JPS62201941U - - Google Patents
Info
- Publication number
- JPS62201941U JPS62201941U JP1986090677U JP9067786U JPS62201941U JP S62201941 U JPS62201941 U JP S62201941U JP 1986090677 U JP1986090677 U JP 1986090677U JP 9067786 U JP9067786 U JP 9067786U JP S62201941 U JPS62201941 U JP S62201941U
- Authority
- JP
- Japan
- Prior art keywords
- package
- integrated circuit
- external lead
- receiving notch
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
- H01L23/49551—Cross section geometry characterised by bent parts
- H01L23/49555—Cross section geometry characterised by bent parts the bent parts being the outer leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986090677U JPS62201941U (fr) | 1986-06-13 | 1986-06-13 | |
| KR2019860022015U KR900003885Y1 (ko) | 1986-06-13 | 1986-12-30 | 집적회로용 패키지 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986090677U JPS62201941U (fr) | 1986-06-13 | 1986-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62201941U true JPS62201941U (fr) | 1987-12-23 |
Family
ID=30950761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986090677U Pending JPS62201941U (fr) | 1986-06-13 | 1986-06-13 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS62201941U (fr) |
| KR (1) | KR900003885Y1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100422439B1 (ko) * | 1997-01-15 | 2004-05-17 | 페어차일드코리아반도체 주식회사 | 모터 드라이브 아이시의 Pd제한 회로 |
-
1986
- 1986-06-13 JP JP1986090677U patent/JPS62201941U/ja active Pending
- 1986-12-30 KR KR2019860022015U patent/KR900003885Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR900003885Y1 (ko) | 1990-05-03 |
| KR880001342U (ko) | 1988-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS62201941U (fr) | ||
| JPH0313753U (fr) | ||
| JPS6115746U (ja) | 集積回路用パツケ−ジ | |
| JPS60124069U (ja) | プリント基板 | |
| JPS6315033U (fr) | ||
| JPS592146U (ja) | 電子部品パツケ−ジ | |
| JPS59104539U (ja) | チツプキヤリア | |
| JPH01121945U (fr) | ||
| JPS58195445U (ja) | 半導体集積回路パツケ−ジ | |
| JPS6186947U (fr) | ||
| JPS6061742U (ja) | 集積回路装置 | |
| JPS6054340U (ja) | 集積回路 | |
| JPS59104544U (ja) | 集積回路装置 | |
| JPH0166763U (fr) | ||
| JPH0158955U (fr) | ||
| JPH0375548U (fr) | ||
| JPS6371570U (fr) | ||
| JPS6247171U (fr) | ||
| JPS6265847U (fr) | ||
| JPS58162664U (ja) | 電子部品組立構体 | |
| JPS5818346U (ja) | Ｉｃパツケ−ジ | |
| JPH0375547U (fr) | ||
| JPH0262769U (fr) | ||
| JPS62112144U (fr) | ||
| JPH01179446U (fr) |