JPS62194628A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS62194628A
JPS62194628A JP3778486A JP3778486A JPS62194628A JP S62194628 A JPS62194628 A JP S62194628A JP 3778486 A JP3778486 A JP 3778486A JP 3778486 A JP3778486 A JP 3778486A JP S62194628 A JPS62194628 A JP S62194628A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
photo resist
resist pattern
dummy
film
4b
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3778486A
Inventor
Shinji Kimura
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To reduce the influence of loading effect on the occasion of a dry- etching, by forming a dummy photo resist pattern on a part where a spacing between photo resist patterns is relatively wide, and performing the dry-etching of a film to be etched applying the photo resist pattern and the dummy photo resist pattern as a mask.
CONSTITUTION: A dummy photo resist pattern 4b is formed on a part where a spacing between photo resist patterns on a film to be etched is relatively wide. In the case where a dry-etching of the exposed part of an aluminum film 30 is selectively performed applying a photo resist pattern 4a and the dummy photo resist pattern 4b as a mask, the density of a pattern containing the photo resist pattern 4a and the dummy photo resist pattern 4b is made uniform, and so the plasma condition becomes uniform for the photo resist pattern 4a and the dummy photo resist pattern 4b. Thus the influence of loading effect is reduced, so that an aluminum wiring patterns 30a, 30b which have dimensional accuracy and contains no undercut can be formed on a base insulating film 2.
COPYRIGHT: (C)1987,JPO&Japio
JP3778486A 1986-02-20 1986-02-20 Manufacture of semiconductor device Pending JPS62194628A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3778486A JPS62194628A (en) 1986-02-20 1986-02-20 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3778486A JPS62194628A (en) 1986-02-20 1986-02-20 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS62194628A true true JPS62194628A (en) 1987-08-27

Family

ID=12507115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3778486A Pending JPS62194628A (en) 1986-02-20 1986-02-20 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS62194628A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193148A (en) * 1987-10-05 1989-04-12 Nec Corp Manufacture of semiconductor device
US5289422A (en) * 1990-11-01 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having dummy wiring pattern therein and manufacturing method thereof
EP0746025A2 (en) * 1995-05-31 1996-12-04 Siemens Aktiengesellschaft Improved fuse link structures through the addition of dummy structures
US8482498B2 (en) 2008-11-07 2013-07-09 Au Optronics Corp. Liquid crystal display panel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193148A (en) * 1987-10-05 1989-04-12 Nec Corp Manufacture of semiconductor device
US5289422A (en) * 1990-11-01 1994-02-22 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having dummy wiring pattern therein and manufacturing method thereof
EP0746025A2 (en) * 1995-05-31 1996-12-04 Siemens Aktiengesellschaft Improved fuse link structures through the addition of dummy structures
EP0746025A3 (en) * 1995-05-31 1998-06-03 International Business Machines Corporation Improved fuse link structures through the addition of dummy structures
US8482498B2 (en) 2008-11-07 2013-07-09 Au Optronics Corp. Liquid crystal display panel

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