an upper end, and is vertically moved elastically by a spring (not shown) in the cylinder. A work (printed circuit board 9) to be tested is mounted on the terminal portion 10 at the upper end of the test pin 3, and is elastically supported on the test pin 3. The printed circuit board 9 is positioned so that each test pin 3 is disposed at a position of a terminal or a circuit pattern on a lower surface side of the printed circuit board 9 to be inspected, which is known in advance. Reference numeral 11 denotes an electronic component mounted on the upper and lower surfaces of the printed circuit board 9.
[0006]
A top plate 5 is provided on the upper side of the test pin board 2 via a support 4. The top plate 5 is provided with a clamp lever 6 and a clamp rod 7 having a toggle structure that moves up and down by rotating the clamp lever 6. The holding plate 8 is fixed to the lower end of the clamp rod 7. A plurality of holding rods 13 are provided to protrude from the lower surface of the holding plate 8. Each presser bar 13 is provided on the presser plate 8 so as to come into contact with a position on the upper surface of the printed circuit board 9 which is known in advance, excluding a mounting position of a circuit pattern or a component.
[0007]
Positioning pins 12 of the printed circuit board 9 are provided to protrude above the test pin board 2. As shown in FIG. 6A, the positioning pins 12 position the printed circuit board 9 by passing through guide holes 12a provided in the printed circuit board 9.
[0008]
When performing the test, as shown in FIG. 5A, the printed circuit board 9 is guided by the positioning pins 12 and placed on the test pins 3 in a state where the clamp is released. Thereafter, as shown in FIG. 3B, the clamp lever 6 is rotated to push down the clamp rod 7, the holding rod 13 is lowered together with the holding plate 8, and the printed circuit board 9 is pressed to be clamped on the test pin 3. . Test with clamped. When the test is completed, the clamp is released again and the printed circuit board 9 is removed from the test pins 3 as shown in FIG.
[0009]
[Problems to be solved by the invention]
However, in the above-described conventional clamping device, the space occupied by the positioning pins 12 and the pressing rods 13 is formed as a dead space on the printed circuit board 9 as shown in FIG. In this dead space, circuit patterns and components cannot be provided, which restricts the pattern layout, hinders high-density mounting, and makes it impossible to reduce the size of the printed circuit board.
[0010]
The present invention has been made in consideration of the above-described conventional technology, and reduces the dead space on a printed circuit board as much as possible to increase the pattern forming area on the board surface, increase the degree of freedom in pattern layout, and enable high-density mounting, and It is an object of the present invention to provide a substrate testing clamp device that can be downsized.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, a plurality of support pins for supporting a plate-shaped work from below on a support table, a plurality of pressing bars for pressing the work against the support pin from above, Operating means for moving the rod up and down between a clamp position and a clamp release position of the work, and a plurality of positioning pins provided on the support table and engaging with the work and projecting to the upper surface side of the work. In the clamp device, the presser bar is provided at a position above and in alignment with the positioning pin, and a press-fitting side of the presser bar is provided with a hole into which an upper end of the positioning pin protruding from the upper surface of the work fits. A clamp device characterized by being formed.
[0012]
According to this configuration, since the pressing position of the presser bar and the positioning position of the positioning pin are aligned and overlap, the dead space on the work is shared, the dead space is reduced, and the work surface can be used effectively.
[0013]
In a preferred configuration example, the work is a printed circuit board, the support pins are test pins for testing a plurality of boards that elastically support the board by protruding from an upper surface of the support base, and the holding bar is configured to perform the operation. It is characterized in that it is provided so as to protrude from the lower surface of the holding plate connected to the means.
[0014]
According to this configuration, when the present invention is applied to the clamp structure in the printed board testing apparatus, when the printed board on the test pin is pressed by the holding rod, the pressing position of the holding rod and the positioning position of the positioning pin are different. Since they are aligned and overlap, the dead space on the printed circuit board is shared and the dead space is reduced, the effective circuit formation area on the printed circuit board surface is widened, the degree of freedom in pattern layout is increased, and high-density mounting and board size reduction are achieved. Becomes possible.
[0015]
According to the present invention, as a preferred configuration example, there is provided a printed circuit board characterized in that a plurality of notches with which the positioning pins are engaged are formed on an outer edge.
[0016]
According to this configuration, a positioning guide is formed by notching an outer edge serving as an outline of the printed circuit board, and a positioning pin is engaged with the notch, so that the entire pressing surface of the presser bar that covers the positioning pin from above is printed. Part of the substrate protrudes outside the substrate without contacting the substrate, and the dead space on the substrate is reduced.
