JPS62193122A - パタ−ン位置合わせ方法 - Google Patents
パタ−ン位置合わせ方法Info
- Publication number
- JPS62193122A JPS62193122A JP61034225A JP3422586A JPS62193122A JP S62193122 A JPS62193122 A JP S62193122A JP 61034225 A JP61034225 A JP 61034225A JP 3422586 A JP3422586 A JP 3422586A JP S62193122 A JPS62193122 A JP S62193122A
- Authority
- JP
- Japan
- Prior art keywords
- manual alignment
- pattern
- alignment marks
- pair
- alignment mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 30
- 230000008569 process Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61034225A JPS62193122A (ja) | 1986-02-19 | 1986-02-19 | パタ−ン位置合わせ方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61034225A JPS62193122A (ja) | 1986-02-19 | 1986-02-19 | パタ−ン位置合わせ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62193122A true JPS62193122A (ja) | 1987-08-25 |
JPH0222531B2 JPH0222531B2 (zh) | 1990-05-18 |
Family
ID=12408202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61034225A Granted JPS62193122A (ja) | 1986-02-19 | 1986-02-19 | パタ−ン位置合わせ方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62193122A (zh) |
-
1986
- 1986-02-19 JP JP61034225A patent/JPS62193122A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0222531B2 (zh) | 1990-05-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6306558B1 (en) | Method of forming small contact holes using alternative phase shift masks and negative photoresist | |
JP2003257828A (ja) | 半導体装置の製造方法 | |
US5237393A (en) | Reticle for a reduced projection exposure apparatus | |
JPH11191530A (ja) | アライメントマーク装置 | |
US4118230A (en) | Process for adjusting exposure masks relative to a substrate wafer | |
JPS62193122A (ja) | パタ−ン位置合わせ方法 | |
JP2003512740A (ja) | レチクル、ウェーハ、及び、ステッパにおけるアラインメント誤差の決定方法 | |
JPS62193121A (ja) | パタ−ン位置合わせ方法 | |
JPS62193124A (ja) | パタ−ン位置合わせ方法 | |
JPS62193123A (ja) | パタ−ン位置合わせ方法 | |
JPH01191416A (ja) | パターン形成方法 | |
JPS6358825A (ja) | パタ−ン形成方法 | |
CN105388699A (zh) | 评价用掩模、评价方法、曝光装置以及物品的制造方法 | |
US20070072128A1 (en) | Method of manufacturing an integrated circuit to obtain uniform exposure in a photolithographic process | |
JPH06342745A (ja) | アライメント精度測定用マーク | |
KR100644049B1 (ko) | 노광 장치용 레티클 및 이를 이용한 비점수차 보정 방법 | |
JP2647835B2 (ja) | ウェハーの露光方法 | |
JP2006203032A (ja) | 素子の製造方法 | |
JP3507996B2 (ja) | 一対のフォトマスクおよびそれを用いた透明基板の表裏面加工方法 | |
JP2545431B2 (ja) | リソグラフィ―用レチクルおよびレチクルパタ―ン転写方法 | |
JPS61288423A (ja) | 露光方法及び露光装置 | |
JPS5975627A (ja) | 半導体装置の製造方法 | |
JP2001092103A5 (zh) | ||
JPH03246921A (ja) | 半導体装置の製造方法 | |
JPH03126218A (ja) | 拡大露光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |