JPS62196323U - - Google Patents
Info
- Publication number
- JPS62196323U JPS62196323U JP8255886U JP8255886U JPS62196323U JP S62196323 U JPS62196323 U JP S62196323U JP 8255886 U JP8255886 U JP 8255886U JP 8255886 U JP8255886 U JP 8255886U JP S62196323 U JPS62196323 U JP S62196323U
- Authority
- JP
- Japan
- Prior art keywords
- printed
- chip
- printed patterns
- patterns
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000003985 ceramic capacitor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Description
第1図は本考案の一実施例による結合回路の実
装図、第2図、第3図は従来の結合回路の実装図
である。
1:プリント配線基板、2:コイル、3:エア
ーバリコンあるいはセラミツク可変コンデンサ、
4,5:結合用パターン、6:チツプジヤンパ抵
抗あるいは磁器コンデンサ、7:結合用リード線
、8:結合用磁器コンデンサ。
FIG. 1 is an implementation diagram of a coupling circuit according to an embodiment of the present invention, and FIGS. 2 and 3 are implementation diagrams of a conventional coupling circuit. 1: Printed wiring board, 2: Coil, 3: Air variable capacitor or ceramic variable capacitor,
4, 5: Coupling pattern, 6: Chip jumper resistor or magnetic capacitor, 7: Coupling lead wire, 8: Coupling magnetic capacitor.
Claims (1)
幅広のプリントパターンと、半田側の前記プリン
トパターンとの対称位置に設けた複数個のプリン
トパターンとで容量を形成し、これら両プリント
パターンにそれぞれ接続された同調回路が必要と
する帯域に応じて、前記分割したプリントパター
ンをチツプ型のジヤンパー抵抗又はチツプ型の磁
器コンデンサで接続するようにしたことを特徴と
する結合回路。 Using a double-sided printed circuit board, a capacitor is formed by a wide printed pattern provided on the component mounting surface and multiple printed patterns provided at symmetrical positions with the printed pattern on the solder side, and connected to each of these printed patterns. A coupling circuit characterized in that the divided printed patterns are connected by a chip-type jumper resistor or a chip-type ceramic capacitor depending on the band required by the tuned circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8255886U JPS62196323U (en) | 1986-06-02 | 1986-06-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8255886U JPS62196323U (en) | 1986-06-02 | 1986-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62196323U true JPS62196323U (en) | 1987-12-14 |
Family
ID=30935328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8255886U Pending JPS62196323U (en) | 1986-06-02 | 1986-06-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62196323U (en) |
-
1986
- 1986-06-02 JP JP8255886U patent/JPS62196323U/ja active Pending
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