JPH0217854U - - Google Patents
Info
- Publication number
- JPH0217854U JPH0217854U JP9534488U JP9534488U JPH0217854U JP H0217854 U JPH0217854 U JP H0217854U JP 9534488 U JP9534488 U JP 9534488U JP 9534488 U JP9534488 U JP 9534488U JP H0217854 U JPH0217854 U JP H0217854U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- soldering
- circuit board
- printed circuit
- external
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534488U JPH0217854U (fr) | 1988-07-18 | 1988-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9534488U JPH0217854U (fr) | 1988-07-18 | 1988-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217854U true JPH0217854U (fr) | 1990-02-06 |
Family
ID=31320009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9534488U Pending JPH0217854U (fr) | 1988-07-18 | 1988-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217854U (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124095A (ja) * | 2007-11-12 | 2009-06-04 | Samsung Sdi Co Ltd | 半導体パッケージ及びその実装方法 |
| JP2017041541A (ja) * | 2015-08-20 | 2017-02-23 | 三菱電機株式会社 | 高周波高出力用デバイス装置 |
-
1988
- 1988-07-18 JP JP9534488U patent/JPH0217854U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009124095A (ja) * | 2007-11-12 | 2009-06-04 | Samsung Sdi Co Ltd | 半導体パッケージ及びその実装方法 |
| US8319319B2 (en) | 2007-11-12 | 2012-11-27 | Samsung Sdi Co., Ltd. | Semiconductor package and mounting method thereof |
| JP2017041541A (ja) * | 2015-08-20 | 2017-02-23 | 三菱電機株式会社 | 高周波高出力用デバイス装置 |