JPS6219071B2 - - Google Patents
Info
- Publication number
 - JPS6219071B2 JPS6219071B2 JP57112641A JP11264182A JPS6219071B2 JP S6219071 B2 JPS6219071 B2 JP S6219071B2 JP 57112641 A JP57112641 A JP 57112641A JP 11264182 A JP11264182 A JP 11264182A JP S6219071 B2 JPS6219071 B2 JP S6219071B2
 - Authority
 - JP
 - Japan
 - Prior art keywords
 - frame
 - contact
 - contacts
 - forming
 - cover
 - Prior art date
 - Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
 - Expired
 
Links
- 230000000712 assembly Effects 0.000 claims description 10
 - 238000000429 assembly Methods 0.000 claims description 10
 - 238000000034 method Methods 0.000 claims description 9
 - 238000000465 moulding Methods 0.000 claims description 7
 - 210000005069 ears Anatomy 0.000 claims description 4
 - 238000007493 shaping process Methods 0.000 claims 1
 - 239000004020 conductor Substances 0.000 description 15
 - 239000000758 substrate Substances 0.000 description 14
 - 239000000463 material Substances 0.000 description 4
 - 230000001681 protective effect Effects 0.000 description 3
 - SYJPAKDNFZLSMV-HYXAFXHYSA-N (Z)-2-methylpropanal oxime Chemical compound CC(C)\C=N/O SYJPAKDNFZLSMV-HYXAFXHYSA-N 0.000 description 2
 - 238000010276 construction Methods 0.000 description 2
 - 238000003780 insertion Methods 0.000 description 2
 - 230000037431 insertion Effects 0.000 description 2
 - 230000014759 maintenance of location Effects 0.000 description 2
 - 239000004033 plastic Substances 0.000 description 2
 - 229910000881 Cu alloy Inorganic materials 0.000 description 1
 - 230000006978 adaptation Effects 0.000 description 1
 - XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
 - 229910052782 aluminium Inorganic materials 0.000 description 1
 - 238000005452 bending Methods 0.000 description 1
 - 238000001816 cooling Methods 0.000 description 1
 - 230000000694 effects Effects 0.000 description 1
 - 238000005530 etching Methods 0.000 description 1
 - 238000012986 modification Methods 0.000 description 1
 - 230000004048 modification Effects 0.000 description 1
 - 229920001169 thermoplastic Polymers 0.000 description 1
 - 239000004416 thermosoftening plastic Substances 0.000 description 1
 
Classifications
- 
        
- H—ELECTRICITY
 - H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
 - H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
 - H05K7/00—Constructional details common to different types of electric apparatus
 - H05K7/02—Arrangements of circuit components or wiring on supporting structure
 - H05K7/10—Plug-in assemblages of components, e.g. IC sockets
 - H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
 - H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
 - H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
 
 - 
        
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
 - Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
 - Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
 - Y10T29/00—Metal working
 - Y10T29/49—Method of mechanical manufacture
 - Y10T29/49002—Electrical device making
 - Y10T29/49117—Conductor or circuit manufacturing
 - Y10T29/49204—Contact or terminal manufacturing
 - Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
 - Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals
 
 
Landscapes
- Engineering & Computer Science (AREA)
 - Microelectronics & Electronic Packaging (AREA)
 - Connecting Device With Holders (AREA)
 
