JPS6219060B2 - - Google Patents

Info

Publication number
JPS6219060B2
JPS6219060B2 JP57167659A JP16765982A JPS6219060B2 JP S6219060 B2 JPS6219060 B2 JP S6219060B2 JP 57167659 A JP57167659 A JP 57167659A JP 16765982 A JP16765982 A JP 16765982A JP S6219060 B2 JPS6219060 B2 JP S6219060B2
Authority
JP
Japan
Prior art keywords
substrate
wafer
dielectric film
present
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57167659A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5957446A (ja
Inventor
Fumio Muramatsu
Ryoji Tsunoda
Genichi Kanazawa
Makoto Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Kokusai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Co Ltd filed Critical Kokusai Electric Co Ltd
Priority to JP57167659A priority Critical patent/JPS5957446A/ja
Publication of JPS5957446A publication Critical patent/JPS5957446A/ja
Publication of JPS6219060B2 publication Critical patent/JPS6219060B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Jigs For Machine Tools (AREA)
JP57167659A 1982-09-28 1982-09-28 静電吸着式基板保持装置 Granted JPS5957446A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57167659A JPS5957446A (ja) 1982-09-28 1982-09-28 静電吸着式基板保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57167659A JPS5957446A (ja) 1982-09-28 1982-09-28 静電吸着式基板保持装置

Publications (2)

Publication Number Publication Date
JPS5957446A JPS5957446A (ja) 1984-04-03
JPS6219060B2 true JPS6219060B2 (cg-RX-API-DMAC10.html) 1987-04-25

Family

ID=15853850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57167659A Granted JPS5957446A (ja) 1982-09-28 1982-09-28 静電吸着式基板保持装置

Country Status (1)

Country Link
JP (1) JPS5957446A (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6156842A (ja) * 1984-08-27 1986-03-22 Kokusai Electric Co Ltd 静電吸着板
JP2513995B2 (ja) * 1985-12-29 1996-07-10 京セラ株式会社 静電チヤツク
JPH0727961B2 (ja) * 1986-06-05 1995-03-29 東陶機器株式会社 静電チャック板の製造方法
JPS62286248A (ja) * 1986-06-05 1987-12-12 Toto Ltd 静電チヤツク板及びその製造方法
JPH0697677B2 (ja) * 1987-04-21 1994-11-30 東陶機器株式会社 静電チャック基盤の製造方法
JP2600558Y2 (ja) * 1991-10-02 1999-10-12 住友金属工業株式会社 静電チャック
US5384681A (en) * 1993-03-01 1995-01-24 Toto Ltd. Electrostatic chuck
JP2002057207A (ja) * 2000-01-20 2002-02-22 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびその製造方法ならびに半導体製造装置
CN106910703B (zh) * 2017-03-10 2020-12-01 京东方科技集团股份有限公司 载台及其制备方法、加工装置及其操作方法
JPWO2024232306A1 (cg-RX-API-DMAC10.html) * 2023-05-11 2024-11-14

Also Published As

Publication number Publication date
JPS5957446A (ja) 1984-04-03

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