JPH0375547U - - Google Patents
Info
- Publication number
- JPH0375547U JPH0375547U JP13708789U JP13708789U JPH0375547U JP H0375547 U JPH0375547 U JP H0375547U JP 13708789 U JP13708789 U JP 13708789U JP 13708789 U JP13708789 U JP 13708789U JP H0375547 U JPH0375547 U JP H0375547U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- flat package
- wicking phenomenon
- soldered
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13708789U JPH0375547U (fr) | 1989-11-27 | 1989-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13708789U JPH0375547U (fr) | 1989-11-27 | 1989-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375547U true JPH0375547U (fr) | 1991-07-29 |
Family
ID=31684262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13708789U Pending JPH0375547U (fr) | 1989-11-27 | 1989-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375547U (fr) |
-
1989
- 1989-11-27 JP JP13708789U patent/JPH0375547U/ja active Pending