[0017]
In a preferred configuration example, the notch has a shape of a quarter circle formed at a corner of a rectangular printed circuit board.
[0018]
According to this configuration, a dead space on the printed circuit board can be efficiently reduced by forming a notch of 1/4 circle at, for example, four corners of the rectangular printed circuit board and engaging the cylindrical positioning pins with the cutouts. Can be made smaller.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
FIGS. 1A and 1B are explanatory diagrams of a configuration of a clamp device applied to a printed board test apparatus according to an embodiment of the present invention, wherein FIG. 1A shows a clamp released state, and FIG. 1B shows a clamp state. FIG. 2 is an explanatory diagram of the shape of the printed circuit board and the dead space in the clamped state.
[0020]
The clamp device 21 constituting the substrate test device has a plurality (two in the figure) of test pins 23 projecting from the upper surface of a test pin board 22 serving as a support base. The test pin 23 has a terminal portion 40 at the upper end, and moves up and down elastically by a spring (not shown) in the cylinder. The work (printed circuit board 9) to be tested is mounted on the terminal portion 40 at the upper end of the test pins 23, and is elastically supported on the test pins 23. The printed circuit board 9 is positioned so that each test pin 23 is disposed at a position of a terminal or a circuit pattern on the lower surface side of the printed circuit board 9 to be inspected, which is known in advance. Reference numeral 11 denotes an electronic component mounted on the upper and lower surfaces of the printed circuit board 9.
[0021]
A top plate 25 is provided above the test pin board 22 via a support post 24. The top plate 25 is provided with a clamp lever 26 and a clamp rod 27 having a toggle structure that moves up and down by rotating the clamp lever 26. A holding plate 28 is fixed to the lower end of the clamp rod 27. A plurality of holding rods 33 are provided to protrude from the lower surface of the holding plate 28. Each presser bar 33 is provided on the presser plate 28 so as to come into contact with a position on the upper surface of the printed circuit board 9 which is known in advance and where the circuit pattern and components are not mounted.
[0022]
Positioning pins 32 of the printed circuit board 9 are provided to protrude above the test pin board 22. As shown in FIG. 2A, the positioning pins 32 position the printed circuit board 9 by passing through guide holes 32a provided in the printed circuit board 9. Although the position of the positioning pin 32 (the position of the guide hole 32a) is provided at two diagonal lines in this example, the position of the positioning pin 32 is set at another position in an unused area avoiding a circuit pattern (not shown) on the substrate. The number may be three or four at four corners or at another position.
[0023]
In the present embodiment, a presser bar 33 is provided at a position above and aligned with the positioning pin 32. A hole 34 into which the positioning pin 32 is fitted is formed on the pressing surface (lower surface) side of the pressing rod 33. In this example, as shown in FIG. 2 (B), pressing rods 33 are respectively provided at two diagonally opposed positions of a pair of positioning pins 32 among the four corners of the printed circuit board 9, and further another pair of The pressing rod 35 is also provided at two opposing positions (positions where there is no positioning pin). The holding rod 35 is not provided with the hole 34 into which the positioning pin 32 is fitted. FIG. 1 shows only the presser bar 33 in which the hole 34 is formed.
[0024]
When performing the test, as shown in FIG. 1A, the printed circuit board 9 is guided by the positioning pins 32 and placed on the terminal portions 40 of the test pins 23 in a state where the clamp is released. At this time, the positioning pins 32 penetrate through the guide holes 32a (FIG. 2A) of the printed board 9 and protrude from the board surface.
[0025]
Thereafter, as shown in FIG. 2B, the clamp lever 26 is rotated to push down the clamp rod 27, and the holding rod 33 and the holding rod 35 (FIG. 2) are lowered together with the holding plate 28 to press the printed circuit board 9. To clamp on the terminal portion 40 of the test pin 23. At this time, the pressing rod 33 presses the printed circuit board 9 at a position overlapping with the positioning pin 32 protruding above the printed circuit board 9, but the upper end of the positioning pin 32 protruding above the substrate is inserted into the hole 34 of the pressing rod 33. Since it is inserted, the printed circuit board 9 can be pressed without any trouble.
[0026]
Thus, the test is performed with the printed circuit board 9 clamped. When the test is completed, the clamp lever 26 is rotated in the direction opposite to the clamp direction to raise the clamp rod 27, and the press bars 33 and 35 are pulled up together with the press plate 28 to release the clamp. As shown in FIG. 1A, the printed circuit board 9 is removed from the test pins 23 in a state where the clamp is released again.
