JPS62193316U - - Google Patents
Info
- Publication number
- JPS62193316U JPS62193316U JP8169786U JP8169786U JPS62193316U JP S62193316 U JPS62193316 U JP S62193316U JP 8169786 U JP8169786 U JP 8169786U JP 8169786 U JP8169786 U JP 8169786U JP S62193316 U JPS62193316 U JP S62193316U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric plate
- lumped constant
- high frequency
- conductor pattern
- terminal pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Description
第1図は、本考案の一実施例としての集中定数
型分配器の分解部品配列斜視図、第2図は、第1
図の集中定数型分配器の誘電体板の裏面を示す斜
視図、第3図は、第1図の集中定数型分配器の組
み立て途中の状態を示す斜視図、第4図は、第1
図の集中定数型分配器の組み立て完成時を示す斜
視図、第5図は、第3図のA―A線断面図、第6
図は、第3図のB―B線断面図、第7図は、従来
の集中定数型分配器の一例を示す斜視図、第8図
は、第7図の集中定数型分配器の回路結線図であ
る。
1……入力コイル、1′……出力分配用コイル
、20……チツプコンデンサ、30……チツプ抵
抗、60……アース基体、61……フランジ部、
70……誘電体板、70A〜70H……スルーホ
ール、71A〜71I……導体パターン、72…
…導電性層、80……カバーケース、81……フ
ランジ部、110A〜110H……端子ピン、1
20……ガラス。
FIG. 1 is a perspective view of an exploded parts arrangement of a lumped constant type distributor as an embodiment of the present invention, and FIG.
FIG. 3 is a perspective view showing the back side of the dielectric plate of the lumped constant type distributor shown in FIG.
Figure 5 is a perspective view showing the completed assembly of the lumped constant type distributor shown in Figure 5;
The figure is a sectional view taken along the line B-B in Fig. 3, Fig. 7 is a perspective view showing an example of a conventional lumped constant type distributor, and Fig. 8 is a circuit connection of the lumped constant type distributor shown in Fig. 7. It is a diagram. 1... Input coil, 1'... Output distribution coil, 20... Chip capacitor, 30... Chip resistor, 60... Earth base, 61... Flange section,
70...Dielectric plate, 70A to 70H...Through hole, 71A to 71I...Conductor pattern, 72...
...Conductive layer, 80...Cover case, 81...Flange portion, 110A to 110H...Terminal pin, 1
20...Glass.
Claims (1)
させて有するアース基体と、該アース基体の上面
に配設される誘電体板と、該誘電体板の上に配設
されるチツプ回路素子とを備えており、前記誘電
体板は、前記端子ピンの各々を通すための複数の
スルーホールを有しており、前記誘電体板の裏面
の前記スルーホールのうちの所定のスルーホール
の周辺部分を除いて実質的に全面に亘つて導電性
層が施されており、前記誘電体板の表面には、所
望の導体パターンが施されており、該導電体パタ
ーンのうち所定の導体パターンは、前記対応する
スルーホールを通して前記導電性層に接続されて
おり、前記誘電体板は、前記アース基体の上面に
前記導電性層を接するようにして接着され、前記
チツプ回路素子は、その各電極を前記対応する導
体パターンに接着するようにして前記誘電体板の
上面に固定されており、前記端子ピンのうちの所
定の端子ピンは、前記対応する導体パターンに接
着されていることを特徴とする集中定数型高周波
回路部品。 (2) 前記アース基体には、前記誘電体板および
前記チツプ回路素子を覆うためのカバーケースが
結合される実用新案登録請求の範囲第(1)項記載
の集中定数型高周波回路部品。 (3) 前記アース基体および前記カバーケースは
、金属製であり、前記アース基体には、その下部
の周辺部にフランジ部が形成されており、前記カ
バーケースには、その下部の周辺部にフランジ部
が形成されており、前記アース基体と前記カバー
ケースとは、前記フランジ部同志を重ね合わせて
抵抗溶接することによつて封止されている実用新
案登録請求の範囲第(2)項記載の集中定数型高周
波回路部品。 (4) 前記封止は、前記誘電体板上のチツプ回路
素子等のモールド成形後に不活性ガス中にて行わ
れる実用新案登録請求の範囲第(3)項記載の集中
定数型高周波回路部品。 (5) 前記トツプ回路素子は、集中定数型分配器
を構成するためのものである実用新案登録請求の
範囲第(1)項から第(4)項のうちのいずれかに記載
の集中定数型高周波回路部品。[Claims for Utility Model Registration] (1) A grounding base having a plurality of hermetic seal terminal pins passed through it, a dielectric plate disposed on the top surface of the grounding base, and a The dielectric plate has a plurality of through holes for passing each of the terminal pins, and one of the through holes on the back surface of the dielectric plate has a plurality of through holes for passing each of the terminal pins. A conductive layer is applied over substantially the entire surface of the dielectric plate except for the peripheral portion of a predetermined through hole, and a desired conductor pattern is applied to the surface of the dielectric plate, and the conductor pattern is formed on the surface