JPH0436249U - - Google Patents
Info
- Publication number
- JPH0436249U JPH0436249U JP7800390U JP7800390U JPH0436249U JP H0436249 U JPH0436249 U JP H0436249U JP 7800390 U JP7800390 U JP 7800390U JP 7800390 U JP7800390 U JP 7800390U JP H0436249 U JPH0436249 U JP H0436249U
- Authority
- JP
- Japan
- Prior art keywords
- flatpack
- pads
- leads
- relief
- flat pack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011295 pitch Substances 0.000 claims 1
- 239000006071 cream Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7800390U JPH0436249U (fr) | 1990-07-23 | 1990-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7800390U JPH0436249U (fr) | 1990-07-23 | 1990-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436249U true JPH0436249U (fr) | 1992-03-26 |
Family
ID=31620897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7800390U Pending JPH0436249U (fr) | 1990-07-23 | 1990-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436249U (fr) |
-
1990
- 1990-07-23 JP JP7800390U patent/JPH0436249U/ja active Pending