JPS6219075B2 - - Google Patents
Info
- Publication number
- JPS6219075B2 JPS6219075B2 JP56184165A JP18416581A JPS6219075B2 JP S6219075 B2 JPS6219075 B2 JP S6219075B2 JP 56184165 A JP56184165 A JP 56184165A JP 18416581 A JP18416581 A JP 18416581A JP S6219075 B2 JPS6219075 B2 JP S6219075B2
- Authority
- JP
- Japan
- Prior art keywords
- wick
- case
- communication hole
- hollow chamber
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18416581A JPS5885555A (ja) | 1981-11-17 | 1981-11-17 | セラミツクヒ−トシンク |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18416581A JPS5885555A (ja) | 1981-11-17 | 1981-11-17 | セラミツクヒ−トシンク |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5885555A JPS5885555A (ja) | 1983-05-21 |
| JPS6219075B2 true JPS6219075B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-04-25 |
Family
ID=16148495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18416581A Granted JPS5885555A (ja) | 1981-11-17 | 1981-11-17 | セラミツクヒ−トシンク |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5885555A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3891621B2 (ja) * | 1996-12-19 | 2007-03-14 | 株式会社トクヤマ | 窒化アルミニウム部材 |
| JP7635360B2 (ja) * | 2021-02-26 | 2025-02-25 | 京セラ株式会社 | 熱デバイス |
| EP4534942A1 (en) * | 2022-05-31 | 2025-04-09 | Kyocera Corporation | Thermal device |
| WO2024019108A1 (ja) * | 2022-07-22 | 2024-01-25 | 京セラ株式会社 | 放熱基板及びベイパーチャンバー |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5810370Y2 (ja) * | 1977-08-26 | 1983-02-25 | 日本特殊陶業株式会社 | 電子回路装置塔載用セラミック基板 |
-
1981
- 1981-11-17 JP JP18416581A patent/JPS5885555A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5885555A (ja) | 1983-05-21 |