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title | 
|---|---|---|---|
| US280324 | 1981-07-06 | ||
| US06/280,324 US4395084A (en) | 1981-07-06 | 1981-07-06 | Electrical socket for leadless integrated circuit packages | 
Publications (2)
| Publication Number | Publication Date | 
|---|---|
| JPS5810842A JPS5810842A (ja) | 1983-01-21 | 
| JPS6219071B2 true JPS6219071B2 (en:Method) | 1987-04-25 | 
Family
ID=23072599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date | 
|---|---|---|---|
| JP57112641A Granted JPS5810842A (ja) | 1981-07-06 | 1982-07-01 | リ−ドレス集積回路パツケ−ジ用ソケツトとその組立方法 | 
Country Status (2)
| Country | Link | 
|---|---|
| US (1) | US4395084A (en:Method) | 
| JP (1) | JPS5810842A (en:Method) | 
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| JPS5882786U (ja) * | 1981-11-30 | 1983-06-04 | ソニー株式会社 | マルチコネクタ | 
| US4445736A (en) * | 1982-03-31 | 1984-05-01 | Amp Incorporated | Method and apparatus for producing a premolded packaging | 
| US4461524A (en) * | 1982-06-07 | 1984-07-24 | Teledyne Industries, Inc. | Frame type electrical connector for leadless integrated circuit packages | 
| US4555157A (en) * | 1982-08-24 | 1985-11-26 | Teledyne Industries, Inc. | Electrical connector for visual display and method of making same | 
| JPS5937675A (ja) * | 1982-08-24 | 1984-03-01 | テレダイン・インダストリ−ス・インコ−ポレ−テツド | 電気コネクタ | 
| US4511201A (en) * | 1982-11-05 | 1985-04-16 | At&T Bell Laboratories | Module mounting assembly | 
| EP0124593A4 (en) * | 1982-11-05 | 1987-01-29 | Western Electric Co | MODULE MOUNTING ASSEMBLY. | 
| US4504887A (en) * | 1983-04-01 | 1985-03-12 | Amp Incorporated | Leadless integrated circuit package housing having means for contact replacement | 
| DE3480984D1 (de) * | 1983-05-31 | 1990-02-08 | Trw Inc | Verbindungseinrichtung mit knoepfen fuer einen chip und eine schaltungsplatte. | 
| JPS60101888A (ja) * | 1983-10-31 | 1985-06-05 | アンプ インコーポレーテッド | 電気コネクタ | 
| US4628597A (en) * | 1983-11-25 | 1986-12-16 | Meehan Robert F | Method of making an electrical connector | 
| US4541676A (en) * | 1984-03-19 | 1985-09-17 | Itt Corporation | Chip carrier test adapter | 
| US4639058A (en) * | 1984-08-22 | 1987-01-27 | Minnesota Mining & Manufacturing Co. | Low profile test clip and handle therefor | 
| FR2572856B1 (fr) * | 1984-11-06 | 1988-01-08 | Socapex | Element de connexion miniature a faible pas et procede de fabrication d'un tel element de connexion | 
| FR2580136B1 (en:Method) * | 1985-04-05 | 1988-10-14 | Radiotechnique Compelec | |
| FR2582898B1 (fr) * | 1985-06-04 | 1989-07-28 | Radiotechnique Compelec | Carte pour realiser un systeme de micro-informatique. | 
| US4769908A (en) * | 1985-11-04 | 1988-09-13 | Amp Incorporated | Method of manufacturing a plurality of contact terminals | 
| US4639063A (en) * | 1985-12-20 | 1987-01-27 | Amp Incorporated | Electrical connector for flexible film circuits | 
| US4699593A (en) * | 1986-01-14 | 1987-10-13 | Amp Incorporated | Connector having contact modules for a substrate such as an IC chip carrier | 
| US4872843A (en) * | 1986-03-25 | 1989-10-10 | Dowty Electronic Components Limited | Interconnection systems for electrical circuits | 
| US4783719A (en) * | 1987-01-20 | 1988-11-08 | Hughes Aircraft Company | Test connector for electrical devices | 
| US4891019A (en) * | 1989-03-03 | 1990-01-02 | Amp Incorporated | Electrical connector for interconnecting a printed circuit board to a ribbon cable | 
| US5046953A (en) * | 1990-05-25 | 1991-09-10 | Hewlett-Packard Company | Method and apparatus for mounting an integrated circuit on a printed circuit board | 
| US5062802A (en) * | 1990-11-01 | 1991-11-05 | Amp Incorporated | Contact module for a low height multi-chip carrier socket | 
| US5226823A (en) * | 1992-01-09 | 1993-07-13 | Teledyne Kinectics | Indexing mechanism for precision alignment of electrical contacts | 
| US5322446A (en) * | 1993-04-09 | 1994-06-21 | Minnesota Mining And Manufacturing Company | Top load socket and carrier | 
| US5484295A (en) * | 1994-04-01 | 1996-01-16 | Teledyne Electronic Technologies | Low profile compression electrical connector | 