of the dielectric plate. A predetermined conductor pattern among them is connected to the conductive layer through the corresponding through hole, and the dielectric plate is bonded to the upper surface of the ground base with the conductive layer in contact with the chip. The circuit element is fixed to the upper surface of the dielectric plate by bonding each electrode to the corresponding conductor pattern, and predetermined terminal pins of the terminal pins are bonded to the corresponding conductor pattern. A lumped constant high frequency circuit component characterized by: (2) The lumped constant high frequency circuit component according to claim 1, wherein a cover case for covering the dielectric plate and the chip circuit element is coupled to the ground base. (3) The grounding base and the cover case are made of metal, and the grounding base has a flange formed around its lower part, and the cover case has a flange formed around its lower part. The earth base body and the cover case are sealed by overlapping the flange parts and resistance welding, according to claim (2) of the utility model registration claim. Lumped constant high frequency circuit components. (4) The lumped constant type high frequency circuit component according to claim (3), wherein the sealing is performed in an inert gas after molding the chip circuit element on the dielectric plate. (5) The top circuit element is a lumped constant type distributor according to any one of claims (1) to (4) of the utility model registration claim, which is for configuring a lumped constant type distributor. High frequency circuit components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986081697U JPH051142Y2 (en) | 1986-05-29 | 1986-05-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986081697U JPH051142Y2 (en) | 1986-05-29 | 1986-05-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62193316U true JPS62193316U (en) | 1987-12-09 |
JPH051142Y2 JPH051142Y2 (en) | 1993-01-13 |
Family
ID=30933670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986081697U Expired - Lifetime JPH051142Y2 (en) | 1986-05-29 | 1986-05-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH051142Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0481360U (en) * | 1990-11-26 | 1992-07-15 | ||
JPH0536925U (en) * | 1991-08-26 | 1993-05-18 | ヒロセ電機株式会社 | Lumped constant type high frequency components |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56108618U (en) * | 1980-01-19 | 1981-08-22 | ||
JPS6022894U (en) * | 1983-07-23 | 1985-02-16 | 株式会社村田製作所 | Shield structure of circuit board equipment |
JPS6178418U (en) * | 1984-10-26 | 1986-05-26 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6022894B2 (en) * | 1976-08-10 | 1985-06-04 | カワサキ機工株式会社 | Stand-alone tea rolling machine and its control method |
-
1986
- 1986-05-29 JP JP1986081697U patent/JPH051142Y2/ja not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56108618U (en) * | 1980-01-19 | 1981-08-22 | ||
JPS6022894U (en) * | 1983-07-23 | 1985-02-16 | 株式会社村田製作所 | Shield structure of circuit board equipment |
JPS6178418U (en) * | 1984-10-26 | 1986-05-26 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0481360U (en) * | 1990-11-26 | 1992-07-15 | ||
JPH0536925U (en) * | 1991-08-26 | 1993-05-18 | ヒロセ電機株式会社 | Lumped constant type high frequency components |
Also Published As
Publication number | Publication date |
---|---|
JPH051142Y2 (en) | 1993-01-13 |
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