JPH03120049U - - Google Patents
Info
- Publication number
- JPH03120049U JPH03120049U JP2891890U JP2891890U JPH03120049U JP H03120049 U JPH03120049 U JP H03120049U JP 2891890 U JP2891890 U JP 2891890U JP 2891890 U JP2891890 U JP 2891890U JP H03120049 U JPH03120049 U JP H03120049U
- Authority
- JP
- Japan
- Prior art keywords
- package
- soldered
- bent
- soldering part
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2891890U JPH03120049U (fr) | 1990-03-20 | 1990-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2891890U JPH03120049U (fr) | 1990-03-20 | 1990-03-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120049U true JPH03120049U (fr) | 1991-12-10 |
Family
ID=31531702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2891890U Pending JPH03120049U (fr) | 1990-03-20 | 1990-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120049U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11929306B2 (en) | 2021-03-22 | 2024-03-12 | Kabushiki Kaisha Toshiba | Semiconductor device comprising first and second lead frames |
-
1990
- 1990-03-20 JP JP2891890U patent/JPH03120049U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11929306B2 (en) | 2021-03-22 | 2024-03-12 | Kabushiki Kaisha Toshiba | Semiconductor device comprising first and second lead frames |