| US5567166A (en) * | 1994-04-08 | 1996-10-22 | Berg Technology, Inc. | Low profile connector and processes for making and using the same | 
| US5525064A (en) * | 1995-01-19 | 1996-06-11 | Teledyne Electronic Technologies | Connector with molded stud(s) and insulated nuts | 
| US5498970A (en) * | 1995-02-06 | 1996-03-12 | Minnesota Mining And Manufacturing | Top load socket for ball grid array devices | 
| FR2826230B1 (fr) * | 2001-06-19 | 2003-11-07 | Bull Sa | Dispositif et procede de fixation de circuits integres sur une carte a circuit imprime | 
| US7258550B2 (en) * | 2003-04-10 | 2007-08-21 | Research In Motion Limited | Electrical connector assembly | 
| TW200509480A (en) * | 2003-08-27 | 2005-03-01 | Mitsumi Electric Co Ltd | Connector for camera module | 
| JP3959529B2 (ja) * | 2004-03-25 | 2007-08-15 | Smk株式会社 | 電子部品取付用ソケット | 
| US6971887B1 (en) * | 2004-06-24 | 2005-12-06 | Intel Corporation | Multi-portion socket and related apparatuses | 
| WO2006003722A1 (ja) * | 2004-07-05 | 2006-01-12 | Kabushiki Kaisha Nihon Micronics | 接触子ブロック及び電気的接続装置 | 
| US7625219B2 (en) * | 2005-04-21 | 2009-12-01 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus | 
| US7484964B2 (en) * | 2007-06-07 | 2009-02-03 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector assembly with floatably arranged wafer | 
| JP4358269B2 (ja) * | 2007-12-21 | 2009-11-04 | 株式会社東芝 | 電子部品モジュール | 
| JP4914530B1 (ja) * | 2011-09-06 | 2012-04-11 | パナソニック株式会社 | 端末装置 | 
| US8905791B2 (en) * | 2013-02-15 | 2014-12-09 | Continental Automotive Systems, Inc. | Single layer leadframe with integrated three-row connector | 
| US9276386B2 (en) * | 2013-02-15 | 2016-03-01 | Continental Automotive Systems, Inc. | Single layer leadframe with integrated three-row connector | 
| US10794933B1 (en) | 2013-03-15 | 2020-10-06 | Johnstech International Corporation | Integrated circuit contact test apparatus with and method of construction | 
| TWI543451B (zh) * | 2013-07-30 | 2016-07-21 | 鴻海精密工業股份有限公司 | 電連接器及其組合 | 
| TWI557857B (zh) * | 2015-01-22 | 2016-11-11 | 台達電子工業股份有限公司 | 功率模組之封裝結構 | 
| CN105870073B (zh) * | 2015-01-22 | 2019-02-15 | 台达电子工业股份有限公司 | 功率模块的封装结构 | 
| DE102016217007A1 (de) * | 2016-09-07 | 2018-03-08 | Siemens Aktiengesellschaft | Leistungsmodul | 
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title | 
|---|---|---|---|---|
| US3026494A (en) * | 1958-11-03 | 1962-03-20 | Sperry Rand Corp | Electrical connector block for interconnecting circuits | 
| GB1004263A (en) * | 1961-07-24 | 1965-09-15 | Cossor Ltd A C | Improvements in and relating to electrical tag strips | 
| US3771109A (en) * | 1972-05-01 | 1973-11-06 | Bunker Ramo | Electrical connector for integrated circuit device | 
| US3877064A (en) * | 1974-02-22 | 1975-04-08 | Amp Inc | Device for connecting leadless integrated circuit packages to a printed-circuit board | 
| US3904262A (en) * | 1974-09-27 | 1975-09-09 | John M Cutchaw | Connector for leadless integrated circuit packages | 
| US3982159A (en) * | 1974-11-11 | 1976-09-21 | E. I. Du Pont De Nemours And Company | Leadless package retaining frame | 
| US3951491A (en) * | 1974-12-19 | 1976-04-20 | Molex Incorporated | Electrical connector | 
| US4008938A (en) * | 1975-08-11 | 1977-02-22 | International Telephone And Telegraph Corporation | Electrical connector | 
| US4063791A (en) * | 1976-12-27 | 1977-12-20 | Cutchaw John M | Connector for leadless integrated circuit packages | 
| GB2008333B (en) * | 1977-11-14 | 1982-05-26 | Amp Inc | Electrical connector | 
| US4340266A (en) * | 1978-05-22 | 1982-07-20 | Minnesota Mining And Manufacturing Company | Connector system | 
- 
        1981
        
- 1981-07-06 US US06/280,324 patent/US4395084A/en not_active Expired - Lifetime
 
 - 
        1982
        
- 1982-07-01 JP JP57112641A patent/JPS5810842A/ja active Granted
 
 
Also Published As
| Publication number | Publication date | 
|---|---|
| JPS5810842A (ja) | 1983-01-21 | 
| US4395084A (en) | 1983-07-26 | 
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