[0027]
In this embodiment, as shown in FIG. 2B, the space occupied by the positioning pins 32 and the space occupied by the presser rods 33, which are dead spaces on the printed circuit board 9, overlap and are shared, so that the dead space is reduced. .
[0028]
3A and 3B are explanatory diagrams of a configuration of a clamp device applied to a printed circuit board test device according to another embodiment of the present invention, wherein FIG. 3A shows a clamp released state, and FIG. 3B shows a clamp state. FIG. 4 is a shape explanatory view showing the shape of the printed circuit board and the dead space in the clamped state.
[0029]
In this embodiment, as shown in FIG. 4A, a notch of 1/4 circle is formed at the four corners of the printed circuit board 9 to form the guide 36 for the positioning pin. Four positioning pins 32 are provided corresponding to each guide 36. A presser bar 33 is provided at a position above and aligned with each of the four positioning pins 32. Each presser bar 33 is provided with a hole 34 into which the positioning pin 32 is fitted, as in the above embodiment. The test operation is the same as in the above embodiment.
[0030]
In this embodiment, since the positioning guide 36 formed on the printed circuit board 9 has a notch of 1/4 circle, the space required for the guide is reduced, and the area of the circuit pattern non-use area on the printed circuit board 9 itself is reduced. Decrease. At the same time, since each presser bar 33 for the printed circuit board 9 is placed on the positioning pin 32, the dead space is reduced by common use of the dead space as in the above-described embodiment. Further, in the present embodiment, since the pressing area serving as a dead space by each presser bar 33 is 1/4 of the pressing surface (the lower surface of the presser bar), the dead space is further reduced.
[0031]
【The invention's effect】
As described above, in the present invention, since the pressing position of the presser bar and the positioning position of the positioning pin are aligned and overlap, the dead space on the work is shared, the dead space is reduced, and the work surface is used effectively. be able to. In particular, when the present invention is applied to a clamp structure in a printed circuit board test apparatus, when the printed board on the test pin is pressed by the pressing rod, the pressing position of the pressing rod and the positioning position of the positioning pin are aligned and overlap. As a result, the dead space on the printed circuit board is shared and the dead space is reduced, the effective circuit formation area on the printed circuit board surface is expanded, the degree of freedom in pattern layout is increased, and high-density mounting and miniaturization of the board are possible. Become.
[Brief description of the drawings]
FIG. 1 is a configuration explanatory view of a clamp device applied to a printed board test device according to an embodiment of the present invention.
FIG. 2 is an explanatory view of the shape of the printed circuit board of FIG. 1 and its dead space.
FIG. 3 is a configuration explanatory view of a clamp device applied to a printed circuit board test device according to another embodiment of the present invention.
FIG. 4 is an explanatory view of the shape of the printed circuit board of FIG. 3 and its dead space.
FIG. 5 is a configuration explanatory view of a clamp device in a conventional printed circuit board test device.
FIG. 6 is an explanatory view of the shape of the printed circuit board of FIG. 5 and its dead space.
[Explanation of symbols]
1: Clamping device, 2: Test pin board, 3: Test pin, 4: Post,
5: top plate, 6: clamp lever, 7: clamp rod, 8: holding plate,
9: printed circuit board, 10: terminal, 11: electronic component, 12: positioning pin,
12a: guide hole, 21: clamp device,
22: test pin board, 23: test pin, 24: support, 25: top plate,
26: clamp lever, 27: clamp rod, 28: holding plate,
32: positioning pin, 32a; guide hole, 33: holding rod, 34: hole,
35: presser bar, 36: guide, 40: terminal.

Claims (4)

A plurality of support pins for supporting the plate-shaped work from below on the support base,
A plurality of pressing rods for pressing the work against the support pin from above,
Operating means for vertically moving the presser bar between a clamp position and a clamp release position of the work;
A plurality of positioning pins provided on the support table and engaging with the work and protruding toward the upper surface of the work;
The pressing rod is provided at a position above and aligned with the positioning pin, and a hole is formed on the pressing surface side of the pressing rod, into which an upper end of the positioning pin protruding from the upper surface of the work fits. Characteristic clamping device. The work is a printed circuit board,
The support pins are test pins for testing a plurality of substrates that project from the upper surface of the support base and elastically support the substrate,
The clamping device according to claim 1, wherein the holding bar is provided to protrude from a lower surface of a holding plate connected to the operating means. The printed circuit board to be tested by the clamp device according to claim 2, wherein a plurality of notches with which the positioning pins engage are formed in an outer edge. The printed circuit board according to claim 3, wherein the notch has a shape of a quarter circle formed at a corner of the rectangular printed circuit board.

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