JPS62199030A - 半導体ウエハ−の処理装置 - Google Patents
半導体ウエハ−の処理装置Info
- Publication number
- JPS62199030A JPS62199030A JP4312886A JP4312886A JPS62199030A JP S62199030 A JPS62199030 A JP S62199030A JP 4312886 A JP4312886 A JP 4312886A JP 4312886 A JP4312886 A JP 4312886A JP S62199030 A JPS62199030 A JP S62199030A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- base
- semiconductor wafer
- mounting table
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning In General (AREA)
- Jigs For Machine Tools (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4312886A JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4312886A JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62199030A true JPS62199030A (ja) | 1987-09-02 |
JPH0553062B2 JPH0553062B2 (enrdf_load_stackoverflow) | 1993-08-09 |
Family
ID=12655203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4312886A Granted JPS62199030A (ja) | 1986-02-27 | 1986-02-27 | 半導体ウエハ−の処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62199030A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006075356A1 (ja) | 2005-01-11 | 2006-07-20 | Mitsubishi Denki Kabushiki Kaisha | 半導体製造装置 |
-
1986
- 1986-02-27 JP JP4312886A patent/JPS62199030A/ja active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006075356A1 (ja) | 2005-01-11 | 2006-07-20 | Mitsubishi Denki Kabushiki Kaisha | 半導体製造装置 |
JPWO2006075356A1 (ja) * | 2005-01-11 | 2008-06-12 | 三菱電機株式会社 | 半導体製造装置 |
JP4611292B2 (ja) * | 2005-01-11 | 2011-01-12 | 三菱電機株式会社 | 半導体製造装置 |
US8696816B2 (en) | 2005-01-11 | 2014-04-15 | Mitsubishi Electric Corporation | Semiconductor manufacturing apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH0553062B2 (enrdf_load_stackoverflow) | 1993-08-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |