JPS6220571A - 導電性組成物 - Google Patents
導電性組成物Info
- Publication number
- JPS6220571A JPS6220571A JP15924085A JP15924085A JPS6220571A JP S6220571 A JPS6220571 A JP S6220571A JP 15924085 A JP15924085 A JP 15924085A JP 15924085 A JP15924085 A JP 15924085A JP S6220571 A JPS6220571 A JP S6220571A
- Authority
- JP
- Japan
- Prior art keywords
- conductive composition
- paste
- conductive
- glass
- glass frit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 29
- 239000011521 glass Substances 0.000 claims abstract description 35
- 239000000843 powder Substances 0.000 claims abstract description 15
- 238000010304 firing Methods 0.000 claims description 13
- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 abstract description 23
- 239000010949 copper Substances 0.000 abstract description 23
- 229910000679 solder Inorganic materials 0.000 abstract description 11
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 abstract description 5
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 238000009736 wetting Methods 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 238000005476 soldering Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000002245 particle Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000013405 beer Nutrition 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
Landscapes
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15924085A JPS6220571A (ja) | 1985-07-18 | 1985-07-18 | 導電性組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15924085A JPS6220571A (ja) | 1985-07-18 | 1985-07-18 | 導電性組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6220571A true JPS6220571A (ja) | 1987-01-29 |
| JPH0588746B2 JPH0588746B2 (enrdf_load_stackoverflow) | 1993-12-24 |
Family
ID=15689407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15924085A Granted JPS6220571A (ja) | 1985-07-18 | 1985-07-18 | 導電性組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6220571A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131405A (ja) * | 1986-11-20 | 1988-06-03 | 旭硝子株式会社 | 導体用組成物 |
| JPH0286665A (ja) * | 1988-09-22 | 1990-03-27 | Sumitomo Metal Mining Co Ltd | メッキ下地用導電性塗料およびそれを用いるメッキ方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61107607A (ja) * | 1984-10-30 | 1986-05-26 | 田中マツセイ株式会社 | 導体組成物 |
-
1985
- 1985-07-18 JP JP15924085A patent/JPS6220571A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61107607A (ja) * | 1984-10-30 | 1986-05-26 | 田中マツセイ株式会社 | 導体組成物 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131405A (ja) * | 1986-11-20 | 1988-06-03 | 旭硝子株式会社 | 導体用組成物 |
| JPH0286665A (ja) * | 1988-09-22 | 1990-03-27 | Sumitomo Metal Mining Co Ltd | メッキ下地用導電性塗料およびそれを用いるメッキ方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0588746B2 (enrdf_load_stackoverflow) | 1993-12-24 |
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